HC5503 INTERSIL | Alldatasheet
Document overview
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- PDF pages: 17
Technical content
Features
- Wide Operating Battery Range (-21V to -44V)
- Single Additional +5V Supply
- 25mA Short Loop Current Limit
- Ring Relay Driver
- Switch Hook and Ring Trip Detect
- Low On-Hook Power Consumption
- On-Hook Transmission
- ITU-T Longitudinal Balance Performance
- Loop Power Denial Function
- Thermal Protection
- Supports Tip, Ring or Balanced Ringing Schemes
- Low Profile Surface Mount Packaging
- Pin Compatible with Industry Standard HC5504B SLIC
- Pb-free Available
Applications
- Analog Subscriber Line Interfaces in Analog Key Systems and Digital ISDN PABX Systems
- Related Literature - AN571, Using Ring Sync with HC-5502A and HC-5504 SLICs
Ordering Information
TEMP. RANGE (°C) PACKAGE PKG. DWG. # HC5503CB 0 to 75 24 Ld SOIC M24.3 HC5503CBZ (Note) 0 to 75 24 Ld SOIC (Pb-free) M24.3 HC5503CBZ96 (Note) 0 to 75 24 Ld SOIC (Pb-free) M24.3 NOTE: Intersil Pb-free products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which is compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J Std-020B. Data Sheet June 2004 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright Harris Corporation 1997-1998, Copyright Intersil Americas Inc. 1999, 2003, 2004. All Rights Reserved All other trademarks mentioned are the property of their respective owners.
Absolute Maximum Ratings (Note 1) Thermal Information Maximum Continuous Supply Voltages Operating Conditions Operating Temperature Range Thermal Resistance (Typical, Note 2) θJA (°C/W) (SOIC - Lead Tips Only) Die Characteristics CAUTION: Stresses above those listed in “Abs olute Maximum Ratings” may cause permanent dam age to the device. This is a stress o nly rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTES: 1. Absolute maximum ratings are limiting values, applied individually, beyond which the serviceability of the circuit may be impaired. Functional operability under any of these conditions is not necessarily implied. 2. θJA is measured with the component mounted on an evaluation PC board in free air. Electrical Specifications Unless Otherwise Specified, VBAT = -24V, VCC = 5V, AG = BG = DG = 0V, Typical Parameters TA = 25°C. Min-Max Parameters are Over Operating Temperature Range. PARAMETER CONDITIONS MIN TYP MAX UNITS On Hook Power Dissipation ILONG = 0 (Note 3), VCC = 5V - 80 100 mW Off Hook Power Dissipation RL = 600Ω , ILONG = 0 (Note 4), VCC = 5V - 180 200 mW Off Hook IVCC RL = 600Ω , ILONG = 0 (Note 3), TA = 0°C - - 6.0 mA Off Hook IVCC RL = 600Ω , ILONG = 0 (Note 3), TA = 25°C - - 4.0 mA Off Hook IBAT RL = 600Ω , ILONG = 0 (Notes 3, 4) - 19 23 mA Off Hook Loop Current RL = 400Ω , ILONG = 0 (Note 3) - 22.9 - mA Off Hook Loop Current RL = 400Ω , VBAT = -21.6V, ILONG = 0 (Note 3), TA = 25°C 17.5 - - mA Off Hook Loop Current RL = 200Ω , ILONG = 0 (Note 3) - 25 30 mA Fault Currents TIP to Ground (Note 4) - 27.5 - mA RING to Ground - 70 - mA TIP to RING (Note 4) - 30 - mA TIP and RING to Ground - 140 - mA Ring Relay Drive VOL IOL = 62mA - 0.2 0.5 V Ring Relay Driver Off Leakage VRD = 12V, RC = 1 = HIGH, TA = 25°C - - 25 µA Ring Trip Detection Period RL = 600Ω , (Note 5) - 2 3 Ring Cycles Switch Hook Detection Threshold 5 - 10.5 mA Loop Current During Power Denial RL = 200Ω - ±2 - mA HC5503
Dial Pulse Distortion (Note 4) 0 - 0.5 ms Receive Input Impedance (Note 5) - 90 - kΩ Transmit Output Impedance (Note 5) - 10 20 Ω 2-Wire Return Loss Referenced to 600Ω +2.16µF (Note 4) SRL LO - 15.5 - dB ERL - 24 - dB SRL HI - 31 - dB Longitudinal Balance 1VRMS 200Hz - 3400Hz, (Note 4) IEEE Method 0°C ≤ TA ≤ 75°C2-Wire Off Hook 53 58 - dB 2-Wire On Hook 53 58 - dB 4-Wire Off Hook at 1kHz 50 58 - dB Insertion Loss 0dBm Input Level, Referenced 600Ω 2-Wire to 4-Wire at 3.4kHz VTR to VO VO is the Output of the Transhybrid Amplifier - ±0.05 ±0.2 dB 4-Wire to 2-Wire at 300Hz -3.8 -4.0 -4.2 dB Frequency Response 200 - 3400Hz Referenced to Absolute Loss at 1kHz and 0dBm Signal Level (Note 4) - ±0.02 ±0.05 dB Idle