HC175

SN54HC175_16 TI1 | Alldatasheet

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/C0083/C0078/C0053/C0052/C0072/C0067/C0049/C0055/C0053/C0044 /C0083/C0078/C0055/C0052/C0072/C0067/C0049/C0055/C0053 /C0081/C0085/C0065/C0068/C0082/C0085/C0080/C0076/C0069 /C0068/C0262/C0084/C0089/C0080/C0069 /C0070/C0076/C0073/C0080/C0262/C0070/C0076/C0079/C0080/C0083 /C0087/C0073/C0084/C0072 /C0067/C0076/C0069/C0065/C0082 SCLS299D − JANUARY 1996 − REVISED SEPTEMBER 2003 1POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 /C0068Wide Operating Voltage Range of 2 V to 6 V /C0068Outputs Can Drive Up To 10 LSTTL Loads /C0068Low Power Consumption, 80-µA Max ICC /C0068Contain Four Flip-Flops With Double-Rail Outputs /C0068Typical tpd = 13 ns /C0068±4-mA Output Drive at 5 V /C0068Low Input Current of 1 µA Max /C0068Applications Include: − Buffer/Storage Registers − Shift Registers − Pattern Generators SN54HC175 ...J O R W PACKAGE SN74HC175 . . . D, DB, N, NS, OR PW PACKAGE (TOP VIEW) SN54HC17 5...F K PACKAGE (TOP VIEW) CLR GND VCC CLK 3 2 1 20 19 91 0 1 1 1 2 1 3 NC NC CLR NC CLK 3Q 4Q GND NC VCC NC − No internal connection description/ordering information These positive-edge-triggered D-type flip-flops have a direct clear (CLR) input. The ’HC175 devices feature complementary outputs from each flip-flop.

