H11B815300W

H11B815300W FAIRCHILD | Alldatasheet

Document overview

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Technical content

Features

Current Transfer Ratio: 600% minimum (at I F = 1 mA) High isolation voltage between input and output (5300 VRMS) UL recognized (File # E90700)

Applications

Telephone/Telegraph Line Receiver Twisted Pair Line Receiver Digital Logic/Digital Logic PackageS chematic 3E MITTER COLLECTORANODE CATHODE

www.fairchildsemi.com H11B815 Rev. 1.0.1 H11B815 4-Pin Photodarlington Optocoupler Absolute Maximum Ratings (No derating required up to 85°C)

Electrical Characteristics

A = 25°C Unless otherwise specified.) Individual Component Characteristics Parameter Symbol Value Units TOTAL DEVICE Storage Temperature T STG -55 to +150 °C Operating Temperature T OPR -55 to +100 °C Lead Solder Temperature T SOL 260 for 10 sec °C Total Device Power Dissipation @ T A = 25°C P D 250 mW EMITTER DC/Average Forward Input Current I F 50 mA Reverse Input Voltage V R Forward Current - Peak (1µs pulse, 300pps) I F (pk) 1 A LED Power Dissipation @ T A = 25°C P D 70 mW Derate above 25°C 1.33 mW/°C DETECTOR Collector-Emitter Voltage V CEO 35 V Emitter-Collector Voltage V ECO Continuous Collector Current I C 80 mA Detector Power Dissipation @ T A = 25°C P D 150 mW Derate above 25°C 2.0 mW/°C Parameter Test Conditions Symbol Min Typ** Max Unit EMITTER Input Forward Voltage (I F = 20 mA) V F 1.2 1.50 V Reverse Leakage Current (V R = 6.0 V) I R 0.001 10 µA DETECTOR Collector-Emitter Breakdown Voltage (I C = 1.0 mA, I F = 0) BV CEO 35 60 V Emitter-Collector Breakdown Voltage (I E = 100 µA, I F = 0) BV ECO 68 V Collector-Emitter Dark Current (V CE = 10 V, I F = 0) I CEO 0.005 1 µA Capacitance (V CE = 0 V, f = 1 MHz) C CE 8p F

www.fairchildsemi.com H11B815 Rev. 1.0.1 H11B815 4-Pin Photodarlington Optocoupler Transfer Characteristics Isolation Characteristics All typicals at TA = 25°C DC Characteristic Test Conditions Symbol Min Typ Max Units Current Transfer Ratio, Collector-Emitter (I F = 1 mA, V CE = 2 V) CTR 600 7,500 % Saturation Voltage (I F = 20 mA, I C = 5 mA) V CE(sat) 0.8 1.0 V Rise Time (non saturated) (I C = 10 mA, V CE = 2 V, R L = 100V) t r 300 µs Fall Time (non saturated) (I C = 10 mA, V CE = 2 V, R L = 100V) t f 250 µs Characteristic Test Conditions Symbol Min Typ** Max Units Input-Output Isolation Voltage (I I-O [ 1 µA, 1 min.) V ISO

5000 Vac(rms)

Isolation Resistance (V I-O = 500 VDC) R ISO Ω Isolation Capacitance (V I-O = &, f = 1 MHz) C ISO 0.5 pf

www.fairchildsemi.com H11B815 Rev. 1.0.1 H11B815 4-Pin Photodarlington Optocoupler Fig. 1 Normalized Current Transfer Ratio vs. Forward Current Fig. 2 Normalized Current Transfer Ratio vs. Ambient Temperature Fig. 4 Collector-Emitter Dark Current vs. Ambient Temperature IF - FORWARD CURRENT (mA) 0.1 1 10 NORMALIZED CURRE NT TRANSFER RATIO - CTR 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 VCE = 2 V NORMALIZED TO IF = 1 mA TA - AMBIENT TEMPERATURE (˚C) TA - AMBIENT TEMPERATURE (˚C) -55 -25 0 25 50 75 100NORMALIZED CURRENT TRAN SFER RATIO - CTR ICEO - CO LLECTOR-E MITTER DARK CURRENT (nA) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 IF = 1 mA, VCE = 2 V NORMALIZED TO TA = 25˚C Fig. 3 Normalized Collector Current vs. Collector Emitter Voltage VCE - COLLECTOR-EMITTER VOLTAGE (V) 01234 5 IC - NORMALIZED COLLECTOR CURRENT 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 IF = 0.5 mA 1 mA 2 mA 5 mA 10 mA NORMALIZED TO IF =1 mA, VCE = 2 V 02 0 4 06 08 0 100 0.1 100 1000 10000 100000 VCE = 10 V Fig. 5 LED Forward Voltage vs. Forward Current IF - LED FORWARD CURRENT (mA) 11 0 100 V F - FORWARD VOLTA GE (V) 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 TA = 55˚C TA = 25˚C TA = 100˚C Typical Performance Curves

