HB04

SN54AHCT04_07 TI | Alldatasheet

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/C0083/C0078/C0053/C0052/C0065/C0072/C0067/C0084/C0048/C0052/C0044 /C0083/C0078/C0055/C0052/C0065/C0072/C0067/C0084/C0048/C0052 /C0072/C0069/C0088 /C0073/C0078/C0086/C0069/C0082/C0084/C0069/C0082/C0083 SCLS232N − OCTOBER 1995 − REVISED JULY 2003 1POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 /C0068Inputs Are TTL-Voltage Compatible /C0068Latch-Up Performance Exceeds 250 mA Per JESD 17 /C0068ESD Protection Exceeds JESD 22 − 2000-V Human-Body Model (A114-A) − 200-V Machine Model (A115-A) − 1000-V Charged-Device Model (C101) GND V CC SN54AHCT04 ...J O R W PACKAGE SN74AHCT04 . . . D, DB, DGV, N, NS, OR PW PACKAGE (TOP VIEW) 32 1 2 0 1 9 91 01 11 21 3 NC NC NC NC NC V GND NC SN54AHCT04 . . . FK PACKAGE (TOP VIEW) CC NC − No internal connection SN74AHCT04 . . . RGY PACKAGE (TOP VIEW) 11 4 4Y V GND CC description/ordering information The ’AHCT04 devices contain six independent inverters. These devices perform the Boolean function Y = A.

ORDERING INFORMATION

TA PACKAGE † ORDERABLE PART NUMBER TOP-SIDE MARKING QFN − RGY Tape and reel SN74AHCT04RGYR HB04 PDIP − N Tube SN74AHCT04N SN74AHCT04N SOIC − D Tube SN74AHCT04D AHCT04SOIC − D Tape and reel SN74AHCT04DR AHCT04 −40°C to 85°C SOP − NS Tape and reel SN74AHCT04NSR AHCT04−40 C to 85C SSOP − DB Tape and reel SN74AHCT04DBR HB04 TSSOP − PW Tube SN74AHCT04PW HB04TSSOP − PW Tape and reel SN74AHCT04PWR HB04 TVSOP − DGV Tape and reel SN74AHCT04DGVR HB04 CDIP − J Tube SNJ54AHCT04J SNJ54AHCT04J −55°C to 125°C CFP − W Tube SNJ54AHCT04W SNJ54AHCT04W−55 C to 125C LCCC − FK Tube SNJ54AHCT04FK SNJ54AHCT04FK † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. FUNCTION TABLE (each inverter) INPUT A OUTPUT Y H L L H Copyright  2003, Texas Instruments Incorporated/C0080/C0082/C0079/C0068/C0085/C0067/C0084/C0073/C0079/C0078 /C0068/C0065/C0084/C0065 /C0105/C0110/C0102/C0111/C0114/C0109/C0097/C0116/C0105/C0111/C0110 /C0105/C0115 /C0099/C0117/C0114/C0114/C0101/C0110/C0116 /C0097/C0115 /C0111/C0102 /C0112/C0117/C0098/C0108/C0105/C0099/C0097/C0116/C0105/C0111/C0110 /C0100/C0097/C0116/C0101/C0046 /C0080/C0114/C0111/C0100/C0117/C0099/C0116/C0115 /C0099/C0111/C0110/C0102/C0111/C0114/C0109 /C0116/C0111 /C0115/C0112/C0101/C0099/C0105/C0102/C0105/C0099/C0097/C0116/C0105/C0111/C0110/C0115 /C0112/C0101/C0114 /C0116/C0104/C0101 /C0116/C0101/C0114/C0109/C0115 /C0111/C0102 /C0084/C0101/C0120/C0097/C0115 /C0073/C0110/C0115/C0116/C0114/C0117/C0109/C0101/C0110/C0116/C0115 /C0115/C0116/C0097/C0110/C0100/C0097/C0114/C0100 /C0119/C0097/C0114/C0114/C0097/C0110/C0116/C0121/C0046 /C0080/C0114/C0111/C0100/C0117/C0099/C0116/C0105/C0111/C0110 /C0112/C0114/C0111/C0099/C0101/C0115/C0115/C0105/C0110/C0103 /C0100/C0111/C0101/C0115 /C0110/C0111/C0116 /C0110/C0101/C0099/C0101/C0115/C0115/C0097/C0114/C0105/C0108/C0121 /C0105/C0110/C0099/C0108/C0117/C0100/C0101 /C0116/C0101/C0115/C0116/C0105/C0110/C0103 /C0111/C0102 /C0097/C0108/C0108 /C0112/C0097/C0114/C0097/C0109/C0101/C0116/C0101/C0114/C0115/C0046 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. /C0079/C0110 /C0112/C0114/C0111/C0100/C0117/C0099/C0116/C0115 /C0099/C0111/C0109/C0112/C0108/C0105/C0097/C0110/C0116 /C0116/C0111 /C0077/C0073/C0076/C0262/C0080/C0082/C0070/C0262/C0051/C0056/C0053/C0051/C0053/C0044 /C0097/C0108/C0108 /C0112/C0097/C0114/C0097/C0109/C0101/C0116/C0101/C0114/C0115 /C0097/C0114/C0101 /C0116/C0101/C0115/C0116/C0101/C0100 /C0117/C0110/C0108/C0101/C0115/C0115 /C0111/C0116/C0104/C0101/C0114/C0119/C0105/C0115/C0101 /C0110/C0111/C0116/C0101/C0100/C0046 /C0079/C0110 /C0097/C0108/C0108 /C0111/C0116/C0104/C0101/C0114 /C0112/C0114/C0111/C0100/C0117/C0099/C0116/C0115/C0044 /C0112/C0114/C0111/C0100/C0117/C0099/C0116/C0105/C0111/C0110 /C0112/C0114/C0111/C0099/C0101/C0115/C0115/C0105/C0110/C0103 /C0100/C0111/C0101/C0115 /C0110/C0111/C0116 /C0110/C0101/C0099/C0101/C0115/C0115/C0097/C0114/C0105/C0108/C0121 /C0105/C0110/C0099/C0108/C0117/C0100/C0101 /C0116/C0101/C0115/C0116/C0105/C0110/C0103 /C0111/C0102 /C0097/C0108/C0108 /C0112/C0097/C0114/C0097/C0109/C0101/C0116/C0101/C0114/C0115/C0046