Channel Noise, 2-Wire to 4-Wire - 1 5 dBrnC - -89 -85 dBm0p Idle Channel Noise, 4-Wire to 2-Wire (Note 4) - 1 5 dBrnC - -89 -85 dBm0p Absolute Delay (Note 5) 2-Wire to 4-Wire, 4-Wire to 2-Wire - - 2 µs Trans Hybrid Loss Balance Network Set Up for 600Ω Termination at 1kHz 30 40 - dB Overload Level VCC = +5V 2-Wire to 4-Wire (On-hook) 2.5 - - VPEAK 4-Wire to 2-Wire (Off-hook, RL = 600Ω) 3.1 - - VPEAK Level Linearity At 1kHz, (Note 4) Referenced to 0dBm Level 2-Wire to 4-Wire, 4-Wire to 2-Wire +3 to -40dBm - - ±0.05 dB -40 to -50dBm - - ±0.1 dB -50 to -55dBm - - ±0.3 dB Electrical Specifications Unless Otherwise Specified, VBAT = -24V, VCC = 5V, AG = BG = DG = 0V, Typical Parameters TA = 25°C. Min-Max Parameters are Over Operating Temperature Range. (Continued) PARAMETER CONDITIONS MIN TYP MAX UNITS HC5503
Power Supply Rejection Ratio (Note 4), 30 - 60Hz, RL = 200ΩVCC to 2-Wire 35 - - dB VCC to Transmit 35 - - dB VBAT to 2-Wire 20 - - dB VBAT to Transmit 20 - - dB VCC to 2-Wire 200 - 16kHz, RL = 200Ω 35 - - dB VCC to Transmit 35 - - dB VBAT to 2-Wire 35 - - dB VBAT to Transmit 35 - - dB Logic Input Current (RS, RC, PD) 0V ≤ VIN ≤ 2.4V - - ±20 µA Logic Inputs Logic ‘0’ VIL - - 0.8 V Logic ‘1’ VIH 2.0 - 5.5 V SHD Output ILOAD 800µA, VCC = 5V Logic ‘0’ VOL - 0.1 0.4 V Logic ‘1’ VOH ILOAD 40µA, VCC = 5V 2.7 - 5.0 V NOTES: 3. ILONG = Longitudinal Current. 4. These parameters are controlled by design or process parameters and are not directly tested. These parameters are characterized upon initial design release, upon design changes which would affect these characteristics, and at intervals to assure product quality and specification compliance. 5. Guaranteed by design, not tested. Electrical Specifications Unless Otherwise Specified, VBAT = -24V, VCC = 5V, AG = BG = DG = 0V, Typical Parameters TA = 25°C. Min-Max Parameters are Over Operating Temperature Range. (Continued) PARAMETER CONDITIONS MIN TYP MAX UNITS HC5503
600Ω balanced load for the 2-wire to 4-wire transmission. (metallic current) to flow around the loop. The HC5503 is optimized for operation with a -24V battery. negative feedback through resistor R2 (reference Figure 1). 300Ω required to match a 600Ω line. NOTE: Grounded for AC analysis. FIGURE 1. IMPEDANCE MATCHING CIRCUITRY
TX pin that is equal to -4RS∆IL. Where: VTX = -4RS∆IL = -600∆IL. divided by the AC current ∆IL as shown in Equation 2. dividing both sides by ∆IL results in Equation 3. be 25.47kΩ . (Note: nearest standard value is 24.9kΩ). 1 , R3 and RINTERNAL , reference Figure 2. TX times the feedback factor (Equation 5). from the Tip feed + Ring feed amplifiers). (90kΩ) and R1 (10kΩ). R3 should be greater then 90kΩ . The selection of the value of 10kΩ for R1 is also arbitrary. FIGURE 2. FEEDBACK EQUIVALENT CIRCUITHC5503
The 2-wire to 4-wire gain is defined as the output voltage VTX divided by the tip to ring voltage (V TR). Where: VTX = -4RS∆IL = -600∆IL and VTR = (RL)∆IL = 600∆IL. The 2-wire to 4-wire gain is therefor e equal to -1.0, as shown in Equation 9. 4-Wire to 2-Wire Gain The 4-wire to 2-wire gain is defined as the output voltage V TR divided by the input voltage, VIN . To determine the 4-wire to 2-wire gain we need to define VTR in terms of VIN . The voltage at VTR is the loop current times the load impedance ZL . For optimum 2-wire return loss, the input impedance of the SLIC (Z O) must equal the load impedance (ZL) of the line. All Equations going further assume ZL= ZO . The loop current ∆IL is the total voltage across the loop divided by the total resistance of the loop. The total voltage across the loop is the sum of the tip feed voltage (V TF) and the ring feed voltage (VRF) where VTF = -VRF . The total resistance is the sum of the sense resistors RB1 and RB2 and the load ZL (ZL +2RS). The total loop current is defined in Equation 11. From Equation 10: Substituting Equation 12 into Equation 11 and solving for V TR : Using Superposition, the voltage at the receive input RX is given as: Where R′1 is the effective impedance that is formed by the parallel combination