SN54HC241_06 TI | Alldatasheet

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/C0083/C0078/C0053/C0052/C0072/C0067/C0050/C0052/C0049/C0044 /C0083/C0078/C0055/C0052/C0072/C0067/C0050/C0052/C0049 /C0079/C0067/C0084/C0065/C0076 /C0066/C0085/C0070/C0070/C0069/C0082/C0083 /C0065/C0078/C0068 /C0076/C0073/C0078/C0069 /C0068/C0082/C0073/C0086/C0069/C0082/C0083 /C0087/C0073/C0084/C0072 /C0051/C0262/C0083/C0084/C0065/C0084/C0069 /C0079/C0085/C0084/C0080/C0085/C0084/C0083 SCLS300C − JANUARY 1996 − REVISED AUGUST 2003 1POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 /C0068Wide Operating Voltage Range of 2 V to 6 V /C0068High-Current Outputs Drive Up To 15 LSTTL Loads /C0068Low Power Consumption, 80-µA Max ICC /C0068Typical tpd = 11 ns /C0068±6-mA Output Drive at 5 V /C0068Low Input Current of 1 µA Max /C00683-State Outputs Drive Bus Lines or Buffer Memory Address Registers 1OE 1A1 2Y4 1A2 2Y3 1A3 2Y2 1A4 2Y1 GND V CC 2OE 1Y1 2A4 1Y2 2A3 1Y3 2A2 1Y4 2A1 SN54HC241 ...J O R W PACKAGE SN74HC241 ...D W , N , NS, OR PW PACKAGE (TOP VIEW) 3212 0 1 9 91 0 1 1 1 2 1 3 1Y1 2A4 1Y2 2A3 1Y3 1A2 2Y3 1A3 2Y2 1A4 SN54HC241 . . . FK PACKAGE (TOP VIEW)2Y4 1A1 1OE 1Y4 2A2 2OE 2Y1 GND 2A1 VCC description/ordering information These octal buffers and line drivers are designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. The ’HC241 devices are organized as two 4-bit buffers/drivers with separate output-enable (1OE and 2OE) inputs. When 1OE is low or 2OE is high, the device passes noninverted data from the A inputs to the Y outputs. When 1OE is high or 2OE is low, the outputs for the respective buffers/drivers are in the high-impedance state.

