HC8LP EATON | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 4

Technical content

  • Low profile surface mount inductors designed for higher speed switch mode applications requiring low voltage, and high current
  • Design utilizes high temperature powder iron material with a non-organic binder to eliminate thermal aging
  • Inductance range from 0.17 uH to 47.9 uH
  • Current range from 1.7 to 56 Amps
  • Frequency range 1kHz to 500kHz

Applications

  • Multi-phase regulators
  • Voltage Regulator Modules (VRMs)
  • Distributed power systems DC-DC converters
  • Notebook and laptop regulators
  • Desktop and server VRMs and EVRDs
  • Point-of-Load (POL) modules
  • Battery power systems
  • High current power supplies
  • Data networking and storage systems Environmental data
  • Storage temperature range (component): -40°C to +155°C
  • Operating temperature range: -40°C to +155°C (ambient plus self-temperature rise)
  • Solder reflow temperature: J-STD-020D compliant HC8LP Low profile, high current power inductors Pb

Low profile, high current power inductors www.eaton.com/elx Product specifications Part number6 OCL1 (μH) ±20% lrms 2 (amps) lsat 3 (amps) 15% rolloff lsat 4 (amps) 30% rolloff DCR (mΩ) maximum @ 20°C Volt-μSec5 (V-μs) HC8LP-R15-R 0.170 29.0 31 56 1.40 7.8 HC8LP-R39-R 0.430 20.2 19 34 2.80 4.7 1. Open Circuit Inductance (OCL) T est Parameters: 100kHz, 1.0Vrms, 0.0Adc, @ +25°C 2. Irms: DC current for an approximate DT of 40°C without core loss. Derating is necessary for AC curr ents. PCB layout, trace thickness and width, air -flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed 155 °C under worst case operating conditions verified in the end application. 3. Peak current for approximately 15% rolloff @+20°C 4. Peak current for approximately 30% rolloff @+20°C 5. Applied V olt-Time product (V-μs) across the inductor. This value represents the applied V-μs at operating frequency necessary to generate additional core loss which contributes to the 40°C temperature ri se. De-rating of the Irms is required to prevent excessive temperature rise. The 100% V-us rating is equivalent to a ripple current Ip-p of 20% of Isat (30% rolloff option). 6. Part number definition: HC8LP-XXX-R HC8LP = Product code and size XXX = Inductance value in uH. R = Decimal point. If no R is present then last character equals number of zeros -R suffix indicates RoHS compliant Dimensions–mm 10.4 Max 10.4 Max HC8LP-XXX wwllyy R TOP VIEW 10.9 Max B Max C L Ar ef 3.95 2p lcs ref FRONT VIEW B max mm 1R23 .3 R39 R75 R15 PN 3.5 3.5 3.5 FRONT VIEW Dimesional Table A ref mm 2.1 2.1 2.1 2.1 1R9 thru 470 2.7 3.5 2.70 ±0 .5 5 (2 x) SIDE VIEW 3.5 typ 2plcs 3.0 typ 2plcs 4.0 typ RECOMMENDED PAD LAYOUT SCHEMATIC Part marking: HC8LP= (Product code and size)-xxx=(inductance value in uH, R= decimal point. If no R is present then last character equals number of zeros. wwlyly=date code, R=revision level Tolerances are ±0.2 millimeters unless stated otherwise All soldering surfaces to be coplanar within 0.1 millimeters Do not route traces or vias underneath the inductor

Low profile, high current power inductors www.eaton.com/elx Rolloff Core loss Packaging information–mm Supplied in tape and reel packaging, 800 parts per reel 1.75 11.5 24.0 +/-0.3 User direction of feed

11.2 HC8LP-XXX

A Ko Bo Ao 1.5 dia +0.1/-0.0 1.5 dia min 4.0 2.0 16.0 Ko=4.3 mm Bo=11.2 mm Ao=10.4 mm Irms DERATING WITH CORE LOSS 100 10 30 50 70 90 110 130 1501 70 190 %A pplied Volt-u Seconds %o f Irmss pecifiedf rom zero ripple application (Maximum) 100kHz 200kHz 300kHz 400kHz 500kHz OCL vs Isat 100 01 02 03 04 05 06 07 08 09 0 100 1101 20 1301 40 1501 60 170 1801 90 200 2102 20 %o f Isat %o f OCL

1000 Eaton Boulevard

Cleveland, OH 44122 United States www.eaton.com/elx © 2015 Eaton All Rights Reserved Printed in USA Publication No. 4120 October 2015 Eaton is a registered trademark. All other trademarks are property of their respective owners. HC8LP Low profile, high current power inductors Technical Data 4126 Effective October 2015 Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Temperature t tP ts TC -5°C Time 25°C to Peak Time 25°C Tsmin Tsmax TL TP Preheat A Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Solder reflow profile Reference JDEC J-STD-020D Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak • Temperature min. (Tsmin) 100°C 150°C

  • Temperature max. (Tsmax) 150°C 200°C
  • Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Seconds Average ramp up rate Tsmax to Tp 3°C/ Second Max. 3°C/ Second Max. Liquidous temperature (Tl) Time at liquidous (tL) 183°C 60-150 Seconds 217°C 60-150 Seconds Peak package body temperature (TP)* Table 1 Table 2 Time (tp) within 5 °C of the specified classification temperature (T c) 20 Seconds 30 Seconds** Average ramp-down rate (Tp to Tsmax) 6°C/ Second Max. 6°C/ Second Max. Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Table 1 - Standard SnPb Solder (Tc) Package Thickness Volume mm3 <350 Volume mm3 ≥350 ≥2.5mm 220°C 220°C Table 2 - Lead (Pb) Free Solder (Tc) Package Thickness Volume mm3 <350 Volume mm3 350 - 2000 Volume mm3 >2000 <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C