HC2LP EATON | Alldatasheet

Document overview

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Technical content

  • Compact footprint
  • Designed for high density, high current/low voltage applications
  • Foil technology that adds higher reliability factor over the traditional magnet wire used for higher frequency circuit designs
  • Frequency Range up to 1MHz
  • Ferrite core material

Applications

  • Distributed power systems DC-DC converters
  • General-purpose low voltage supplies
  • Computer systems
  • Servers
  • Point of Load (POL) converters
  • Industrial Equipment
  • Networking/Telecom power supplies Environmental data
  • Storage temperature range (component): -40°C to +125°C
  • Operating temperature range: -40°C to +125°C (ambient + self-temperature rise).
  • Solder reflow temperature: J-STD-020D compliant. HC2LP Low profile, high current power inductors Pb HALOGEN HFFREE

Low profile, high current power inductors www.eaton.com/elx Product specifications Part number OCL1 (μH) ±20% lrms 2 amps (approx.) lsat 3 amps (approx.) DCR4 (Ω) maximum @ 20°C Volt-μsec5 (V-μs) 1. Open Circuit Inductance Test Parameters: 300kHz, 0.250 Vrms, 0.0 Adc 2. DC current for an approximate temperature change of 40°C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed 125°C under worst case operating conditions verified in the end application. 3. Peak current for approximately 30% rolloff. 4. Values @ 20°C 5. Applied Volt-Time product (V-μs) across the inductor. This value represents the applied V-μs at 300KHz neccessary to generate a core loss equal to 10% of the total losses for 40°C temperature rise. Dimensions–mm Packaging information (mm) Supplied in tape and reel packaging, 130 parts per 13” reel. 1 40.4 +/-0.1 44.0 +/-0.3 11.3 32 19.3 A 1.7 20.2 2.0 1.5Dia +0.10 -0.00 4.0 A User direction of feedSECTION A-A 19.3 19.00 10.00 5.50 5.50 9.5 typ 19.2 max 19.2 max 2.8 typ 2.3 typ 11.18 max FRONT VIEW TOP VIEW SCHEMATIC RECOMMENDED PCB PAD LAYOUT HC2LP-xxx wwllyy R1 2 xxx = Inductance value wwllyy = Date code R = Revision level

Low profile, high current power inductors www.eaton.com/elx Core loss IRMS DERATING WITH CORE LOSS 100080060050040030020010080605040302010 %o f Applied Volt-μ-Seconds %o fL osses from Irms (maximum) 1MHz 0KHz 300 KHz 200KHz 100 KHz OCL vs. Isat 02 04 06 08 0 100 120 140 160 180 200 100 % of ISAT %o fO CL Inductance Characteristics

1000 Eaton Boulevard

Cleveland, OH 44122 United States www.eaton.com/elx © 2015 Eaton All Rights Reserved Printed in USA Publication No. 4114 October 2015 Eaton is a registered trademark. All other trademarks are property of their respective owners. HC2LP Low profile, high current power inductors Technical Data 4114 Effective October 2015 Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Temperature t tP ts TC -5°C Time 25°C to Peak Time 25°C Tsmin Tsmax TL TP Preheat A Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Solder reflow profile Reference JDEC J-STD-020D Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak • Temperature min. (Tsmin) 100°C 150°C

  • Temperature max. (Tsmax) 150°C 200°C
  • Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Seconds Average ramp up rate Tsmax to Tp 3°C/ Second Max. 3°C/ Second Max. Liquidous temperature (Tl) Time at liquidous (tL) 183°C 60-150 Seconds 217°C 60-150 Seconds Peak package body temperature (TP)* Table 1 Table 2 Time (tp) within 5 °C of the specified classification temperature (T c) 20 Seconds 30 Seconds** Average ramp-down rate (Tp to Tsmax) 6°C/ Second Max. 6°C/ Second Max. Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Table 1 - Standard SnPb Solder (Tc) Package Thickness Volume mm3 <350 Volume mm3 ≥350 ≥2.5mm 220°C 220°C Table 2 - Lead (Pb) Free Solder (Tc) Package Thickness Volume mm3 <350 Volume mm3 350 - 2000 Volume mm3 >2000 <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C