of RINTERNAL (90kΩ), R3 (150kΩ), R1 (10kΩ) and is equal to 8.49kΩ . R′2 is the effective impedance that’s formed by the parallel combination of R INTERNAL (90kΩ), R3 (150kΩ ), R2 (24.9kΩ) and is equal to 17.25kΩ . VRX for the recommended values of R1 and R2 is given in Equations 15 and 16. For impedance matching to a load other than 600Ω , recalculate the parallel impedances R′1 , R′2 and substitute into Equation 15. The 4-wire to 2-wire gain is recalculated by using the Equations below. Substituting Equation 16 into Equation 13: From Equation 10: From Equation 1: Substituting Equation 18 into Equation 19: Substituting Equation 20 into Equation 17: Assuming RS = 150Ω and rearranging terms: The 4-wire to 2-wire gain (Given that: R1 = 10kΩ , R2 = 24.9kΩ and R3 = 150kΩ) for a 600Ω load is: A24– VTX VTR 600– ∆IL 600∆IL VTR ∆IL ZL×∆ IL ZO×== (EQ. 10) ∆IL VTF VRF– 2V TF() ∆IL VTR ZO VTR 2V TF() ZO= (EQ. 13) VRX VTF R′1 VTX R′2 VIN+== (EQ. 14) VRX VTF 8.49k Ω VTX 17.25k Ω VIN+== (EQ. 15) VRX VTF 0.25() VTX 0.633() VIN+== (EQ. 16) VTR ZO= (EQ. 17) ∆IL VTR ZO VTX 4RS ∆IL–= (EQ. 19) VTX 4RS VTR ZO VTR 2RS VTR ZO ZO 1 300 VTR 1.266ZO V IN= (EQ. 22) A42– VTR VIN 1.266ZO HC5503
24 PIN
1 TIP An analog input connected to the TIP (more positive) side of the subscriber loop. Functions with the Ring terminal to receive voice signals from the telephone and for loop monitoring purposes. 2 RING An analog input connected to the RING (more negative) side of the subscriber loop. Functions with the Tip terminal to receive voice signals from the telephone and for loop monitoring purposes. 3 RFS Senses ring side of loop for ring trip detection. During ringing, the ring signal is inserted into the line at this node and RF is isolated from RFS via a relay. 4 VCC Positive Voltage Source - Most positive supply. VCC is typically 5V. 5 C1 Capacitor #1 - An external capacitor to be connected between this terminal and analog ground. Required for proper operation of the loop current limiting function, and for filtering V BAT. Typical value is 0.3µF, 16V. 6 DG Digital Ground - To be connected to zero potential and serves as a reference for all digital inputs and outputs on the SLIC microcircuit. 7 RS Ring Synchronization Input - A TTL - compatible clock input. The clock should be arranged such that a positive pulse transition occurs on the zero crossing of the ring voltage source, as it appears at the RFS terminal. For Tip side injected systems, the RS pulse should occur on the negative going zero crossing and for Ring injected systems, on the positive going zero crossing. This ensures that the ring relay activates and deactivates when the instantaneous ring voltage is near zero. If synchronization is not required, the pin should be tied to 5V. 8 RD Relay Driver - A low active open collector logic output. When enabled, the external ring relay is energized. 9 TF Tip Feed - A low impedance analog output connected to the TIP terminal through a 150Ω feed resistor. Functions with the RF terminal to provide loop current, feed voice signals to the telephone set, and sink longitudinal current. 10 RF Ring Feed - A low impedance analog output connected to the RING terminal through a 150Ω feed resistor. Functions with the TF terminal to provide loop current, feed voice signals to the telephone set, and sink longitudinal current. 11 VBAT Negative Voltage Source - Most negative supply. VBAT is typically -24V. Frequently referred to as “battery”. 12 BG Battery Ground - To be connected to zero potential. All loop current and some quiescent current flows into this ground terminal. 13 SHD Switch Hook Detection - A low active LS TTL - compatible logic output. This output is enabled for loop currents exceeding 10.5mA and disabled for loop currents less than 5mA. 15 PD Power Denial - A low active TTL - Compatible logic input. When enabled, the switch hook detect (SHD) is not necessarily valid, and the relay driver (RD) output is disabled. 