H11B815 FAIRCHILD | Alldatasheet

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Technical content

© 2002 Fairchild Semiconductor Corporation H11B815

DESCRIPTION

The H11B815 consists of a gallium arsenide infrared emitting diode driving a silicon Darlington phototransistor in a 4-pin dual in-line package.

FEATURES

  • Compact 4-pin package
  • Current Transfer Ratio: 600% minimum (at I F = 1 mA)
  • High isolation voltage between input and output (5300 VRMS)
  • UL recognized (File # E90700)

APPLICATIONS

  • P ower Supply Monitors
  • Relay Contact Monitor
  • T elephone/Telegraph Line Receiver
  • T wisted Pair Line Receiver
  • Digital Logic/Digital Logic 3E MITTER COLLECTORANODE CATHODE

© 2002 Fairchild Semiconductor Corporation 4-PIN PHOTODARLINGTON OPTOCOUPLER H11B815 ABSOLUTE MAXIMUM RATINGS (No derating required up to 85°C) Parameter Symbol Value Units TOTAL DEVICE Storage Temperature T STG -55 to +150 °C Operating Temperature T OPR -55 to +100 °C Lead Solder Temperature T SOL 260 for 10 sec °C Total Device Power Dissipation @ T A = 25°C P D 250 mW EMITTER DC/Average Forward Input Current I F 80 mA Reverse Input Voltage V R Forward Current - Peak (1µs pulse, 300pps) I F (pk) 1A LED Power Dissipation @ T A = 25°C P D 140 mW Derate above 25°C 1.33 mW/°C DETECTOR Collector-Emitter Voltage V CEO 35 V Emitter-Collector Voltage V ECO Continuous Collector Current I C 200 mA Detector Power Dissipation @ T A = 25°C P D 200 mW Derate above 25°C 2.0 mW/°C

ELECTRICAL CHARACTERISTICS

A = 25°C Unless otherwise specified.) INDIVIDUAL COMPONENT CHARACTERISTICS Parameter Test Conditions Symbol Min Typ** Max Unit EMITTER Input Forward Voltage (I F = 20 mA) V F 1.2 1.50 V Reverse Leakage Current (V R = 6.0 V) I R 0.001 10 µA DETECTOR Collector-Emitter Breakdown Voltage (I C = 1.0 mA, I F = 0) BV CEO 35 60 V Emitter-Collector Breakdown Voltage (I E = 100 µA, I F = 0) BV ECO 68 V Collector-Emitter Dark Current (V CE = 10 V, I F = 0) I CEO 0.005 1 µA Capacitance (V CE = 0 V, f = 1 MHz) C CE 8p F

© 2002 Fairchild Semiconductor Corporation 4-PIN PHOTODARLINGTON OPTOCOUPLER H11B815 All typicals at TA = 25°C TRANSFER CHARACTERISTICS DC Characteristic Test Conditions Symbol Min Typ Max Units Current Transfer Ratio, Collector-Emitter (I F = 1 mA, V CE = 2 V) CTR 600 7,500 % Saturation Voltage (I F = 20 mA, I C = 5 mA) V CE(sat) 0.8 1.0 V Rise Time (non saturated) (I C = 10 mA, V CE = 2 V, R L = 100V) t r 300 µs Fall Time (non saturated) (I C = 10 mA, V CE = 2 V, R L = 100V) t f 250 µs ISOLATION CHARACTERISTICS Characteristic Test Conditions Symbol Min Typ** Max Units Input-Output Isolation Voltage (I I-O [ 1 µA, 1 min.) V ISO

5300 Vac(rms)

Isolation Resistance (V I-O = 500 VDC) R ISO Ω Isolation Capacitance (V I-O = &, f = 1 MHz) C ISO 0.5 pf

