HCC40100B STMICROELECTRONICS | Alldatasheet

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32-STAGE STATIC LEFT/RIGHT SHIFT REGISTER

DESCRIPTION

.FULLY STATIC OPERATION .SHIFT LEFT/SHIFT RIGHT CAPABILITY .MULTIPLE PACKAGE CASCADING .RECIRCULATE CAPABILITY .LIFO OR FIFO CAPABILITY .STANDARDIZED SYMMETRICAL OUTPUT CHARACTERISTICS .QUIESCENT CURRENT SPECIFIED AT 20V FOR HCC DEVICE .5V, 10V, AND 15V PARAMETRIC RATINGS .INPUT CURRENT OF 100nA AT 18V AND 25°C FOR HCC DEVICE .100% TESTED FOR QUIESCENT CURRENT .MEETS ALL REQUIREMENTS OF JEDECTEN- TATIVE STANDARD N o. 13A, ”STANDARD SPECIFICATIONS FOR DESCRIPTION OF ”B” SERIES CMOS DEVICES” June 1989 The HCC40100B (extended temperature range) and HCF40100B (intermediate temperature range) are monolithic integrated circuits, available in 16- lead dual in-line plastic or ceramic package and plastic micro package. TheHCC/HCF40100B is a 32-stage shift register containing 32 D-type master- slave flip-flops. The data present at the SHIFT- RIGHT INPUT is transferred into the first register stage synchronously withthepositive CLOCK edge, provided the LEFT/RIGHT CONTROL is at a low level, the RECIRCULATE CONTROL is at a high level, and the CLOCK INHIBIT is low. If the LEFT/RIGHT CONTROL is at a high level and the RECIRCULATE CONTROL is also high, data at the SHIFT-LEFT INPUT istransferred into the 32nd reg- ister stage synchronously with the positive CLOCK transition, provided the CLOCK INHIBIT is low. The state of the LEFT/RIGHT CONTROL, RECIRCU- LATE CONTROL, and CLOCK INHIBIT should not be changed when the CLOCK ishigh. Datais shifted one stage left or one stage right depending on the state of the LEFT/RIGHT CONTROL, synchron- ously with the positive CLOCK edge. Data clocked into the first or 32nd register states is available at the SHIFT-LEFT or SHIFT-RIGHT OUTPUT respec- tively, on the next negative CLOCK transition (see Data Transfer Table). No shifting occurs on the posi- tive CLOCK edge if the CLOCK INHIBIT line is at a high level. With the RECIRCULATE CONTROL low, EY (Plastic Package) (Plastic Chip Carrier) ORDER CODES : HCC4010 0BF HCF40100 BM1 HCF40100B EY HCF40100 BC1 PIN CONNECTIONS data in the 32nd stage is shifted into the first stage when the LEFT/RIGHT CONTROL is low and from the 1st stage to the 32nd stage when the LEFT/RIGHT CONTROL is high. (Micro Package) F (Ceramic Frit Seal Package)

Symbol Parameter Value Unit V DD * Supply Voltage :HCC Types HCF Types – 0.5 to + 20 – 0.5 to + 18 V V V i Input Voltage – 0.5 to V DD + 0.5 V II DC Input Current (any one input) ± 10 mA P tot Total Power Dissipation (per package) Dissipation per Output Transistor for Top = Full Package-temperature Range 200 100 mW mW T op Operating Temperature :HCC Types HCF Types –5 5t o+1 2 5 –4 0t o+8 5 T stg Storage Temperature – 65 to + 150 °C RECOMMENDED OPERATING CONDITIONS Symbol Parameter Value Unit V DD Supply Voltage :HCC Types HCF Types 3t o+1 8 3t o+1 5 V V V I Input Voltage 0 to V DD V T op Operating Temperature :HCC Types HCF Types – 55 to + 125 –4 0t o+8 5 Stresses above those listed under ”Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sec- tions of this specification is not implied. Exposure to absolute maximum rating conditions for external periods may affect device reliability. HCC/HCF40100B

Control Action Input Bit Origin 1 0 1 Shift Left Shift Left Input 1 0 0 Shift Left Stage 1 0 0 1 Shift Right Shift Right Input 0 0 0 Shift Right Stage 32 X 1 X No Shift – 0 = Low level 1 = High level X= Don’t Care. NC = No change. * For Shift-Right Mode For Shift-left Mode Data Input = SHIFT-RIGHT INPUT (Pin 11) Data input = SHIFT LEFT INPUT (Pin 6) Internal Stage = Stage 1 (Q1) Internal Stage = Stage 32 (Q32) Output = SHIFT-LEFT OUTPUT (Pin 4). Output = SHIFT-RIGHT OUTPUT (Pin 12). TRUTH TABLES DATA TRANSFER Initial State Clock Resulting State Data Input Clock Inhibit Internal Stage Level Change Internal Stage Q Output 00X –/– 0N C X00 –\\– NC 0 10X –/– 1N C X01 –\\– NC 1 X 1 1 X NC NC STATIC ELECTRICAL CHARACTERISTICS (over recommended operating conditions) Test Conditions Value V I V O |IO |V DD T Low * 25 °CT High *Symbol Parameter Unit IL Quiescent Current HCC Types 0/ 5 5 5 0.04 5 150 µA 0/10 10 10 0.04 10 300 0/15 15 20 0.04 20 600 0/20 20 100 0.08 100 3000 HCF Types 0/ 5 5 20 0.04 20 150 0/10 10 40 0.04 40 300 0/15 15 80 0.04 80 600 V OH Output High Voltage 0/ 5 < 1 5 4.95 4.95 4.95 V0/10 < 1 10 9.95 9.95 9.95 0/15 < 1 15 14.95 14.95 14.95 V OL Output Low Voltage 5/0 < 1 5 0.05 0.05 0.05 V10/0 < 1 10 0.05 0.05 0.05 15/0 < 1 15 0.05 0.05 0.05 *T Low =– 5 5 °Cf o rHCC device : – 40°C forHCF device. *T High = + 125 °Cf o rHCC device : + 85°Cf o rHCF device. HCC/HCF40100B