ORDERING INFORMATION

TA PACKAGE † ORDERABLE PART NUMBER TOP-SIDE MARKING PDIP − N Tube of 20 SN74HC241N SN74HC241N SOIC − DW Tube of 25 SN74HC241DW HC241SOIC − DW Reel of 2000 SN74HC241DWR HC241 −40°C to 85°C SOP − NS Reel of 2000 SN74HC241NSR HC241−40 C to 85C Reel of 70 SN74HC241PW TSSOP − PW Reel of 2000 SN74HC241PWR HC241TSSOP − PW Reel of 250 SN74HC241PWT HC241 CDIP − J Tube of 20 SNJ54HC241J SNJ54HC241J −55°C to 125°C CFP − W Tube of 85 SNJ54HC241W SNJ54HC241W−55 C to 125C LCCC − FK Tube of 55 SNJ54HC241FK SNJ54HC241FK † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright  2003, Texas Instruments Incorporated/C0080/C0082/C0079/C0068/C0085/C0067/C0084/C0073/C0079/C0078 /C0068/C0065/C0084/C0065 /C0105/C0110/C0102/C0111/C0114/C0109/C0097/C0116/C0105/C0111/C0110 /C0105/C0115 /C0099/C0117/C0114/C0114/C0101/C0110/C0116 /C0097/C0115 /C0111/C0102 /C0112/C0117/C0098/C0108/C0105/C0099/C0097/C0116/C0105/C0111/C0110 /C0100/C0097/C0116/C0101/C0046 /C0080/C0114/C0111/C0100/C0117/C0099/C0116/C0115 /C0099/C0111/C0110/C0102/C0111/C0114/C0109 /C0116/C0111 /C0115/C0112/C0101/C0099/C0105/C0102/C0105/C0099/C0097/C0116/C0105/C0111/C0110/C0115 /C0112/C0101/C0114 /C0116/C0104/C0101 /C0116/C0101/C0114/C0109/C0115 /C0111/C0102 /C0084/C0101/C0120/C0097/C0115 /C0073/C0110/C0115/C0116/C0114/C0117/C0109/C0101/C0110/C0116/C0115 /C0115/C0116/C0097/C0110/C0100/C0097/C0114/C0100 /C0119/C0097/C0114/C0114/C0097/C0110/C0116/C0121/C0046 /C0080/C0114/C0111/C0100/C0117/C0099/C0116/C0105/C0111/C0110 /C0112/C0114/C0111/C0099/C0101/C0115/C0115/C0105/C0110/C0103 /C0100/C0111/C0101/C0115 /C0110/C0111/C0116 /C0110/C0101/C0099/C0101/C0115/C0115/C0097/C0114/C0105/C0108/C0121 /C0105/C0110/C0099/C0108/C0117/C0100/C0101 /C0116/C0101/C0115/C0116/C0105/C0110/C0103 /C0111/C0102 /C0097/C0108/C0108 /C0112/C0097/C0114/C0097/C0109/C0101/C0116/C0101/C0114/C0115/C0046 /C0079/C0110 /C0112/C0114/C0111/C0100/C0117/C0099/C0116/C0115 /C0099/C0111/C0109/C0112/C0108/C0105/C0097/C0110/C0116 /C0116/C0111 /C0077/C0073/C0076/C0262/C0080/C0082/C0070/C0262/C0051/C0056/C0053/C0051/C0053/C0044 /C0097/C0108/C0108 /C0112/C0097/C0114/C0097/C0109/C0101/C0116/C0101/C0114/C0115 /C0097/C0114/C0101 /C0116/C0101/C0115/C0116/C0101/C0100 /C0117/C0110/C0108/C0101/C0115/C0115 /C0111/C0116/C0104/C0101/C0114/C0119/C0105/C0115/C0101 /C0110/C0111/C0116/C0101/C0100/C0046 /C0079/C0110 /C0097/C0108/C0108 /C0111/C0116/C0104/C0101/C0114 /C0112/C0114/C0111/C0100/C0117/C0099/C0116/C0115/C0044 /C0112/C0114/C0111/C0100/C0117/C0099/C0116/C0105/C0111/C0110 /C0112/C0114/C0111/C0099/C0101/C0115/C0115/C0105/C0110/C0103 /C0100/C0111/C0101/C0115 /C0110/C0111/C0116 /C0110/C0101/C0099/C0101/C0115/C0115/C0097/C0114/C0105/C0108/C0121 /C0105/C0110/C0099/C0108/C0117/C0100/C0101 /C0116/C0101/C0115/C0116/C0105/C0110/C0103 /C0111/C0102 /C0097/C0108/C0108 /C0112/C0097/C0114/C0097/C0109/C0101/C0116/C0101/C0114/C0115/C0046

/C0083/C0078/C0053/C0052/C0072/C0067/C0050/C0052/C0049/C0044 /C0083/C0078/C0055/C0052/C0072/C0067/C0050/C0052/C0049 /C0079/C0067/C0084/C0065/C0076 /C0066/C0085/C0070/C0070/C0069/C0082/C0083 /C0065/C0078/C0068 /C0076/C0073/C0078/C0069 /C0068/C0082/C0073/C0086/C0069/C0082/C0083 /C0087/C0073/C0084/C0072 /C0051/C0262/C0083/C0084/C0065/C0084/C0069 /C0079/C0085/C0084/C0080/C0085/C0084/C0083 SCLS300C − JANUARY 1996 − REVISED AUGUST 2003

2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

logic diagram (positive logic) 17 3 181A1 1A2 1A3 1A4 1Y1 2OE 2A1 2A2 2A3 2A4 2Y1 1Y2 1Y3 1Y4 2Y2 2Y3 2Y4 1OE absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7.

