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Document overview
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- PDF pages: 7
Technical content
Features
- Protection for the Following IEC Standards: IEC 61000−4−2 (Level 4) ISO 10605
- Low ESD Clamping V oltage
- Automatically Resets Itself if the LED Heals Itself or is Replaced
- ON−State Voltage Typically 1.1 V
- OFF−State Current less than 1.0 /C0109A
- SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable
- These Devices are Pb−Free and are RoHS Compliant Typical Applications
- LEDs where Preventive Maintenance is Impractical
- LED Headlights in Automobiles
- Automotive LED Applications
- LEDs with High Reliability Requirements
- Crowbar Protection for Open Circuit Conditions
- Overvoltage Protection for Sensitive Circuits http://onsemi.com Control Circuit See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet.
ORDERING INFORMATION
XX = Specific Device Code M = Date Code SOD−323 CASE 477 SOD−523 CASE 502 SOD−923 CASE 514AB HD M M LD M HBL5006 1 2 1 2 HBL5006 Apply heat sinking to pin 2 ESD
http://onsemi.com MAXIMUM RATINGS Rating Symbol Value Unit On−State Current, (TA = 25°C) (Note 2) SOD−323 (Note 1) SOD−323 (Note 2) SOD−523 (Note 1) SOD−523 (Note 2) SOD−923 (Note 1) SOD−923 (Note 2) IT(AVG) 250 200 300 250 350 300 mA Thermal Resistance, Junction−to−Air (All Packages) SOD−323 (Note 1) SOD−323 (Note 2) SOD−523 (Note 1) SOD−523 (Note 2) SOD−923 (Note 1) SOD−923 (Note 2) /C0113JA 435 550 360 435 285 360 °C/W Operating Temperature Range (Note 3) TJ −40 to 150 °C Non−Operating Temperature Range TJ 150 °C Lead Temperature, Soldering (10 Sec) TL 260 °C IEC 61000−4−2 Contact (ESD) IEC 61000−4−2 Air (ESD) ESD ESD ±15 ±15 kV Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Mounted onto a 2−layer, 1000 mm 2 per layer, 3 oz Cu, FR4 PCB with pin 2 connected to the heat sink and pin 1 only connected to a signal trace. The heat sinking must be connected to pin 2, which is the LED cathode connection. Normally this device would be mounted on the same copper heat sink and adjacent to the LED(s). If the LED(s) were to go open, then the HBL shunt would now dissipate the power using the same copper heat sink. Since the shunt has a voltage that is nominally 30% of the LED, then the power dissipation would be much lower, and easily handled by the same heat sink as the LED. 2. Mounted onto a 2−layer, 50 mm 2 per layer, 1 oz Cu, FR4 PCB. 3. Max operating temperature for DC conditions is 150°C, but not to exceed 175°C for pulsed conditions with low duty cycle or non−repetitive.
at the breakdown region. Measured at IBR = 1 mA. application of the off-state voltage. Measured at 3.3 V. performance may not be indicated by the Electrical Characteristics if operated under different conditions.
- ANSI/ESD STM5.5.1 − Electrostatic Discharge Sensitivity Testing using Transmission Line Pulse (TLP) Model TLP conditions: Z0 = 50 /C0087,
tp = 100 ns, tr = 4 ns, averaging window; t1 = 30 ns to t2 = 60 ns. Figure 1. I−V Characteristics
Figure 2. Typical Application Circuit
http://onsemi.com DEVICE ORDERING INFORMATION Device Marking Package Shipping† HBL5006HT1G HD SOD−323 (Pb−Free) 3000 / Tape & Reel SZHBL5006HT1G* HD HBL5006XV2T1G 56 SOD−523 (Pb−Free) 3000 / Tape & Reel SZHBL5006XV2T1G* 56 HBL5006P2T5G LD SOD−923 (Pb−Free) 8000 / Tape & Reel SZHBL5006P2T5G* LD †For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. *SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable. PACKAGE DIMENSIONS SOD−323 CASE 477−02 ISSUE H HE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. LEAD THICKNESS SPECIFIED PER L/F DRAWING WITH SOLDER PLATING. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. 5. DIMENSION L IS MEASURED FROM END OF RADIUS. NOTE 3 D 1 2b E A C NOTE 5 L HE DIM MIN NOM MAX MILLIMETERS A 0.80 0.90 1.00 A1 0.00 0.05 0.10 A3 0.15 REF b 0.25 0.32 0.4 C 0.089 0.12 0.177 D 1.60 1.70 1.80 E 1.15 1.25 1.35 0.08 2.30 2.50 2.70 L 0.031 0.035 0.040 0.000 0.002 0.004
0.006 REF
0.010 0.012 0.016 0.003 0.005 0.007 0.062 0.066 0.070 0.045 0.049 0.053 0.003 0.090 0.098 0.105 MIN NOM MAX INCHES 1.60 0.063 0.63 0.025 0.83 0.033 2.85 0.112 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT*
http://onsemi.com PACKAGE DIMENSIONS SOD−523 CASE 502 ISSUE E NOTES: 6. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 7. CONTROLLING DIMENSION: MILLIMETERS. 8. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 9. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PRO- TRUSIONS, OR GATE BURRS. E D −X− −Y− b2X M0.08 X Y A Hc DIM MIN NOM MAX MILLIMETERS D 1.10 1.20 1.30 E 0.70 0.80 0.90 A 0.50 0.60 0.70 b 0.25 0.30 0.35 c 0.07 0.14 0.20 L 0.30 REF H 1.50 1.60 1.70 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT* E E RECOMMENDED TOP VIEW SIDE VIEW BOTTOM VIEW L2X 0.48 0.40 1.80 DIMENSION: MILLIMETERS PACKAGE OUTLINE L2 0.15 0.20 0.25
http://onsemi.com PACKAGE DIMENSIONS SOD−923 CASE 514AB ISSUE C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PRO- TRUSIONS, OR GATE BURRS. DIM MIN NOM MAX MILLIMETERS A 0.34 0.37 0.40 b 0.15 0.20 0.25 c 0.07 0.12 0.17 D 0.75 0.80 0.85 E 0.55 0.60 0.65 0.95 1.00 1.05 L 0.19 REF HE 0.013 0.015 0.016 0.006 0.008 0.010 0.003 0.005 0.007 0.030 0.031 0.033 0.022 0.024 0.026 0.037 0.039 0.041
0.007 REF
D E c A −Y− −X− DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT* See Application Note AND8455/D for more mounting details 1.20 0.25 0.36 PACKAGE OUTLINE b2X
0.08 XY TOP VIEW
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