www.fairchildsemi.com H11B815 Rev. 1.0.1 H11B815 4-Pin Photodarlington Optocoupler Recommended Thermal Reflow Profile for Surface Mount DIP Package Temperature (°C) 250 200 150 100 01 2 345 Time (Min) 220°C: 10 sec to 40 sec Time > 183°C: 120 sec to 180 sec 225°C

www.fairchildsemi.com H11B815 Rev. 1.0.1 H11B815 4-Pin Photodarlington Optocoupler NOTE All dimensions are in inches (millimeters) Package Dimensions (Through Hole) Package Dimensions (0.4" Lead Spacing) SEATING PLANE 0.190 (4.83) 0.175 (4.45) 0.200 (5.08) 0.115 (2.92) 0.100 (2.54) TYP 0.154 (3.90) 0.120 (3.05) 0.270 (6.86) 0.250 (6.35) 0.270 (6.86) 0.250 (6.35) 0.020 (0.51) MIN 0.300 (7.62) typ 15° 0.016 (0.40) 0.008 (0.20) SEATING PLAN E 0.400 (10.16) TYP 0 to 15° 0.270 (6.86) 0.250 (6.35) 0.190 (4.83) 0.175 (4.45) 0.100 (2.54) TYP 0.154 (3.90) MIN 0.200 (5.08) 0.115 (2.92) 0.270 (6.86) 0.250 (6.35) 0.016 (0.40) 0.008 (0.20) 0.070 (1.78) 0.060 (1.52) 0.030 (0.76) 0.295 (7.49) 0.415 (10.54) 0.100 (2.54) SEATIN G PLANE 0.190 (4.83) 0.175 (4.45) 0.200 (5.08) 0.115 (2.92) 0.020 (0.51) MIN 0.070 (1.78) 0.045 (1.14) 0.100 (2.54) TYP 0.022 (0.56) 0.016 (0.41) 0.405 (10.30) MAX 0.315 (8.00) MIN 0.300 (7.62) TYP 0.016 (0.40) 0.008 (0.20) 0.270 (6.86) 0.250 (6.35) Lead Coplanarity 0.004 (0.10) MAX Package Dimensions (Surface Mount) PCB Footprint Layout

www.fairchildsemi.com H11B815 Rev. 1.0.1 H11B815 4-Pin Photodarlington Optocoupler

Ordering Information

Option Order Entry Identifier Description S. S Surface Mount Lead Bend SD .SD Surface Mount; Tape and reel W. W 0.4" Lead Spacing 300 .300 VDE 0884 300W .300W VDE 0884, 0.4" Lead Spacing 3S .3S VDE 0884, Surface Mount 3SD .3SD VDE 0884, Surface Mount, Tape & Reel Definitions 1F airchild logo 2D evice number

3 VDE mark (Note: Only appears on parts ordered with VDE

option – See order entry table)

4 One digit year code

5T wo digit work week ranging from ‘01’ to ‘53’

6 Assembly package code

www.fairchildsemi.com H11B815 Rev. 1.0.1 H11B815 4-Pin Photodarlington Optocoupler NOTE All dimensions are in millimeters Carrier Tape Specifications 4.0 ± 0.1 Ø1.55 ± 0.05 User Direction of Feed 4.0 ± 0.1 1.75 ± 0.10 7.5 ± 0.1 16.0 ± 0.3 12.0 ± 0.1 0.30 ± 0.05 13.2 ± 0.2 5.00 ± 0.20 4.95 ± 0.20

www.fairchildsemi.com H11B815 Rev. 1.0.1 H11B815 4-Pin Photodarlington Optocoupler DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY , FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status Definition Advance Information Preliminary No Identification Needed Obsolete This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Formative or In Design First Production Full Production Not In Production ISOPLANAR™ LittleFET™ MICROCOUPLER™ MicroFET™ MicroPak™ MICROWIRE™ MSX™ MSXPro™ OCX™ OCXPro™ OPTOLOGIC OPTOPLANAR™ PACMAN™ POP™ Power247™ PowerEdge™ FAST FASTr™ FPS™ FRFET™ GlobalOptoisolator™ GTO™ HiSeC™ I 2C™ i-Lo™ ImpliedDisconnect™ IntelliMAX™ Rev. I16 ACEx™ ActiveArray™ Bottomless™ Build it Now™ CoolFET™ CROSSVOLT™ DOME™ EcoSPARK™ E 2CMOS™ EnSigna™ FACT™ FACT Quiet Series™ PowerSaver™ PowerTrench QFET QS™ QT Optoelectronics™ Quiet Series™ RapidConfigure™ RapidConnect™ µSerDes™ SILENT SWITCHER SMART START™ SPM™ Stealth™ SuperFET™ SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 SyncFET™ TinyLogic TINYOPTO™ TruTranslation™ UHC™ UltraFET UniFET™ VCX™ Wire™ Across the board. Around the world.™ The Power Franchise  Programmable Active Droop™