CIM-H33N MITSUMI | Alldatasheet

Document overview

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Technical content

FEATURES

  1. Hinge machanism type 2. Small and tin design 3. Prevents from losing card by attaching a card to the plate at card attachment and removal. 4. Card attachment and removal is easy by plate opening with spring force. 5. Contact slide on card pad at card setting with self-cleaning mechanism. 6. ESD countermeasure is possible at card attachment. Connectors SPECIFICATIONS Rated Voltage AC 50V (rms) Rated Current 0.5A Withstanding Voltage 500V AC (rms) 1minute Insulation Resistance 1000MΩ min. (Initial value) Contact Resistance 100mΩ max. (Initial value)

ELECTRICAL CHARACTERISTICS

Life (Matching Cycle) 10,000times Using Temperature Range -25~+85°C MECHANICAL CHARACTERISTICS HOW TO ORDER H33N-008-21 0 - A G G E 12 3 4 5 6 7 8 1 Series No. (H33N : Nomal type) 2 No. of contacts (008 : 8pins)

3 Housing material (21 : LCP resin)

4 Housing UL grade (0 : UL94V-0)

5 Contact plating (A : Gold)

6 Contact plating thickness (G : 3µm)

7 Contact read style (G : Angle SMT)

8 Package (E : Taping)

MATERIAL & FINISH microSD card connectors Component Parts Material Finish Housing LCP resin (Black) Contact Copper Alloy Gold plating Plate SUS - Lock Spring Copper Alloy Gold plating Wing Copper Alloy Gold plating Shaft SUS - Torsion Spring SUS - DIMENSIONS Slide lock Slide unlock 12.1 2.70.6 0.6 16.9 12.1 0.4 0.4 0.55 0.4 0.55 13.75 0.55 0.4 0.4 0.25 8.3 2.5 0.3 6.3 5.7 5.9 2.157.7 1.11.9 2.2 2.15 (13) (1.5) Slide stroke #1 #8 Slide 1.651 12.1 11.5 1.4 Note [For GND] 4.8 5.4 1.7 9.4 1.7 2.7 1.7 1 1.3 10.76 10.1 9.625 1.7 8.35 7.7 1.1 0.9 0.9 0.9 0.5 OPE.1 Card insert OPE.2 Plate close OPE.3 Plate slide OPE.4 Slide lock position Recommended PWB layout