16 RC Ring Command - A low active TTL - Compatible logic input. When enabled, the relay driver (RD) output goes low on the next high level of the ring sync (RS) input, as long as the SLIC is not in the power denial state (PD = 0) or the subscriber is not already off-hook (SHD = 0). 21 RX Receive Input, Four Wire Side - A high impedance analog input which is internally biased. Capacitive coupling to this input is required. AC signals appearing at this input deferentially drive the Tip feed and Ring feed terminals, which in turn drive tip and ring through 150Ω of feed resistance on each side of the line. 22 C2 Capacitor #2 - An external capacitor to be connected between this terminal and analog ground. This capacitor prevents false ring trip detection from occurring when longitudinal currents are induced onto the subscriber loop from nearby power lines and other noise sources. Recommended value is 1.0µF, 20V. This capacitor should be nonpolarized. 23 AG Analog Ground - To be connected to zero potential and serves as a reference for the transmit output (TX) and receive input (RX) terminals. 24 TX Transmit Output, Four Wire Side - A low impedance analog output which represents the differential voltage across Tip and Ring. Transhybrid balancing must be performed beyond this output to completely implement two to four wire conversion. This output is unbalanced and referenced to analog ground. Since the DC level of this output varies with loop current, capacitive coupling to the next stage is essential. 14 NC Used during production testing. For proper operation of the SLIC, this pin should float. 17, 18, 19, NC No internal connection. NOTE: All grounds (AG, BG, and DG) must be applied before VCC or VBAT . Failure to do so may result in premature failure of the part. If a user wishes to run separate grounds off a line card, the AG must be applied first. HC5503
HC5503 (SOIC) TOP VIEW TIP RING DG RS TF RF BG TX N/C N/C AG N/C VCC RX N/C RC PD N/C SHD RD RFS VBAT DIFF AMP LOOP MONITORING RING CONTROL 2-WIRE LOOP SECONDARY PROTECTION LINE DRIVERS TIP RING VBAT VBAT PDPOWER DENIAL RING 150Ω RF BG TF TIP RD RC RS RING SYNC RING COMMAND RING TRIP SHD TX TRANSMIT OUTPUT RX RECEIVE INPUT SLIC MICROCIRCUIT 1/2 RING RELAY VBAT RING VOLTAGE RFS 1/2 RING RELAY 150Ω SWITCH HOOK DETECTION BATTERY FEED LOOP CURRENT LIMITER FIGURE 7. HC5503
FIGURE 8. FUNCTIONAL SCHEMATIC
High voltage surge conditions are as specified in Table 1. FIGURE 9. LOGIC NETWORK
11 Cycles
- Secondary protection diode bridge recommended is a 2A, 200V type.
- All grounds (AG, BG, and DG) must be applied before VCC or VBAT. Failure to do so may result in premature failure of the part. If a user wishes
to run separate grounds off a line card, the AG must be applied first.
- Application shows Ring Injected Ringing, Balanced or Tip injected configuration may be used.
FIGURE 10. -24V APPLICATION CIRCUIT RB1 = RB2 = 150 (1% absolute value). Z1 = 250V to 350V transient protection. PTC used as ring generator ballast.
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, soft ware and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that da ta sheets are current before placing orders. Information furnishe d by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com HC5503 Small Outline Plastic Packages (SOIC) NOTES: 1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M -1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension “E” does not include interlead flash or protrusions. Inter- lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch) 10. Controlling dimension: MILLIME TER. Converted inch dimensions are not necessarily exact. INDEX AREA E D N 123 -B- 0.25(0.010) C AM BS e -A- L B M -C- A SEATING PLANE 0.10(0.004) h x 45o C H µ 0.25(0.010) BM M α M24.3 (JEDEC MS-013-AD ISSUE C)
24 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
A 0.0926 0.1043 2.35 2.65 - A1 0.0040 0.0118 0.10 0.30 - B 0.013 0.020 0.33 0.51 9 C 0.0091 0.0125 0.23 0.32 - D 0.5985 0.6141 15.20 15.60 3 E 0.2914 0.2992 7.40 7.60 4 e 0.05 BSC 1.27 BSC - H 0.394 0.419 10.00 10.65 - h 0.010 0.029 0.25 0.75 5 L 0.016 0.050 0.40 1.27 6 N2 4 2 4 7 α 0o 8o 0o 8o - Rev. 0 12/93