ORDERING INFORMATION

TA PACKAGE † ORDERABLE PART NUMBER TOP-SIDE MARKING PDIP − N Tube of 25 SN74HC175N SN74HC175N Tube of 40 SN74HC175D SOIC − D Reel of 2500 SN74HC175DR HC175SOIC − D Reel of 250 SN74HC175DT HC175 −40°C to 85°C SOP − NS Reel of 2000 SN74HC175NSR HC175−40 C to 85C SSOP − DB Reel of 2000 SN74HC175DBR HC175 Tube of 90 SN74HC175PW TSSOP − PW Reel of 2000 SN74HC175PWR HC175TSSOP − PW Reel of 250 SN74HC175PWT HC175 CDIP − J Tube of 25 SNJ54HC175J SNJ54HC175J −55°C to 125°C CFP − W Tube of 150 SNJ54HC175W SNJ54HC175W−55 C to 125C LCCC − FK Tube of 55 SNJ54HC175FK SNJ54HC175FK † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright  2003, Texas Instruments Incorporated/C0080/C0082/C0079/C0068/C0085/C0067/C0084/C0073/C0079/C0078 /C0068/C0065/C0084/C0065 /C0105/C0110/C0102/C0111/C0114/C0109/C0097/C0116/C0105/C0111/C0110 /C0105/C0115 /C0099/C0117/C0114/C0114/C0101/C0110/C0116 /C0097/C0115 /C0111/C0102 /C0112/C0117/C0098/C0108/C0105/C0099/C0097/C0116/C0105/C0111/C0110 /C0100/C0097/C0116/C0101/C0046 /C0080/C0114/C0111/C0100/C0117/C0099/C0116/C0115 /C0099/C0111/C0110/C0102/C0111/C0114/C0109 /C0116/C0111 /C0115/C0112/C0101/C0099/C0105/C0102/C0105/C0099/C0097/C0116/C0105/C0111/C0110/C0115 /C0112/C0101/C0114 /C0116/C0104/C0101 /C0116/C0101/C0114/C0109/C0115 /C0111/C0102 /C0084/C0101/C0120/C0097/C0115 /C0073/C0110/C0115/C0116/C0114/C0117/C0109/C0101/C0110/C0116/C0115 /C0115/C0116/C0097/C0110/C0100/C0097/C0114/C0100 /C0119/C0097/C0114/C0114/C0097/C0110/C0116/C0121/C0046 /C0080/C0114/C0111/C0100/C0117/C0099/C0116/C0105/C0111/C0110 /C0112/C0114/C0111/C0099/C0101/C0115/C0115/C0105/C0110/C0103 /C0100/C0111/C0101/C0115 /C0110/C0111/C0116 /C0110/C0101/C0099/C0101/C0115/C0115/C0097/C0114/C0105/C0108/C0121 /C0105/C0110/C0099/C0108/C0117/C0100/C0101 /C0116/C0101/C0115/C0116/C0105/C0110/C0103 /C0111/C0102 /C0097/C0108/C0108 /C0112/C0097/C0114/C0097/C0109/C0101/C0116/C0101/C0114/C0115/C0046 /C0079/C0110 /C0112/C0114/C0111/C0100/C0117/C0099/C0116/C0115 /C0099/C0111/C0109/C0112/C0108/C0105/C0097/C0110/C0116 /C0116/C0111 /C0077/C0073/C0076/C0262/C0080/C0082/C0070/C0262/C0051/C0056/C0053/C0051/C0053/C0044 /C0097/C0108/C0108 /C0112/C0097/C0114/C0097/C0109/C0101/C0116/C0101/C0114/C0115 /C0097/C0114/C0101 /C0116/C0101/C0115/C0116/C0101/C0100 /C0117/C0110/C0108/C0101/C0115/C0115 /C0111/C0116/C0104/C0101/C0114/C0119/C0105/C0115/C0101 /C0110/C0111/C0116/C0101/C0100/C0046 /C0079/C0110 /C0097/C0108/C0108 /C0111/C0116/C0104/C0101/C0114 /C0112/C0114/C0111/C0100/C0117/C0099/C0116/C0115/C0044 /C0112/C0114/C0111/C0100/C0117/C0099/C0116/C0105/C0111/C0110 /C0112/C0114/C0111/C0099/C0101/C0115/C0115/C0105/C0110/C0103 /C0100/C0111/C0101/C0115 /C0110/C0111/C0116 /C0110/C0101/C0099/C0101/C0115/C0115/C0097/C0114/C0105/C0108/C0121 /C0105/C0110/C0099/C0108/C0117/C0100/C0101 /C0116/C0101/C0115/C0116/C0105/C0110/C0103 /C0111/C0102 /C0097/C0108/C0108 /C0112/C0097/C0114/C0097/C0109/C0101/C0116/C0101/C0114/C0115/C0046

/C0083/C0078/C0053/C0052/C0072/C0067/C0049/C0055/C0053/C0044 /C0083/C0078/C0055/C0052/C0072/C0067/C0049/C0055/C0053 /C0081/C0085/C0065/C0068/C0082/C0085/C0080/C0076/C0069 /C0068/C0262/C0084/C0089/C0080/C0069 /C0070/C0076/C0073/C0080/C0262/C0070/C0076/C0079/C0080/C0083 /C0087/C0073/C0084/C0072 /C0067/C0076/C0069/C0065/C0082 SCLS299D − JANUARY 1996 − REVISED SEPTEMBER 2003

2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

description/ordering information (continued) Information at the data (D) inputs meeting the setup time requirements is transferred to the outputs on the positive-going edge of the clock (CLK) pulse. Clock triggering occurs at a particular voltage level and is not related directly to the transition time of the positive-going edge of CLK. When CLK is at either the high or low level, the D input has no effect at the output. FUNCTION TABLE (each flip-flop) INPUTS OUTPUTS CLR CLK D Q Q L X X L H H ↑ HH L H ↑ LL H H L X Q 0 Q 0 logic diagram (positive logic) CLR CLK R 1Q To Three Other Channels 4 2 Pin numbers shown are for the D, DB, J, N, NS, PW, and W packages. absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7.

