GPA1601_09 TSC | Alldatasheet

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Technical content

Features

— Cases: TO-220AC Molded plastic — Epoxy: UL 94V-O rate flame retardant — Green compound with suffix "G" on packing code & prefix "G" on datecode. — High temperature soldering guaranteed: 260oC/10 seconds .16"(4.06mm) from case. — Terminal : Pure tin plated, lead free, solderable per MIL-STD-202, Method 208 guaranteed Maximum Instantaneous Forward Voltage @ 16.0A Maximum DC Reverse Current @ TA=25℃ at Rated DC Blocking Voltage @ TA=125℃ Type Number Maximum Recurrent Peak Reverse Voltage — Weight: 2.24 gram Peak Forward Surge Current, 8.3 ms Single Half Sine- wave Superimposed on Rated Load (JEDEC method ) Typical Junction Capacitance (Note 1) Typical Thermal Resistance (Note 2) Operating Temperature Range — Polarity: As marked 1.1 100 Dimensions in inches and (millimeters) Storage Temperature Range 16.0 250 250 2.0 -65 to +150 -65 to +150 C09

臺 灣 半 導 體 股 份 有 限 公 司 Taiwan Semiconductor Co. LTD DATA Sheet History 變 更 記 錄 表 Part No : GPA1601 – GPA1607 日 期 Date 版 本 Version 變 更 內 容 Revised description 變 更 原因 Revised Reason Dec. 21/06 A Initial Issue May. 26/09 B Modify G1 Dimensions according to QPCN9001. ** 本文件之著作權及營業機密內容屬於台半公司,非經許可不得翻印 ** (QWS58280A)