*T Low =– 5 5 °Cf o rHCC device : – 40°C forHCF device. *T High = + 125 °Cf o rHCC device : + 85°Cf o rHCF device. STATIC ELECTRICAL CHARACTERISTICS (continued) Test Conditions Value V I V O |IO |V DD T Low * 25 °CT High *Symbol Parameter Unit V IH Input High Voltage V1/9 < 1 10 7 7 7 1.5/13.5 < 1 15 11 11 11 V IL Input Low Voltage V9/1 < 1 10 3 3 3 13.5/1.5 < 1 15 4 4 4 IOH Output Drive Current HCC Types mA HCF Types IOL Output Sink Current HCC Types 0/ 5 0.4 5 0.64 0.51 1 0.36 mA HCF Types 0/ 5 0.4 5 0.52 0.44 1 0.36 IIH,IIL Input Leakage Current HCC Types 0/18 Any Input µAHCF Types 0/15 15 ± 0.3 ±10–5 ± 0.3 ± 1 C I Input Capacitance Any Input 5 7.5 pF DYNAMIC ELECTRICAL CHARACTERISTICS (Tamb =2 5°C, CL = 50pF, RL = 200kΩ , typical temperature coefficient for all VDD values is 0.3%/°C, all input rise and fall time = 20ns) ValueSymbol Parameter Test Conditions V DD (V) Min. Typ. Max. Unit tPLH , tPH L Propagation Delay Time Clock to Shift Left/Right Output 53 6 0 7 2 0 ns10 165 330 15 115 230 t THL , tTLH Transition Time 5 100 200 ns10 50 100 15 40 80 HCC/HCF40100B

DYNAMIC ELECTRICAL CHARACTERISTICS (continued) ValueSymbol Parameter Test Conditions V DD (V) Min. Typ. Max. Unit tsetup Data Setup Time 5 100 50 ns10 20 10 15 10 5 thold Data Hold Time 5 275 170 ns10 100 75 15 75 50 tW Clock Input Pulse Width Low Level 5 450 225 ns10 230 115 15 190 95 tW Clock Input Pulse Width High Level 5 280 140 ns10 150 75 15 140 70 fCL Maximum Clock Input Frequency 5 1 2 MHz10 2.5 5 15 3 6 HCC/HCF40100B

Output Low (sink) Current Characteristics. Output High (source) Current Characteristics. Typical Propagation Delay Time (clock to shift left right) vs. Load Capacitance. Typical Transition Time vs. Load Capacitance. Typical Dynamic Power Dissipation vs. Clock Fre- quency . HCC/HCF40100B

Input Leakage Current. Input Voltage. TEST CIRCUITS Quiescent Device Current. HCC/HCF40100B

Plastic DIP16 (0.25) MECHANICAL DATA DIM. mm inch a1 0.51 0.020 B 0.77 1.65 0.030 0.065 b 0.5 0.020 b1 0.25 0.010 D 20 0.787 E 8.5 0.335 e 2.54 0.100 e3 17.78 0.700 F 7.1 0.280 I 5.1 0.201 L 3.3 0.130 Z 1.27 0.050 P001C HCC/HCF40100B

Ceramic DIP16/1 MECHANICAL DATA DIM. mm inch A 20 0.787 B 7 0.276 D 3.3 0.130 E 0.38 0.015 e3 17.78 0.700 F 2.29 2.79 0.090 0.110 G 0.4 0.55 0.016 0.022 H 1.17 1.52 0.046 0.060 L 0.22 0.31 0.009 0.012 M 0.51 1.27 0.020 0.050 N 10.3 0.406 P 7.8 8.05 0.307 0.317 Q 5.08 0.200 P053D HCC/HCF40100B

SO16 (Narrow) MECHANICAL DATA DIM. mm inch A 1.75 0.068 a1 0.1 0.2 0.004 0.007 a2 1.65 0.064 b 0.35 0.46 0.013 0.018 b1 0.19 0.25 0.007 0.010 C 0.5 0.019 c1 45 ° (typ.) D 9.8 10 0.385 0.393 E 5.8 6.2 0.228 0.244 e 1.27 0.050 e3 8.89 0.350 F 3.8 4.0 0.149 0.157 G 4.6 5.3 0.181 0.208 L 0.5 1.27 0.019 0.050 M 0.62 0.024 S8 ° (max.) P013H HCC/HCF40100B

DIM. mm inch A 9.78 10.03 0.385 0.395 B 8.89 9.04 0.350 0.356 D 4.2 4.57 0.165 0.180 d1 2.54 0.100 d2 0.56 0.022 E 7.37 8.38 0.290 0.330 e 1.27 0.050 e3 5.08 0.200 F 0.38 0.015 G 0.101 0.004 M 1.27 0.050 M1 1.14 0.045 P027A HCC/HCF40100B

Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specificationsmentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronicsproducts are not authorized foruse ascritical componentsin life support devices or systems without express written approval of SGS-THOMSON Microelectonics.  1994 SGS-THOMSON Microelectronics - All Rights Reserved SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands - Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A HCC/HCF40100B