H11C1

H11C1 FAIRCHILD | Alldatasheet

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Technical content

© 2003 Fairchild Semiconductor Corporation H11C1 H11C2 H11C3 H11C4 H11C5 H11C6

DESCRIPTION

The H11C series consists of a gallium-arsenide infrared emitting diode optically coupled with a light activated silicon controlled rectifier in a dual-in-line package

FEATURES

• High efficiency, low degradation, liquid epitaxial LED
• Underwriters Laboratory (UL) recognized fl File #E90700
• 200V/400V Peak blocking voltage
• High isolation voltage - 5300V AC (RMS)

APPLICATIONS

• L ow power logic circuits
• T elecommunications equipment
• P ortable electronics
• Solid state relays
• Interfacing coupling systems of different potentials and impedances.
• 10 A, T L compatible, solid state relay
• 25 W logic indicator lamp driver
• 200 V symmetrical transistor coupler (H11C1, H11C2, H11C3)
• 400 V symmetrical transistor coupler (H11C4, H11C5, H11C6) CATHODE ANODE ANODE CATHODE

6 GATE

© 2003 Fairchild Semiconductor Corporation PHOTO SCR OPTOCOUPLERS H11C1 H11C2 H11C3 H11C4 H11C5 H11C6 Parameter Symbol Device Value Units TOTAL DEVICE Storage Temperature T STG All -55 to +150 °C Operating Temperature T OPR All -55 to +100 °C Lead Solder Temperature T SOL All 260 for 10 sec °C EMITTER Continuous Forward Current I F All 60 mA Reverse Voltage V R All 6 V Forward Current - Peak (1 µs pulse, 300 pps) I F(pk) All 3.0 A LED Power Dissipation P D All 100 mW Derate above 25°C 1.33 mW/°C DETECTOR Power Dissipation (ambient) P D All 400 mW Derate linearly above 25°C ambient 5.3 mW/°C Power Dissipation (case) P D All Derate linearly above 25°C case 13.3 mW/°C Peak Reverse Gate Voltage V GR All 6 V RMS On-State Current I DM (RMS) All 300 mA Peak On-State Current (100 µS, 1% duty cycle) I DM (Peak) All 10 A Surge Current (10ms) I DM (Surge) All 5 A Peak Forward Voltage V DM H11C1, H11C2, H11C3 200 V Peak Forward Voltage V DM H11C4, H11C5, H11C6 400 V

© 2003 Fairchild Semiconductor Corporation PHOTO SCR OPTOCOUPLERS H11C1 H11C2 H11C3 H11C4 H11C5 H11C6 *Typical values at T A = 25°C

ELECTRICAL CHARACTERISTICS

A = 25°C Unless otherwise specified.) INDIVIDUAL COMPONENT CHARACTERISTICS Parameter Test Conditions Symbol Device Min Typ* Max Unit EMITTER Input Forward Voltage I F = 10 mA V F All 1.2 1.5 V Reverse Leakage Current V R = 3 V I R All 10 µA Capacitance V F = 0 V, f = 1.0 MHz C J All 50 pF DETECTOR Off-State Voltage R GK = 10k Ω , T A = 100°C, I D = 50µA V DM H11C1, H11C2, H11C3 200 V R GK = 10k Ω , T A = 100°C, I D = 150µA H11C4, H11C5, H11C6 400 Reverse Voltage R GK = 10k Ω A = 100°C, I R = 50µA V RM H11C1, H11C2, H11C3 200 V R GK = 10k Ω A = 100°C, I R = 150µA H11C4, H11C5, H11C6 400 On-State Voltage I TM = 300 mA V TM All 1.2 1.3 V Off-State Current V DM = 200V, T A = 100°C, I F = 0 mA, R GK = 10k Ω I DM H11C1, H11C2, H11C3 50 µA V DM = 400V, T A = 100°C, I F = 0 mA, R GK = 10k Ω H11C4, H11C5, H11C6 150 Reverse Current V RM = 200 V, T A = 100 °C, I F = 0 mA, R GK = 10k Ω I RM H11C1, H11C2, H11C3 50 µA V RM = 400 V, T A = 100 °C, I F = 0 mA, R GK = 10k Ω H11C4, H11C5, H11C6 150 TRANSFER CHARACTERISTICS A = 25°C Unless otherwise specified.) Characteristics Test Conditions Symbol Device Min Typ* Max Units Input Current to Trigger V AK = 50 V, R GK = 10 k Ω I FT H11C1,H11C2, H11C4, H11C5 20 H11C3, H11C6 30 mA V AK = 100 V, R GK = 27 k Ω H11C1,H11C2, H11C4, H11C5 11 H11C3, H11C6 14 Coupled dv/dt, input to output (figure 8) dv/dt ALL 500 V/µS