/C0083/C0078/C0053/C0052/C0072/C0067/C0049/C0055/C0053/C0044 /C0083/C0078/C0055/C0052/C0072/C0067/C0049/C0055/C0053 /C0081/C0085/C0065/C0068/C0082/C0085/C0080/C0076/C0069 /C0068/C0262/C0084/C0089/C0080/C0069 /C0070/C0076/C0073/C0080/C0262/C0070/C0076/C0079/C0080/C0083 /C0087/C0073/C0084/C0072 /C0067/C0076/C0069/C0065/C0082 SCLS299D − JANUARY 1996 − REVISED SEPTEMBER 2003 3POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 recommended operating conditions (see Note 3) SN54HC175 SN74HC175 UNITMIN NOM MAX MIN NOM MAX UNIT VCC Supply voltage 2 5 6 2 5 6 V VCC = 2 V 1.5 1.5 VIH High-level input voltage VCC = 4.5 V 3.15 3.15 VVIH High-level input voltage VCC = 6 V 4.2 4.2 V VCC = 2 V 0.5 0.5 VIL Low-level input voltage VCC = 4.5 V 1.35 1.35 VVIL Low-level input voltage VCC = 6 V 1.8 1.8 V VI Input voltage 0 VCC 0 VCC V VO Output voltage 0 VCC 0 VCC V VCC = 2 V 1000 1000 ∆t/∆v Input transition rise/fall time VCC = 4.5 V 500 500 ns∆t/∆v Input transition rise/fall time VCC = 6 V 400 400 ns TA Operating free-air temperature −55 125 −40 85 °C NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VCC TA = 25°C SN54HC175 SN74HC175 UNITPARAMETER TEST CONDITIONS VCC MIN TYP MAX MIN MAX MIN MAX UNIT 2 V 1.9 1.998 1.9 1.9 VOH VI = VIH or VIL IOH = −20 µA 6 V 5.9 5.999 5.9 5.9 VVOH VI = VIH or VIL V 2 V 0.002 0.1 0.1 0.1 VOL VI = VIH or VIL IOL = 20 µA 6 V 0.001 0.1 0.1 0.1 VVOL VI = VIH or VIL V II VI = VCC or 0 6 V ±0.1 ±100 ±1000 ±1000 nA ICC VI = VCC or 0, IO = 0 6 V 8 160 80 µA C i 2 V to 6 V 3 10 10 10 pF

/C0083/C0078/C0053/C0052/C0072/C0067/C0049/C0055/C0053/C0044 /C0083/C0078/C0055/C0052/C0072/C0067/C0049/C0055/C0053 /C0081/C0085/C0065/C0068/C0082/C0085/C0080/C0076/C0069 /C0068/C0262/C0084/C0089/C0080/C0069 /C0070/C0076/C0073/C0080/C0262/C0070/C0076/C0079/C0080/C0083 /C0087/C0073/C0084/C0072 /C0067/C0076/C0069/C0065/C0082 SCLS299D − JANUARY 1996 − REVISED SEPTEMBER 2003

4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

timing requirements over recommended operating free-air temperature range (unless otherwise noted) VCC TA = 25°C SN54HC175 SN74HC175 UNITVCC MIN MAX MIN MAX MIN MAX UNIT 2 V 6 4.2 5 fclock Clock frequency 4.5 V 31 21 25 MHzfclock Clock frequency

6 V 36 25 29

2 V 80 120 100

CLR low 4.5 V 16 24 20 tw Pulse duration CLR low

6 V 14 20 17

nstw Pulse duration 2 V 80 120 100 ns CLK high or low 4.5 V 16 24 20CLK high or low

2 V 100 150 125

Data 4.5 V 20 30 25 tsu Setup time before CLK↑ Data

6 V 17 25 21

nstsu Setup time before CLK↑ 2 V 100 150 125 ns CLR inactive 4.5 V 20 30 25CLR inactive

