H11L1M_06 FAIRCHILD | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 9

Technical content

Features

High data rate, 1MHz typical (NRZ) Free from latch up and oscilliation throughout voltage and temperature ranges. Microprocessor compatible drive Logic compatible output sinks 16mA at 0.4V maximum Guaranteed on/off threshold hysteresis Wide supply voltage capability, compatible with all popular logic systems Underwriters Laboratory (UL) recognized— file #E90700, Volume 2 VDE recognized – File#102497 – Add option V (e.g., H11LIVM)

Applications

Programmable current level sensor Line receiver—eliminate noise and transient problems A.C. to TTL conversion—square wave shaping Digital programming of power supplies Interfaces computers with peripherals

Description

The H11LXM series has a high speed integrated circuit detector optically coupled to a gallium-arsenide infrared emitting diode. The output incorporates a Schmitt trigger, which provides hysteresis for noise immunity and pulse shaping. The detector circuit is optimized for simplicity of operation and utilizes an open collector output for maximum application flexibility. Packages Schematic

5 GND

www.fairchildsemi.com H11L1M, H11L2M, H11L3M Rev. 1.0.0 H11L1M, H11L2M, H11L3M 6-Pin DIP Optocoupler Absolute Maximum Ratings A = 25°C Unless otherwise specified.) Symbol Parameters Value Units TOTAL DEVICE T STG Storage Temperature -55 to +150 °C T OPR Operating Temperature -40 to +85 °C T SOL Lead Solder Temperature 260 for 10 sec °C P D Total Device Power Dissipation @ 25°C 250 mW Derate Above 25°C 2.94 mW/°C EMITTER I F Continuous Forward Current 60 mA V R Reverse Voltage 6 V I F (pk) Forward Current – Peak (1µs pulse, 300pps) 3.0 A P D LED Power Dissipation 25°C Ambient 120 mW Derate Linearly From 25°C 1.41 mW/°C DETECTOR P D Detector Power Dissipation @ 25°C 150 mW Derate Linearly from 25°C 2.0 mW/°C V O V Allowed Range 0 to 16 V V CC V Allowed Range 3 to 16 V I O I Output Current 50 mA

www.fairchildsemi.com H11L1M, H11L2M, H11L3M Rev. 1.0.0 H11L1M, H11L2M, H11L3M 6-Pin DIP Optocoupler

Electrical Characteristics

A = 25°C Unless otherwise specified.) Individual Component Characteristics Transfer Characteristics Isolation Characteristics Note: 1. Maximum I F(ON) is the maximum current required to trigger the output. For example, a 1.6mA maximum trigger current would require the LED to be driven at a current greater than 1.6mA to guarantee the device will turn on. A 10% guard band is recommended to account for degradation of the LED over its lifetime. The maximum allowable LED drive current is 60mA. Symbol Parameters Test Conditions Device Min. Typ. Max. Units EMITTER V F Input Forward Voltage I F = 10mA All 1.2 1.5 V I F = 0.3mA 0.75 1.0 I R Reverse Current V R = 3V All 10 µA C J Capacitance V = 0, f = 1.0MHz All 100 pF DETECTOR V CC Operating Voltage Range All 3 15 V I CC(off) Supply Current I F = 0, V CC = 5V All 1.6 5.0 mA I OH Output Current, High I F = 0, V CC = V O = 15V All 100 µA Symbol Parameter Test Conditions Device Min. Typ. Max. Units DC CHARACTERISTICS I CC(on) Supply Current I F = 10mA, V CC = 5V All 1.6 5.0 mA V OL Output Voltage, low R L = 270 Ω CC = 5V, I F = I F(on) max. All 0.2 0.4 V I F(on) Turn-On Threshold Current (1) R L = 270 Ω , V CC = 5V H11L1M 1.6 mA H11L2M 10.0 H11L3M 5.0 I F(off) Turn-Off Threshold Current R L = 270 Ω , V CC = 5V All 0.3 1.0 mA I F(off) F(on) Hysteresis Ratio R L = 270 Ω , V CC = 5V All 0.50 0.75 0.90 AC CHARACTERISTICS, Switching Speed t on Turn-On time R L = 270 Ω , V CC = 5V, I F = I F(on) , T A = 25°C All 1.0 4 µs t f Fall Time R L = 270 Ω , V CC = 5V, I F = I F(on) , T A = 25°C All 0.1 µs t off Turn-Off Time R L = 270 Ω , V CC = 5V, I F = I F(on) , T A = 25°C All 1.2 4 µs t r Rise time R L = 270 Ω , V CC = 5V, I F = I F(on) , T A = 25°C All 0.1 µs Data Rate All 1.0 MHz Symbol Parameter Test Conditions Min. Typ. Max. Units V ISO Input-Output Isolation Voltage t =1 sec. 7500 V PEAK C ISO Isolation Capacitance V I-O = 0V, f = 1MHz 0.4 0.6 pF R ISO Isolation Resistance V I-O = ±500 VDC 1011 Ω