/C0083/C0078/C0053/C0052/C0072/C0067/C0050/C0052/C0049/C0044 /C0083/C0078/C0055/C0052/C0072/C0067/C0050/C0052/C0049 /C0079/C0067/C0084/C0065/C0076 /C0066/C0085/C0070/C0070/C0069/C0082/C0083 /C0065/C0078/C0068 /C0076/C0073/C0078/C0069 /C0068/C0082/C0073/C0086/C0069/C0082/C0083 /C0087/C0073/C0084/C0072 /C0051/C0262/C0083/C0084/C0065/C0084/C0069 /C0079/C0085/C0084/C0080/C0085/C0084/C0083 SCLS300C − JANUARY 1996 − REVISED AUGUST 2003 3POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 recommended operating conditions (see Note 3) SN54HC241 SN74HC241 UNITMIN NOM MAX MIN NOM MAX UNIT VCC Supply voltage 2 5 6 2 5 6 V VCC = 2 V 1.5 1.5 VIH High-level input voltage VCC = 4.5 V 3.15 3.15 VVIH High-level input voltage VCC = 6 V 4.2 4.2 V VCC = 2 V 0.5 0.5 VIL Low-level input voltage VCC = 4.5 V 1.35 1.35 VVIL Low-level input voltage VCC = 6 V 1.8 1.8 V VI Input voltage 0 VCC 0 VCC V VO Output voltage 0 VCC 0 VCC V VCC = 2 V 1000 1000 ∆t/∆v Input transition rise/fall time VCC = 4.5 V 500 500 ns∆t/∆v Input transition rise/fall time VCC = 6 V 400 400 ns TA Operating free-air temperature −55 125 −40 85 °C NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VCC TA = 25°C SN54HC241 SN74HC241 UNITPARAMETER TEST CONDITIONS VCC MIN TYP MAX MIN MAX MIN MAX UNIT 2 V 1.9 1.998 1.9 1.9 VOH VI = VIH or VIL IOH = −20 µA 6 V 5.9 5.999 5.9 5.9 VVOH VI = VIH or VIL V 2 V 0.002 0.1 0.1 0.1 VOL VI = VIH or VIL IOL = 20 µA 6 V 0.001 0.1 0.1 0.1 VVOL VI = VIH or VIL V II VI = VCC or 0 6 V ±0.1 ±100 ±1000 ±1000 nA IOZ VO = VCC or 0 6 V ±0.01 ±0.5 ±10 ±5 µA ICC VI = VCC or 0, IO = 0 6 V 8 160 80 µA C i 2 V to 6 V 3 10 10 10 pF

/C0083/C0078/C0053/C0052/C0072/C0067/C0050/C0052/C0049/C0044 /C0083/C0078/C0055/C0052/C0072/C0067/C0050/C0052/C0049 /C0079/C0067/C0084/C0065/C0076 /C0066/C0085/C0070/C0070/C0069/C0082/C0083 /C0065/C0078/C0068 /C0076/C0073/C0078/C0069 /C0068/C0082/C0073/C0086/C0069/C0082/C0083 /C0087/C0073/C0084/C0072 /C0051/C0262/C0083/C0084/C0065/C0084/C0069 /C0079/C0085/C0084/C0080/C0085/C0084/C0083 SCLS300C − JANUARY 1996 − REVISED AUGUST 2003

4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

switching characteristics over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 1) PARAMETER FROM TO VCC TA = 25°C SN54HC241 SN74HC241 UNITPARAMETER FROM (INPUT) TO (OUTPUT) VCC MIN TYP MAX MIN MAX MIN MAX UNIT

