H11N1SR2VM

H11N1 FAIRCHILD | Alldatasheet

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Technical content

HIGH SPEED LOGIC OPTOCOUPLERS 4/14/03 Page 1 of 9 © 2003 Fairchild Semiconductor Corporation H11N1-M H11N2-M H11N3-M

DESCRIPTION

The H11NX-M series has a high speed integrated circuit detector optically coupled to an AlGaAs infrared emitting diode. The output incorporates a Schmitt trigger, which provides hysteresis for noise immunity and pulse s haping. The detector circuit is optimized for simplicity of operation and utilizes an open collector output for maximum application flexibility.

FEATURES

• High data rate, 5 MHz typical (NRZ)
• F ree from latch up and oscilliation throughout voltage and temperature ranges.
• Microprocessor compatible drive
• Logic compatible output sinks 16 mA at 0.5 V maximum
• Guaranteed on/off threshold hysteresis
• Wide supply voltage capability, compatible with all popular logic systems
• High common mode transient immunity, 2000 V/µs minimum
• F ast switching t r = 7.5ns typical, t f = 12ns typical
• Underwriter Laboratory (UL) recognized—file #E90700
• VDE recognized – File#102497 – Add option V (e.g., H11N1VM)

APPLICATIONS

• Logic to logic isolator
• Programmable current level sensor
• Line receiver—eliminate noise and transient problems
• A.C. to TTL conversion—square wave shaping
• Interfaces computers with peripherals
• Isolated power MOS driver for power supplies 5G N D 4 VO VCCANODE CATHODE Truth Table Input Output HL LH

© 2003 Fairchild Semiconductor Corporation 6-PIN DIP HIGH SPEED LOGIC OPTOCOUPLERS H11N1-M H11N2-M H11N3-M *Typical values at T A = 25°C ABSOLUTE MAXIMUM RATINGS Parameters Symbol Device Value Units TOTAL DEVICE Storage Temperature T STG All -55 to +150 °C Operating Temperature T OPR All -40 to +85 °C Lead Solder Temperature T SOL All 260 for 10 sec °C Total Device Power Dissipation @ 25°C P D All 250 mW Derate Above 25°C 2.94 mW/°C EMITTER Continuous Forward Current I F All 30 mA Reverse Voltage V R All 6 V Forward Current - Peak (1 µs pulse, 300 pps) I F (pk) All 1.0 A LED Power Dissipation 25°C Ambient P D All 120 mW Derate Linearly From 25°C 1.41 mW/°C DETECTOR Detector Power Dissipation @ 25°C P D All 150 mW Derate Linearly from 25°C 1.76 mW/°C V Allowed Range V O All 0 to 16 V V Allowed Range V CC All 0 to 16 V I Output Current I O All 50 mA

ELECTRICAL CHARACTERISTICS

A = 0-70°C Unless otherwise specified.) INDIVIDUAL COMPONENT CHARACTERISTICS Parameters Test Conditions Symbol Device Min Typ* Max Units EMITTER Input Forward Voltage I F = 10 mA V F All 1.4 2 V I F = 0.3 mA 0.75 1.25 Reverse Current V R = 5 V I R All 10 µA Capacitance V = 0, f = 1.0 MHz C J All 100 pF DETECTOR Operating Voltage Range V CC All 4 15 V Supply Current I F = 0, V CC = 5V I CC(off) All 6 10 mA Output Current, High I F = 0.3mA, V CC = V O = 15V I OH All 100 µA

© 2003 Fairchild Semiconductor Corporation 6-PIN DIP HIGH SPEED LOGIC OPTOCOUPLERS H11N1-M H11N2-M H11N3-M *Typical values at T A = 25°C NOTES: 1. Maximum I F(ON) is the maximum current required to trigger the output. For example, a 3.2mA maximum trigger current would require the LED to be driven at a current greater than 3.2mA to guarantee the device will turn on. A 10% guard band is recommended to account for degradation of the LED over its lifetime. The maximum allowable LED drive current is 30mA. 2. H11N1: R E = 910 Ω H11N2: R E = 560 Ω H11N3: R E = 240 Ω TRANSFER CHARACTERISTICS DC Characteristics Test Conditions Symbol Device Min Typ* Max Units Supply Current I F = 10mA, V CC = 5V I CC(on) All 6.5 10 mA Output Voltage, low R L =270 Ω CC =5V, I F F(on) max. V OL All 0.5 V Turn-On Threshold Current R L =270 Ω , V CC = 5V note 1 I F(on) H11N1-M 0.8 3.2 mAH11N2-M 2.3 5 H11N3-M 4.1 10 Turn-Off Threshold Current R L =270 Ω , V CC = 5V I F(off) All 0.3 mA Hysteresis Ratio R L =270 Ω , V CC = 5V I F(off) F(on) All 0.65 0.95 AC Characteristics Test Conditions Symbol Device Min Typ Max Units SWITCHING SPEED Propagation delay time High to Low C=120pF , t P =1µs, R E : Note 2 Fig. 1 t PHL All 100 330 ns Rise Time C=120pF , t P =1µs, R E : Note 2 Fig. 1 t r All 7.5 ns Propagation delay time Low to High C=120pF , t P =1µs, R E : Note 2 Fig. 1 t PLH All 150 330 ns Fall time C=120pF , t P =1µs, R E : Note 2 Fig. 1 t f All 12 ns Data Rate All 5 MHz ISOLATION CHARACTERISTICS Parameters Test Conditions Symbol Min Typ* Max Units Input-Output Isolation Voltage f = 60 Hz, t =1 sec. V ISO 7500 V PEAK Isolation Capacitance V I-O = 0V, f = 1 MHz C ISO 0.4 0.6 pF Isolation Resistance V I-O = ±500 VDC R ISO Ω