Figure 7. Switching Test Circuit and Waveforms

6 www.fairchildsemi.com H11L1M, H11L2M, H11L3M Rev. 1.0.0 H11L1M, H11L2M, H11L3M 6-Pin DIP Optocoupler Package Dimensions Through Hole Surface Mount Recommend Pad Layout for 0.4” Lead Spacing Surface Mount Leadform Note: All dimensions are in inches (millimeters). 0.350 (8.89) 0.320 (8.13) 0.260 (6.60) 0.240 (6.10) 0.320 (8.13) 0.070 (1.77) 0.040 (1.02) 0.014 (0.36) 0.010 (0.25) 0.200 (5.08) 0.115 (2.93) 0.100 (2.54) 0.015 (0.38) 0.020 (0.50) 0.012 (0.30) 0.350 (8.89) 0.320 (8.13) 0.260 (6.60) 0.240 (6.10) 0.390 (9.90) 0.332 (8.43) 0.070 (1.77) 0.040 (1.02) 0.014 (0.36) 0.010 (0.25) 0.320 (8.13) 0.035 (0.88) 0.012 (0.30) 0.012 (0.30) 0.008 (0.20) 0.200 (5.08) 0.115 (2.93) 0.025 (0.63) 0.020 (0.51) 0.020 (0.50) 0.016 (0.41) 0.100 [2.54] 0.350 (8.89) 0.320 (8.13) 0.260 (6.60) 0.240 (6.10) 0.070 (1.77) 0.010 (0.25) 0.200 (5.08) 0.115 (2.93) 0.020 (0.50) 0.016 (0.41) 0.100 [2.54] 0.100 (2.54) 0.015 (0.38) 0.012 (0.30) 0.008 (0.21) 0.425 (10.80) 0.400 (10.16) 0.070 (1.78) 0.060 (1.52) 0.030 (0.76) 0.100 (2.54) 0.305 (7.75) 0.425 (10.79)

7 www.fairchildsemi.com H11L1M, H11L2M, H11L3M Rev. 1.0.0 H11L1M, H11L2M, H11L3M 6-Pin DIP Optocoupler

Ordering Information

Option/Order Entry Identifier Description S Surface Mount Lead Bend SR2 Surface Mount; Tape and reel T 0.4" Lead Spacing V VDE 0884 TV VDE 0884, 0.4" Lead Spacing SV VDE 0884, Surface Mount SR2V VDE 0884, Surface Mount, Tape & Reel H11L1 V X YY Q 43 5 *Note – Parts that do not have the ‘V’ option (see definition 3 above) that are marked with date code ‘325’ or earlier are marked in portrait format. Definitions 1F airchild logo 2D evice number

3 VDE mark (Note: Only appears on parts ordered with VDE

option – See order entry table) 4 One digit year code, e.g., ‘3’ 5T wo digit work week ranging from ‘01’ to ‘53’

6 Assembly package code

8 www.fairchildsemi.com H11L1M, H11L2M, H11L3M Rev. 1.0.0 H11L1M, H11L2M, H11L3M 6-Pin DIP Optocoupler Tape Dimensions Note: All dimensions are in millimeters. Reflow Profile 4.0 ± 0.1 Ø 1.5 MIN User Direction of Feed 2.0 ± 0.05 1.75 ± 0.10 11.5 ± 1.0 24.0 ± 0.3 12.0 ± 0.1 0.30 ± 0.05 21.0 ± 0.1 4.5 ± 0.20 0.1 MAX 10.1 ± 0.20 9.1 ± 0.20 Ø 1.5 ± 0.1/-0 300 280 260 240 220 200 180 160 140 120 100 Time (s) 0 60 180120 270 260°C >245°C = 42 Sec Time above 183°C = 90 Sec 360 1.822°C/Sec Ramp up rate

33 Sec

The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. Definition of Terms ACEx™ ActiveArray™ Bottomless™ Build it Now™ CoolFET™ CROSSVOLT ™ DOME™ EcoSPARK™ E2CMOS™ EnSigna™ FACT FAST® FASTr™ FPS™ FRFET™ FACT Quiet Series™ GlobalOptoisolator™ GTO™ HiSeC™ I 2C™ i-Lo™ ImpliedDisconnect™ IntelliMAX™ ISOPLANAR™ LittleFET™ MICROCOUPLER™ MicroFET™ MicroPak™ MICROWIRE™ MSX™ MSXPro™ OCX™ OCXPro™ OPTOLOGIC® OPTOPLANAR™ PACMAN™ POP™ Power247™ PowerEdge™ PowerSaver™ PowerTrench QFET® QS™ QT Optoelectronics™ Quiet Series™ RapidConfigure™ RapidConnect™ µSerDes™ ScalarPump™ SILENT SWITCHER SMART START™ SPM™ Stealth™ SuperFET™ SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 SyncFET™ TCM™ TinyBoost™ TinyBuck™ TinyPWM™ TinyPower™ TinyLogic® TINYOPTO™ TruTranslation™ UHC® UniFET™ VCX™ Wire™ Across the board. Around the world.™ The Power Franchise® Programmable Active Droop™ Datasheet Identification Product Status Definition Advance Information Formative or In Design This data sheet contains the design specifications for product development. Specifications may change in any manner without notice. Preliminary First Production This datasheet contains preliminary da ta, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. No Identification Needed Full Production This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor . The datasheet is printed for reference information only. FAIRCHILD SEMICONDUCTOR TRADEMARKS DISCLAIMER LIFE SUPPORT POLICY PRODUCT STATUS DEFINITIONS Rev. I22