H24B1 QT | Alldatasheet
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Technical content
PACKAGE DIMENSIONS DESCRIPTION
50 REF The H24B series consists of a gallium arsenide infrared
9.52 MAX 4 emitting diode coupled with a silicon phototransistor. The : devices are housed in a low-cost plastic package with _ lead spacing compatible with a dual in-line package. ey p74 50 REF eles + os seem * LEAD PROFILE
5.35 MAX 6 = 4-pin configuration
aol be 50, = Small package size and low cost = = UL recognized file £51868 FH = High current transfer ratio 16, “50 3.89 MAX — SEATING PLANE cry 7.62 MIN x x | 7.24 DIMENSIONS IN MM $T2006 ANODE| <i EMIT. CATH,| S (S|COLL. stao04 Equivalent Circuit ABSOLUTE MAXIMUM RATINGS TOTAL PACKAGE DETECTOR Lead solder temperature . 260°C for 5 sec Veco feteeteeeeeseeeeeeeeeeees 80V Power dissipation (25°C ambient) 100 mW Derate linearly (above 25°C) veces. 1.67 mW/C 251