2 V 39 115 170 145

tpd A Y 4.5 V 12 23 34 29 nstpd A Y

6 V 11 20 29 25

2 V 60 150 225 190

ten OE or OE Y 4.5 V 17 30 45 38 nsten OE or OE Y

6 V 15 26 38 32

2 V 40 150 225 190

tdis OE or OE Y 4.5 V 18 30 45 38 nstdis OE or OE Y

6 V 17 26 38 32

2 V 28 60 90 75

tt Y 4.5 V 8 12 18 15 nstt Y

6 V 6 10 15 13

switching characteristics over recommended operating free-air temperature range, CL = 150 pF (unless otherwise noted) (see Figure 1) PARAMETER FROM TO VCC TA = 25°C SN54HC241 SN74HC241 UNITPARAMETER FROM (INPUT) TO (OUTPUT) VCC MIN TYP MAX MIN MAX MIN MAX UNIT

2 V 50 165 245 210

tpd A Y 4.5 V 16 33 49 42 nstpd A Y

6 V 14 28 42 35

2 V 100 200 300 250

ten OE or OE Y 4.5 V 20 40 60 50 nsten OE or OE Y

6 V 17 34 51 43

2 V 45 210 315 265

tt Y 4.5 V 17 42 63 53 nstt Y

6 V 13 36 53 45

operating characteristics, TA = 25°C PARAMETER TEST CONDITIONS TYP UNIT C pd Power dissipation capacitance per buffer/driver No load 35 pF

NOTES: A. C L includes probe and test-fixture capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns. D. The outputs are measured one at a time with one input transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. Figure 1. Load Circuit and Voltage Waveforms

Orderable Device Status(1) Package Type Package Drawing Pins Package Qty Eco Plan(2) Lead/Ball FinishMSL Peak Temp (3) JM38510/65704BRA ACTIVE CDIP J 20 1 TBD A42 SNPB N / A for Pkg Type SN54HC241J ACTIVE CDIP J 20 1 TBD A42 SNPB N / A for Pkg Type SN74HC241DW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC241DWE4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC241DWR ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC241DWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC241N ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74HC241NE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74HC241NSR ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC241NSRE4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC241PW ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC241PWE4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC241PWR ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC241PWRE4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC241PWT ACTIVE TSSOP PW 20 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC241PWTE4 ACTIVE TSSOP PW 20 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SNJ54HC241FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54HC241J ACTIVE CDIP J 20 1 TBD A42 SNPB N / A for Pkg Type (1)The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2)Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontentfor the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS):TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br):TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) PACKAGE OPTION ADDENDUM www.ti.com 6-Dec-2006 Addendum-Page 1

(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. PACKAGE OPTION ADDENDUM www.ti.com 6-Dec-2006 Addendum-Page 2

MLCC006B – OCTOBER 1996 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 4040140/D 10/96

28 TERMINAL SHOWN

B 0.358 (9,09) MAX (11,63) 0.560 (14,22) 0.560 0.458 0.858 (21,8) 1.063 (27,0) (14,22) ANO. OF MINMAX 0.358 0.660 0.761 0.458 0.342 (8,69) MIN (11,23) (16,26) 0.640 0.739 0.442 (9,09) (11,63) (16,76) 0.962 1.165 (23,83) 0.938 (28,99) 1.141 (24,43) (29,59) (19,32)(18,78) 0.020 (0,51) TERMINALS 0.080 (2,03) 0.064 (1,63) (7,80) 0.307 (10,31) 0.406 (12,58) 0.495 (12,58) 0.495 (21,6) 0.850 (26,6) 1.047 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.035 (0,89) 0.010 (0,25) 121314151618 17 432 0.020 (0,51) 0.010 (0,25) 12826 27 B SQ A SQ 0.055 (1,40) 0.045 (1,14) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. This package can be hermetically sealed with a metal lid. D. The terminals are gold plated. E. Falls within JEDEC MS-004

MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE

14 PINS SHOWN

0,65 M0,10 0,10 0,25 0,50 0,75 0,15 NOM Gage Plane 9,80 9,60 7,90 7,70 2016 6,60 6,40 4040064/F 01/97 0,30 6,60 6,20 0,19 4,30 4,50 0,15 A 1,20 MAX 5,10 4,90 3,10 2,90 A MAX A MIN DIM PINS ** 0,05 4,90 5,10 Seating Plane 0°–8° NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0,15. D. Falls within JEDEC MO-153

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