© 2003 Fairchild Semiconductor Corporation PHOTO SCR OPTOCOUPLERS H11C1 H11C2 H11C3 H11C4 H11C5 H11C6 *Typical values at T A = 25°C Note 1. For this test, LED pins 1 and 2 are common, and SCR pins 4, 5 and 6 are common. ISOLATION CHARACTERISTICS Characteristic Test Conditions Symbol Min Typ* Max Units Isolation Voltage (t = 1 min.) (note 1) V ISO 5300 V Isolation Resistance (note 1) (V I-O = 500 VDC) R ISO Ω Isolation Capacitance (note 1) (f = 1 MHz, V I-O = 0) C I-O 0.8 pF

© 2003 Fairchild Semiconductor Corporation PHOTO SCR OPTOCOUPLERS H11C1 H11C2 H11C3 H11C4 H11C5 H11C6 TYPICAL APPLICATIONS 10A, T L COMPATIBLE, SOLID STATE RELAY Use of the H11C4 for high sensitiv- ity, 5300 V isolation capability, provides this highly reliable solid state relay design. This design is compatible with 74, 74S and 74H series T 2L logic systems inputs and 120V AC (H11C1, H11C2, H11C3) or 220V AC (H11C4, H11C5, H11C6) loads up to 10A. 25W, LOGIC INDICATOR LAMP DRIVER The high surge capability and non-reactive input characteris- tics of the H11C allow it to directly couple, without buffers, T 2L and DTL logic to indicator alarm devices, without danger of introducing noise and logic glitches. 200V/400V SYMMETRICAL TRANSISTOR COUPLER Use of the high voltage PNP portion of the H11C provides a 400V transistor capable of conducting positive and negative signals with current transfer ratios of over 1%. This function is useful in remote instrumentation, high voltage power supplies and test equipment. Care should be taken not to exceed the H11C 400mW power dissipation rating when used at high voltages. +5V 470 Ω "COIL" H11CX 56K 100 Ω 47 Ω 47 Ω SC146D 0.1 µF LOAD "CONTACT"

120 VAC (H11C1, H11C2, H11C3)

220 VAC (H11C4, H11C5, H11C6)

IN5060 (4) +5V 56K 470 Ω H11CX 0.1 µF 100 Ω INPUT INDICATOR LAMP OUTPUTINPUT H11CX Fig. 8 Coupled dv/dt - Test Circuit tp H11C4 Vp H EXPONENTIAL OSCILLOSCOPE 10 KΩ RAMP GEN. 100 Ω +100 VAC Vp = 800 Volts tp = .010 Seconds f = 25 Hertz TA = 25 °C dv / dt .63 VpVp