2 V 0 0 0

th Hold time, data after CLK↑ 4.5 V 0 0 0 nsth Hold time, data after CLK

6 V 0 0 0

switching characteristics over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 1) PARAMETER FROM TO VCC TA = 25°C SN54HC175 SN74HC175 UNITPARAMETER FROM (INPUT) TO (OUTPUT) VCC MIN TYP MAX MIN MAX MIN MAX UNIT 2 V 6 12 4.2 5 fmax 4.5 V 31 50 21 25 MHzfmax

6 V 36 60 25 29

2 V 52 150 255 190

CLR Any 4.5 V 15 30 45 38 tpd CLR Any

6 V 13 26 38 32

nstpd 2 V 58 150 255 190 ns CLK Any 4.5 V 16 30 45 38CLK Any

2 V 38 75 110 90

tt Any 4.5 V 8 15 22 19 nstt Any

6 V 6 13 19 16

operating characteristics, TA = 25°C PARAMETER TEST CONDITIONS TYP UNIT C pd Power dissipation capacitance per flip-flop No load 30 pF

NOTES: A. C L includes probe and test-fixture capacitance. characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns. C. For clock inputs, fmax is measured when the input duty cycle is 50%. D. The outputs are measured one at a time with one input transition per measurement. E. tPLH and tPHL are the same as tpd. Figure 1. Load Circuit and Voltage Waveforms

www.ti.com 9-Aug-2016 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples 84089012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 84089012A SNJ54HC 175FK 8408901EA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 8408901EA SNJ54HC175J 8408901FA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 8408901FA SNJ54HC175W JM38510/65308BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 65308BEA M38510/65308BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 65308BEA SN54HC175J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 SN54HC175J SN74HC175D ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC175 SN74HC175DBR ACTIVE SSOP DB 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC175 SN74HC175DG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC175 SN74HC175DR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC175 SN74HC175DRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC175 SN74HC175N ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -40 to 85 SN74HC175N SN74HC175NE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -40 to 85 SN74HC175N SN74HC175NSR ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC175 SN74HC175PW ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC175 SN74HC175PWG4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC175 SN74HC175PWLE OBSOLETE TSSOP PW 16 TBD Call TI Call TI -40 to 85

www.ti.com 9-Aug-2016 Addendum-Page 2 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples SN74HC175PWR ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC175 SN74HC175PWT ACTIVE TSSOP PW 16 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC175 SNJ54HC175FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 84089012A SNJ54HC 175FK SNJ54HC175J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 8408901EA SNJ54HC175J SNJ54HC175W ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 8408901FA SNJ54HC175W (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width.

www.ti.com 9-Aug-2016 Addendum-Page 3 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN54HC175, SN74HC175 :

• Catalog: SN74HC175
• Military: SN54HC175 NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
• Military - QML certified for Military and Defense Applications

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 Pack Materials-Page 1

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74HC175DBR SSOP DB 16 2000 367.0 367.0 38.0 SN74HC175DR SOIC D 16 2500 333.2 345.9 28.6 SN74HC175NSR SO NS 16 2000 367.0 367.0 38.0 SN74HC175PWR TSSOP PW 16 2000 367.0 367.0 35.0 SN74HC175PWT TSSOP PW 16 250 367.0 367.0 35.0 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 Pack Materials-Page 2

MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 4040065 /E 12/01

28 PINS SHOWN

8,20 7,40 0,55 0,95 0,25 12,90 12,30 10,50 8,50 Seating Plane 9,907,90 10,50 9,90 0,38 5,60 5,00 0,22 A 2016 6,506,50 0,05 MIN 5,905,90 DIM A MAX A MIN PINS ** 2,00 MAX 6,90 7,50 0,65 M0,15 0°–/C02578° 0,10 0,09 0,25 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0,15. D. Falls within JEDEC MO-150

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