/C0083/C0078/C0053/C0052/C0065/C0072/C0067/C0084/C0048/C0052/C0044 /C0083/C0078/C0055/C0052/C0065/C0072/C0067/C0084/C0048/C0052 /C0072/C0069/C0088 /C0073/C0078/C0086/C0069/C0082/C0084/C0069/C0082/C0083 SCLS232N − OCTOBER 19 95 − REVISED JULY 2003

2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

logic diagram, each inverter (positive logic) YA absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7. 3. The package thermal impedance is calculated in accordance with JESD 51-5. recommended operating conditions (see Note 4) SN54AHCT04 SN74AHCT04 UNITMIN MAX MIN MAX UNIT VCC Supply voltage 4.5 5.5 4.5 5.5 V VIH High-level input voltage 2 2 V VIL Low-level input voltage 0.8 0.8 V VI Input voltage 0 5.5 0 5.5 V VO Output voltage 0 VCC 0 VCC V IOH High-level output current −8 −8 mA IOL Low-level output current 8 8 mA ∆t/∆v Input transition rise or fall rate 20 20 ns/V TA Operating free-air temperature −55 125 −40 85 °C NOTE 4: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004.

/C0083/C0078/C0053/C0052/C0065/C0072/C0067/C0084/C0048/C0052/C0044 /C0083/C0078/C0055/C0052/C0065/C0072/C0067/C0084/C0048/C0052 /C0072/C0069/C0088 /C0073/C0078/C0086/C0069/C0082/C0084/C0069/C0082/C0083 SCLS232N − OCTOBER 1995 − REVISED JULY 2003 3POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VCC TA = 25°C SN54AHCT04 SN74AHCT04 UNITPARAMETER TEST CONDITIONS VCC MIN TYP MAX MIN MAX MIN MAX UNIT VOH IOH = −50 /C0109A 4.5 V 4.4 4.5 4.4 4.4 VVOH IOH = −8 mA 4.5 V 3.94 3.8 3.8 V VOL IOL = 50 /C0109A 4.5 V 0.1 0.1 0.1 VVOL IOL = 8 mA 4.5 V 0.36 0.44 0.44 V II VI = 5.5 V or GND 0 V to 5.5 V ±0.1 ±1* ±1 /C0109A ICC VI = VCC or GND, IO = 0 5.5 V 2 20 20 /C0109A ∆ICC † One input at 3.4 V, Other inputs at VCC or GND 5.5 V 1.35 1.5 1.5 mA C i VI = VCC or GND 5 V 4 10 10 pF * On products compliant to MIL-PRF-38535, this parameter is not production tested at VCC = 0 V. † This is the increase in supply current for each input at one of the specified TTL voltage levels, rather than 0 V or VCC . switching characteristics over recommended operating free-air temperature range, VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1) PARAMETER FROM TO LOAD TA = 25°C SN54AHCT04 SN74AHCT04 UNITPARAMETER FROM (INPUT) TO (OUTPUT) LOAD CAPACITANCE MIN TYP MAX MIN MAX MIN MAX UNIT tPLH A Y C L = 15 pF nstPHL tPLH A Y C L = 50 pF 5.5 7.7 1 8.5 1 8.5 nstPHL A Y C L = 50 pF 5.5 7.7 1 8.5 1 8.5 ns ** On products compliant to MIL-PRF-38535, this parameter is not production tested. noise characteristics, VCC = 5 V, CL = 50 pF, TA = 25°C (see Note 5) PARAMETER SN74AHCT04 UNITPARAMETER MIN TYP MAX UNIT VOL(P) Quiet output, maximum dynamic VOL 0.8 V VOL(V) Quiet output, minimum dynamic VOL −0.8 V VOH(V) Quiet output, minimum dynamic VOH 4.7 V VIH(D) High-level dynamic input voltage 2 V VIL(D) Low-level dynamic input voltage 0.8 V NOTE 5: Characteristics are for surface-mount packages only. operating characteristics, VCC = 5 V, TA = 25°C PARAMETER TEST CONDITIONS TYP UNIT C pd Power dissipation capacitance No load, f = 1 MHz 14 pF

4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

NOTES: A. C L includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns. D. The outputs are measured one at a time with one input transition per measurement. E. All parameters and waveforms are not applicable to all devices. Figure 1. Load Circuit and Voltage Waveforms

Orderable Device Status(1) Package Type Package Drawing Pins Package Qty Eco Plan(2) Lead/Ball FinishMSL Peak Temp (3) 5962-9680401Q2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type 5962-9680401QCA ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type 5962-9680401QDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SN74AHCT04D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHCT04DBLE OBSOLETE SSOP DB 14 TBD Call TI Call TI SN74AHCT04DBR ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHCT04DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHCT04DBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHCT04DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHCT04DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHCT04DGVR ACTIVE TVSOP DGV 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHCT04DGVRE4 ACTIVE TVSOP DGV 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHCT04DGVRG4 ACTIVE TVSOP DGV 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHCT04DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHCT04DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHCT04DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHCT04N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74AHCT04NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74AHCT04NSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHCT04NSRE4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHCT04NSRG4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHCT04PW ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHCT04PWE4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHCT04PWG4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHCT04PWLE OBSOLETE TSSOP PW 14 TBD Call TI Call TI SN74AHCT04PWR ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHCT04PWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM PACKAGE OPTION ADDENDUM www.ti.com 4-Jun-2007 Addendum-Page 1

Orderable Device Status(1) Package Type Package Drawing Pins Package Qty Eco Plan(2) Lead/Ball FinishMSL Peak Temp (3) SN74AHCT04PWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHCT04RGYR ACTIVE QFN RGY 14 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR SN74AHCT04RGYRG4 ACTIVE QFN RGY 14 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR SNJ54AHCT04FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54AHCT04J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type SNJ54AHCT04W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type (1)The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2)Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontentfor the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS):TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br):TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. PACKAGE OPTION ADDENDUM www.ti.com 4-Jun-2007 Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 16-Jun-2007 Pack Materials-Page 1

