HC3 EATON | Alldatasheet

Document overview

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Technical content

  • Compact footprint
  • Designed for high density, high current/low voltage applications
  • Foil technology that adds higher reliability factor over the traditional magnet wire used for higher frequency circuit designs
  • Inductance range from 0.50uH to 6.52uH
  • Current range from 30 to 120 Amps
  • Ferrite core material

Applications

  • Distributed power systems DC-DC converters
  • General-purpose low voltage supplies
  • Computer systems
  • Servers
  • Point of Load (POL) converters
  • Industrial Equipment Environmental data
  • Storage temperature range (component): -40°C to +125°C
  • Operating temperature range: -40°C to +125°C (ambient plus self-temperature rise)
  • Solder reflow temperature: J-STD-020D compli- ant. Packaging
  • Supplied in bulk packaging, 24 parts per tray HC3 High current power inductors Pb

High current power inductors www.eaton.com/electronics Product specifications Part number5 OCL1 (μH) ±20% lrms 2 (amps) lsat 3 (amps) DCR (mΩ) maximum @ 20°C Volt-μsec4 (V-μs) ref. HC3-R50-R 0.50 78.00 120 0.42 17.33 HC3-1R0-R 1.05 78.00 78 0.42 17.33 HC3-2R2-R 2.05 55.50 60 0.70 26.01 HC3-3R3-R 3.63 42.45 46 1.20 34.65 HC3-4R7-R 4.98 33.80 38 2.17 43.30 1. OCL (Open Circuit Inductance) Test parameters: 300kHz, .25Vrms, 0.0ADC & Isat. 2. DC current for approximately ∆T of 40°C without core loss De-rating is necessary for AC currents. PCB layout, trace thickness and width, air flow and proximity of other heat generating components will affect temperature rise. It is recommended that the temperature of the part not exceed 125°C under worst case conditions verified in the end application. 3. Peak current for approximately 30% rolloff (@20°C). 4. Applied Volt-Time product (V-μs) across the inductor. This value represents the applied V-μs at 300kHz necessary to generate a core loss equal to 10% of the total losses for a 40°C temperature rise. 5. Part number definition - HC3-xxx-R: HC3 = Product code and size -xxx = Inductance value R = Decimal point (if no “R” is present, last character equals number of zeros ) -R Suffix = RoHS compliant Dimensions–mm Part number Height max HC3-R50-R 18.0 HC3-1R0-R 17.5 HC3-2R2-R 17.5 HC3-3R3-R 17.5 HC3-4R7-R 17.5 HC3-5R6-R 17.5 HC3-6R0-R 17.5 HC3-xxx wwllyy R 14.5 typ 25.3 max 30.0 max 22.0 19.05.50 5.50 3.0 typ 4.0 typ HT max TOP VIEW RECOMMENDED PCB PAD LAYOUT FRONT VIEW SCHEMATIC Part marking: HC3-xxx (-xxx= inductance value, R= decimal point, if no R is present then last character equals number of zeros) wwllyy= date code, R= Revision level

High current power inductors www.eaton.com/electronics Inductance characteristics Core loss Irms DE RA TING WI TH CO RE LOSS for HC 3 10 0 10 30 50 70 90 11 01 30 150 1701 90 %A pplied Volt-u Seconds %of Irms specified from zero ripple application 100kHz 200kHz 300kHz 400kHz 500kHz OCL vs Isat 100 01 02 03 04 05 06 07 08 09 01 00 1101 20 130 %o f Isat %o fO CL

1000 Eaton Boulevard

Cleveland, OH 44122 United States www.eaton.com/electronics © 2017 Eaton All Rights Reserved Printed in USA Publication No. 4122 February 2017 Eaton is a registered trademark. All other trademarks are property of their respective owners. HC3 High current power inductors Technical Data 4122 Effective February 2017 Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Temperature t tP ts TC -5°C Time 25°C to Peak Time 25°C Tsmin Tsmax TL TP Preheat A Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Solder reflow profile Reference JDEC J-STD-020D Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak • Temperature min. (Tsmin) 100°C 150°C

  • Temperature max. (Tsmax) 150°C 200°C
  • Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Seconds Average ramp up rate Tsmax to Tp 3°C/ Second Max. 3°C/ Second Max. Liquidous temperature (Tl) Time at liquidous (tL) 183°C 60-150 Seconds 217°C 60-150 Seconds Peak package body temperature (TP)* Table 1 Table 2 Time (tp) within 5 °C of the specified classification temperature (T c) 20 Seconds 30 Seconds** Average ramp-down rate (Tp to Tsmax) 6°C/ Second Max. 6°C/ Second Max. Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Table 1 - Standard SnPb Solder (Tc) Package Thickness Volume mm3 <350 Volume mm3 ≥350 ≥2.5mm 220°C 220°C Table 2 - Lead (Pb) Free Solder (Tc) Package Thickness Volume mm3 <350 Volume mm3 350 - 2000 Volume mm3 >2000 <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C