Figure 6. Supply Current vs. Supply Voltage Figure 7. LED Forward Voltage vs. Forward Current

© 2003 Fairchild Semiconductor Corporation 6-PIN DIP HIGH SPEED LOGIC OPTOCOUPLERS H11N1-M H11N2-M H11N3-M Package Dimensions (Through Hole) Package Dimensions (Surface Mount) Package Dimensions (0.4” Lead Spacing) Recommended Pad Layout for Surface Mount Leadform 0.350 (8.89) 0.320 (8.13) 0.260 (6.60) 0.240 (6.10) 0.320 (8.13) 0.070 (1.77) 0.040 (1.02) 0.014 (0.36) 0.010 (0.25) 0.200 (5.08) 0.115 (2.93) 0.100 (2.54) 0.015 (0.38) 0.020 (0.50) 0.012 (0.30) 0.350 (8.89) 0.320 (8.13) 0.260 (6.60) 0.240 (6.10) 0.390 (9.90) 0.332 (8.43) 0.070 (1.77) 0.040 (1.02) 0.014 (0.36) 0.010 (0.25) 0.320 (8.13) 0.035 (0.88) 0.006 (0.16) 0.012 (0.30) 0.008 (0.20) 0.200 (5.08) 0.115 (2.93) 0.025 (0.63) 0.020 (0.51) 0.020 (0.50) 0.016 (0.41) 0.100 [2.54] 0.350 (8.89) 0.320 (8.13) 0.260 (6.60) 0.240 (6.10) 0.070 (1.77) 0.010 (0.25) 0.200 (5.08) 0.115 (2.93) 0.020 (0.50) 0.016 (0.41) 0.100 [2.54] 0.100 (2.54) 0.015 (0.38) 0.012 (0.30) 0.008 (0.21) 0.425 (10.80) 0.400 (10.16) 0.070 (1.78) 0.060 (1.52) 0.030 (0.76) 0.100 (2.54) 0.305 (7.75) 0.425 (10.79)

4/14/03Page 7 of 9© 2003 Fairchild Semiconductor Corporation 6-PIN DIP HIGH SPEED LOGIC OPTOCOUPLERS H11N1-M H11N2-M H11N3-M

ORDERING INFORMATION

Option/Order Entry Identifier Description S Surface Mount Lead Bend SR2 Surface Mount; Tape and reel T 0.4" Lead Spacing V VDE 0884 TV VDE 0884, 0.4" Lead Spacing SV VDE 0884, Surface Mount SR2V VDE 0884, Surface Mount, Tape & Reel H11N1 V X YY Q 43 5 *Note – Parts that do not have the ‘V’ option (see definition 3 above) that are marked with date code ‘325’ or earlier are marked in portrait format. Definitions 1F airchild logo 2D evice number

3 VDE mark (Note: Only appears on parts ordered with VDE

option – See order entry table) 4 One digit year code, e.g., ‘3’ 5T wo digit work week ranging from ‘01’ to ‘53’

6 Assembly package code

4/14/03Page 8 of 9© 2003 Fairchild Semiconductor Corporation 6-PIN DIP HIGH SPEED LOGIC OPTOCOUPLERS H11N1-M H11N2-M H11N3-M NOTE All dimensions are in inches (millimeters) Reflow Profile (White Package, -M Suffix) Carrier Tape Specifications 4.0 ± 0.1 Ø 1.5 MIN User Direction of Feed 2.0 ± 0.05 1.75 ± 0.10 11.5 ± 1.0 24.0 ± 0.3 12.0 ± 0.1 0.30 ± 0.05 21.0 ± 0.1 4.5 ± 0.20 0.1 MAX 10.1 ± 0.20 9.1 ± 0.20 Ø 1.5 ± 0.1/-0 Ramp up = 2–10°C/sec • Peak reflow temperature: 245°C (package surface temperature)

• Time of temperature higher than 183°C for 120–180 seconds
• One time soldering reflow is recommended 230°C, 10–30 s Time (Minute) 300 250 200 150 100 Temperature (°C) Time above 183°C, 120–180 sec 245°C peak

FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. 4/14/03Page 9 of 9© 2003 Fairchild Semiconductor Corporation 6-PIN DIP HIGH SPEED LOGIC OPTOCOUPLERS H11N1-M H11N2-M H11N3-M