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Technical content
Features
1.00 mm aperture Mounting tabs on Housing Choice of inverter or buffer outputs Choice of open-collector or totem-pole output configuration TTL/CMOS compatible output RoHS compliant
Description
The H21L series are slotted switches designed for multipurpose non contact sensing. The con- sist of a GaAs LED and silicon LOGIC OUTPUT sensor packaged in an injection molded hous- ing , facing each other across a 3mm gap.The output is either inverting on non inverting, with a choice of totem-pole or open collector confiqura- tion for TTL/CMOS compatibility. Package Dimensions Notes 1. Dimensions for all drawings are in millimeters. 2. Tolerance of . +/- 0.25mm (0.010) on all non nominal dimensions unless otherwise specified
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Madison, New Jersey 07940 United States of America www.americanmicrosemi.com DEKRA Certification Inc. AS9100C and ISO 9001:2008 Certificate No. 131519.01 © 2016 American Microsemiconductor, Inc. Specifications are subject to change without notice Document Page 2 of 7 Revised 05/2016 Absolute Maximum Ratings (TA = 25O C unless otherwise specified) Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In Addition, extended exposure to stresses above the recommended operat ing conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Symbol Parameter Rating Units TOPR Operating Temperature -40 to +85 oC TSTG Storage Temperature -40 to +85 oC TSOL-I Soldering Temperature (Solder Iron) (3,4,5,6) 240 for 5 sec oC TSOL-F Soldering Temperature (Solder Flow) (3,4.5.6) 260 for 10 sec oC Emitter IF Continuous Forward Current (1) 50 mA VR Reverse Voltage 5 V PD Power Dissipation(1) 100 mW Sensor IO Output Current 50 mA VCC Supply Voltage 4.0-16 V VO Output Voltage 30 V PD Power Dissipation (2) 150 mW Notes: 1. Derate power dissipation linearly, on Emitter, 1.67 mW/OC above 25OC. 2. Derate power dissipation linearly, 2.50 mW/OC above 25OC. 3. RMA Flux is recommended. 4. Methanol or isopropyl alcohols are recommended as cleaning agents. 5. Soldering iron tip 1.6mm from housing. 6. As long as leads are not under stress or spring tension Input/Output Table Part Number LED Output H21LTB On High H21LTB Off Low H21LTI On Low H21LTI Off High H21LOB On High H21LOB Off Low H21LOI On Low H21LOI Off High
Tel. 1-973-377-9566 Fax. 1-973-377-3078 Madison, New Jersey 07940 United States of America www.americanmicrosemi.com DEKRA Certification Inc. AS9100C and ISO 9001:2008 Certificate No. 131519.01 © 2016 American Microsemiconductor, Inc. Specifications are subject to change without notice Document Page 3 of 7 Revised 05/2016 Electrical/Optical Characteristics Cont. (TA = 25O C ) Symbol Parameter Test Condtions Min. Typ. Max. Units VCC Recommended Operating Supply Voltage IF = 20mA 4.4 5.5 V VF Forward Voltage IF = 20mA 1.5 V IR Reverse Leakage Current VR = 5V 10 µA Output (Sensor) ICC Supply Current VCC = 5V 5 mA Coupled VOL Low Level Output Voltage H21LTB, H21LOB IF = 0mA, VCC = 5V, IOL = 16mA 0.4 V Low Level Output Voltage H21LTI, H21LOI IF = 15mA, VCC = 5V, IOL = 16mA 0.4 VOH High Level Output H21LTB IF = 15mA, VCC = 5V, IOH = ‐1mA 2.4 V High Level Output H21LTI IF = 0mA, VCC = 5V, IOH = ‐1mA 2.4 IOH High Level Output Current H21LOB IF = 15mA, VCC = 5V, VOH = 30V 100 µA High Level Output Current H21LOI IF = 0mA, VCC = 5V, VOH = 30V 100 µA IF(+) Turn on Threshold Current VCC = 5V 15 mA IF(-) Turn off Threshold Current VCC = 5V 0.5 mA IF(+)/IF(-) Hysteresis Ratio 1.2 tPLH, tPHL Propagation Delay H21LOI, H21LOB VCC = 5V, RL = 300Ω (Fig 9) 6 µS Propagation Delay H21LTI, H21LTB VCC = 5V, RL = 300Ω (Fig 9) 6 Tr, Tf Output Rise and Fall Time, H21LOI, H21LOB VCC = 5V, RL = 300Ω (Fig 9) 100 nS Output Rise and Fall Time, H21LTI, H21LTB VCC = 5V, RL = 300Ω (Fig 9) 70
Tel. 1-973-377-9566 Fax. 1-973-377-3078 Madison, New Jersey 07940 United States of America www.americanmicrosemi.com DEKRA Certification Inc. AS9100C and ISO 9001:2008 Certificate No. 131519.01 © 2016 American Microsemiconductor, Inc. Specifications are subject to change without notice Document Page 4 of 7 Revised 05/2016 Schematics
Tel. 1-973-377-9566 Fax. 1-973-377-3078 Madison, New Jersey 07940 United States of America www.americanmicrosemi.com DEKRA Certification Inc. AS9100C and ISO 9001:2008 Certificate No. 131519.01 © 2016 American Microsemiconductor, Inc. Specifications are subject to change without notice Document Page 5 of 7 Revised 05/2016 Typical Performance Characteristics
Tel. 1-973-377-9566 Fax. 1-973-377-3078 Madison, New Jersey 07940 United States of America www.americanmicrosemi.com DEKRA Certification Inc. AS9100C and ISO 9001:2008 Certificate No. 131519.01 © 2016 American Microsemiconductor, Inc. Specifications are subject to change without notice Document Page 6 of 7 Revised 05/2016 Switching Criteria DISCLAMER AMERICAN MICROSEMICONDUCTOR INC RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY. FUNCTION OR DESIGN AMERICAN MICROSEMICONDUCTOR INC DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; HEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHT OF ORTHERS LIFE SUPPORT POLICY AMERICAN MICROSEMICONDUCTOR’S ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF AMERICAN MICROSEMICONDUCTOR’S. As used herein: 1.Life support devices or systems are devices or systems 2. A critical component in any component of a life support which, (a) are intended for surgical implant into the body, device or system whose failure to perform can be or (b) support or sustain life, and (c) whose failure to reasonably expected to cause the failure of the life support perform when properly used in accordance with device or system, or to affect its safety or effectiveness. instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user.
Tel. 1-973-377-9566 Fax. 1-973-377-3078 Madison, New Jersey 07940 United States of America www.americanmicrosemi.com DEKRA Certification Inc. AS9100C and ISO 9001:2008 Certificate No. 131519.01 © 2016 American Microsemiconductor, Inc. Specifications are subject to change without notice Document Page 7 of 7 Revised 05/2016