© 2002 Fairchild Semiconductor Corporation 4-PIN PHOTODARLINGTON OPTOCOUPLER H11B815 Fig. 1 Normalized Current Transfer Ratio vs. Forward Current Fig. 2 Normalized Current Transfer Ratio vs. Ambient Temperature Fig. 4 Collector-Emitter Dark Current vs. Ambient Temperature IF - FORWARD CURRENT (mA) 0.1 1 10 NOR MALIZED CURRE NT TRAN SFER R ATIO - CTR 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 VCE = 2 V NORMALIZED TO IF = 1 mA TA - AMBIENT TEMPERATURE (˚C) TA - AMBIENT TEMPERATURE (˚C) -55 -25 0 25 50 75 100NORMALIZED CURRE NT TRAN SFER R ATI O - CTR ICEO - CO LLECTOR-E MITTER D AR K CURR ENT ( nA) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 IF = 1 mA, VCE = 2 V NORMALIZED TO TA = 25˚C Fig. 3 Normalized Collector Current vs. Collector Emitter Voltage VCE - COLLECTOR-EMITTER VOLTAGE (V) 01234 5 IC - NOR MALIZED CO LLECTOR C URRENT 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 IF = 0.5 mA 1 mA 2 mA 5 mA 10 mA NORMALIZED TO IF =1 mA, VCE = 2 V 02 0 4 06 08 0 100 0.1 100 1000 10000 100000 VCE = 10 V Fig. 5 LED Forward Voltage vs. Forward Current IF - LED FORWARD CURRENT (mA) 11 0 100 V F - FORW ARD VOLTA GE ( 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 TA = 55˚C TA = 25˚C TA = 100˚C Typical Performance Curves

© 2002 Fairchild Semiconductor Corporation 4-PIN PHOTODARLINGTON OPTOCOUPLER H11B815 Recommended Thermal Reflow Profile for Surface Mount DIP Package Temperature (°C) 250 200 150 100 01 2 345 Time (Min) 220°C: 10 sec to 40 sec Time > 183°C: 120 sec to 180 sec 225°C

© 2002 Fairchild Semiconductor Corporation 4-PIN PHOTODARLINGTON OPTOCOUPLER H11B815 NOTE All dimensions are in inches (millimeters) Package Dimensions (Through Hole) Package Dimensions (0.4" Lead Spacing) PCB Footprint Layout SEATING PLANE 0.190 (4.83) 0.175 (4.45) 0.200 (5.08) 0.115 (2.92) 0.100 (2.54) TYP 0.154 (3.90) 0.120 (3.05) 0.270 (6.86) 0.250 (6.35) 0.270 (6.86) 0.250 (6.35) 0.020 (0.51) MIN 0.300 (7.62) typ 15° 0.016 (0.40) 0.008 (0.20) SEATING PLANE 0.400 (10.16) TYP 0 to 15° 0.270 (6.86) 0.250 (6.35) 0.190 (4.83) 0.175 (4.45) 0.100 (2.54) TYP 0.154 (3.90) MIN 0.200 (5.08) 0.115 (2.92) 0.270 (6.86) 0.250 (6.35) 0.016 (0.40) 0.008 (0.20) 0.070 (1.78) 0.060 (1.52) 0.030 (0.76) 0.295 (7.49) 0.415 (10.54) 0.100 (2.54) SEATIN G PLANE 0.190 (4.83) 0.175 (4.45) 0.200 (5.08) 0.115 (2.92) 0.020 (0.51) MIN 0.070 (1.78) 0.045 (1.14) 0.100 (2.54) TYP 0.022 (0.56) 0.016 (0.41) 0.405 (10.30) MAX 0.315 (8.00) MIN 0.300 (7.62) TYP 0.016 (0.40) 0.008 (0.20) 0.270 (6.86) 0.250 (6.35) Lead Coplanarity 0.004 (0.10) MAX Package Dimensions (Surface Mount)

© 2002 Fairchild Semiconductor Corporation 4-PIN PHOTODARLINGTON OPTOCOUPLER H11B815

ORDERING INFORMATION

Option Order Entry Identifier Description S. S Surface Mount Lead Bend SD .SD Surface Mount; Tape and reel W. W 0.4" Lead Spacing 300 .300 VDE 0884 300W .300W VDE 0884, 0.4" Lead Spacing 3S .3S VDE 0884, Surface Mount 3SD .3SD VDE 0884, Surface Mount, Tape & Reel Definitions 1F airchild logo 2D evice number

3 VDE mark (Note: Only appears on parts ordered with VDE

option – See order entry table)

4 One digit year code

5T wo digit work week ranging from ‘01’ to ‘53’

6 Assembly package code

© 2002 Fairchild Semiconductor Corporation 4-PIN PHOTODARLINGTON OPTOCOUPLER H11B815 NOTE All dimensions are in millimeters Carrier Tape Specifications 4.0 ± 0.1 Ø1.55 ± 0.05 User Direction of Feed 4.0 ± 0.1 1.75 ± 0.10 7.5 ± 0.1 16.0 ± 0.3 12.0 ± 0.1 0.30 ± 0.05 13.2 ± 0.2 5.00 ± 0.20 4.95 ± 0.20

FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. 3/26/03 Page 9 of 9 © 2002 Fairchild Semiconductor Corporation 4-PIN PHOTODARLINGTON OPTOCOUPLER H11B815