Device Package Pins Site Reel Diameter (mm) Reel Width (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W (mm) Pin1 Quadrant SN74AHCT04DBR DB 14 MLA 330 16 8.2 6.6 2.5 12 16 Q1 SN74AHCT04DGVR DGV 14 MLA 330 12 6.8 4.0 1.6 8 16 Q1 SN74AHCT04DR D 14 MLA 330 16 6.5 9.0 2.1 8 16 Q1 SN74AHCT04NSR NS 14 MLA 330 16 8.2 10.5 2.5 12 16 Q1 SN74AHCT04PWR PW 14 MLA 330 12 7.0 5.6 1.6 8 12 Q1 SN74AHCT04RGYR RGY 14 MLA 180 12 3.85 3.85 1.35 8 12 Q1 TAPE AND REEL BOX INFORMATION Device Package Pins Site Length (mm) Width (mm) Height (mm) SN74AHCT04DBR DB 14 MLA 342.9 336.6 28.58 SN74AHCT04DGVR DGV 14 MLA 342.9 336.6 20.64 SN74AHCT04DR D 14 MLA 342.9 336.6 28.58 SN74AHCT04NSR NS 14 MLA 342.9 336.6 28.58 SN74AHCT04PWR PW 14 MLA 342.9 336.6 20.64 SN74AHCT04RGYR RGY 14 MLA 190.0 212.7 31.75 PACKAGE MATERIALS INFORMATION www.ti.com 16-Jun-2007 Pack Materials-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 16-Jun-2007 Pack Materials-Page 3

MLCC006B – OCTOBER 1996 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 4040140/D 10/96

28 TERMINAL SHOWN

B 0.358 (9,09) MAX (11,63) 0.560 (14,22) 0.560 0.458 0.858 (21,8) 1.063 (27,0) (14,22) ANO. OF MINMAX 0.358 0.660 0.761 0.458 0.342 (8,69) MIN (11,23) (16,26) 0.640 0.739 0.442 (9,09) (11,63) (16,76) 0.962 1.165 (23,83) 0.938 (28,99) 1.141 (24,43) (29,59) (19,32)(18,78) 0.020 (0,51) TERMINALS 0.080 (2,03) 0.064 (1,63) (7,80) 0.307 (10,31) 0.406 (12,58) 0.495 (12,58) 0.495 (21,6) 0.850 (26,6) 1.047 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.035 (0,89) 0.010 (0,25) 121314151618 17 432 0.020 (0,51) 0.010 (0,25) 12826 27 B SQ A SQ 0.055 (1,40) 0.045 (1,14) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. This package can be hermetically sealed with a metal lid. D. The terminals are gold plated. E. Falls within JEDEC MS-004

MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE

24 PINS SHOWN

3,70 3,50 4,90 5,10 20DIM PINS ** 4073251/E 08/00 1,20 MAX Seating Plane 0,05 0,15 0,25 0,50 0,75 0,23 0,13 11 2 24 13 4,30 4,50 0,16 NOM Gage Plane A 7,90 7,70 382416 4,90 5,103,70 3,50 A MAX A MIN 6,60 6,20 11,20 11,40 9,60 9,80 0,08 M0,070,40 0°–8° NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. D. Falls within JEDEC: 24/48 Pins – MO-153 14/16/20/56 Pins – MO-194

MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 4040065 /E 12/01

28 PINS SHOWN

8,20 7,40 0,55 0,95 0,25 12,90 12,30 10,50 8,50 Seating Plane 9,907,90 10,50 9,90 0,38 5,60 5,00 0,22 A 2016 6,506,50 0,05 MIN 5,905,90 DIM A MAX A MIN PINS ** 2,00 MAX 6,90 7,50 0,65 M0,15 0°–/C02578° 0,10 0,09 0,25 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0,15. D. Falls within JEDEC MO-150

MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE

14 PINS SHOWN

0,65 M0,10 0,10 0,25 0,50 0,75 0,15 NOM Gage Plane 9,80 9,60 7,90 7,70 2016 6,60 6,40 4040064/F 01/97 0,30 6,60 6,20 0,19 4,30 4,50 0,15 A 1,20 MAX 5,10 4,90 3,10 2,90 A MAX A MIN DIM PINS ** 0,05 4,90 5,10 Seating Plane 0°–8° NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0,15. D. Falls within JEDEC MO-153

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