3/19/03Page 8 of 11© 2003 Fairchild Semiconductor Corporation PHOTO SCR OPTOCOUPLERS H11C1 H11C2 H11C3 H11C4 H11C5 H11C6 Package Dimensions (Through Hole) Package Dimensions (Surface Mount) Package Dimensions (0.4” Lead Spacing) Recommended Pad Layout for Surface Mount Leadform 0.100 (2.54) TYP 0.020 (0.51) MIN 0.350 (8.89) 0.330 (8.38) 0.270 (6.86) 0.240 (6.10) PIN 1 ID. 0.022 (0.56) 0.016 (0.41) 0.070 (1.78) 0.045 (1.14) 0.200 (5.08) 0.115 (2.92) 0.300 (7.62) TYP0° to 15° 0.154 (3.90) 0.100 (2.54) SEATING PLANE 0.016 (0.40) 0.008 (0.20) Lead Coplanarity : 0.004 (0.10) MAX 0.270 (6.86) 0.240 (6.10) 0.350 (8.89) 0.330 (8.38) 0.300 (7.62) TYP 0.405 (10.30) MAX 0.315 (8.00) MIN 0.016 (0.40) MIN PIN 1 ID. 0.016 (0.41) 0.008 (0.20) 0.100 (2.54) TYP 0.022 (0.56) 0.016 (0.41) 0.070 (1.78) 0.045 (1.14) 0.200 (5.08) 0.165 (4.18) 0.020 (0.51) MIN SEATING PLANE 0.016 (0.40) 0.008 (0.20) 0.070 (1.78) 0.045 (1.14) 0.350 (8.89) 0.330 (8.38) 0.154 (3.90) 0.100 (2.54) 0.200 (5.08) 0.135 (3.43) 0.004 (0.10) MIN 0.270 (6.86) 0.240 (6.10) 0.400 (10.16) TYP 0.016 (0.41) 0.100 (2.54) TYP 0.070 (1.78) 0.060 (1.52) 0.030 (0.76) 0.100 (2.54) 0.295 (7.49) 0.415 (10.54) Note All dimensions are in inches (millimeters)

3/19/03Page 9 of 11© 2003 Fairchild Semiconductor Corporation PHOTO SCR OPTOCOUPLERS H11C1 H11C2 H11C3 H11C4 H11C5 H11C6

ORDERING INFORMATION

Option Order Entry Identifier Description S. S Surface Mount Lead Bend SD .SD Surface Mount; Tape and Reel W. W 0.4" Lead Spacing 300 .300 VDE 0884 300W .300W VDE 0884, 0.4" Lead Spacing 3S .3S VDE 0884, Surface Mount 3SD .3SD VDE 0884, Surface Mount, Tape and Reel H11C1 V XX YY K 43 5 Definitions 1F airchild logo 2D evice number

3 VDE mark (Note: Only appears on parts ordered with VDE

option – See order entry table) 4T wo digit year code, e.g., ‘03’ 5T wo digit work week ranging from ‘01’ to ‘53’

6 Assembly package code

3/19/03Page 10 of 11© 2003 Fairchild Semiconductor Corporation PHOTO SCR OPTOCOUPLERS H11C1 H11C2 H11C3 H11C4 H11C5 H11C6 NOTE All dimensions are in inches (millimeters) Reflow Profile (Black Package, No Suffix) Carrier Tape Specifications 4.0 ± 0.1 Ø 1.55 ± 0.05 User Direction of Feed 4.0 ± 0.1 1.75 ± 0.10 7.5 ± 0.1 16.0 ± 0.3 12.0 ± 0.1 0.30 ± 0.05 13.2 ± 0.2 4.85 ± 0.20 0.1 MAX 10.30 ± 0.20 9.55 ± 0.20 Ø 1.6 ± 0.1

• Peak reflow temperature: 225° C (package surface temperature)
• Time of temperature higher than 183° C for 60–150 seconds
• One time soldering reflow is recommended 215°C, 10–30 s

225 C peak

Time (Minute) 300 250 200 150 100 Temperature (°C) Time above 183° C, 60–150 sec Ramp up = 3 C/sec

FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. 3/19/03Page 11 of 11© 2003 Fairchild Semiconductor Corporation PHOTO SCR OPTOCOUPLERS H11C1 H11C2 H11C3 H11C4 H11C5 H11C6