GP2W0118YP0F

GP2W0118YP0F ETC2 | Alldatasheet

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: 7 ED-04G044. GP2WO118YPOF . . May 10, 2004 Product name : OPTICAL DATA COMMUNICATION TRANSCEIVER < Model No. :_ GP2W0118YPOF 1.._ These specification sheets include materials protected under copyright of Sharp Corporation ("Sharp"). Please do not reproduce or cause anyone to reproduce them without Sharp's consent. 2. When using this product, please observe the absolute maximum ratings and the instructions for use outlined in these specification sheets, as well as the precautions mentioned below. Sharp assumes no responsibility . for any damage resulting from use of the product which does not comply with the absolute maximum ratings ‘ and the instructions included in these specification sheets, and the precautions mentioned below, (Precautions) . : (1) This product is designed for use in the following application areas ; -OAequipment Audio visual equipment — - Home appliances ~ »Telecommunication equipment (Terminal) .. - Measuring equipment : -Tooling machines — - Computers Tf the use of the product in the above application areas is for equipment listed in paragraphs (2) or (3); please be sure to observe the precautions given in those respective paragraphs. (2) Appropriate measures; such as fail-safe design and redundant design considering the safety design of the overall system and equipment, should be taken to ensure reliability and safety when this product is used for equipment which demands high reliability and safety in function and precision, such as ; . - Transportation control and safety equipment (aircraft, train, automobile etc.) -. + Traffic signals - Gas leakage sensor breakers _- Rescue and security equipment + Other safety equipment ‘ (3) Please do not use this product for equipment which require extremely high reliability and safety in function and precision, such as ; + Space equipment —_- Telecommunication equipment (for trunk lines) 7 - Nuclear power control equipment — - Medical equipment (4) Please contact and consult with a Sharp sales representative if there are any questions regarding interpretation of the above three paragraphs, : 3, Please contact and consult with a Sharp sales representative for any questions about this product. .

May 10, 2004 1. Application This specification applies to the outline and characteristics of IDA1.2 type (Data rate 2,4kbps to 115.2kbps, Low Power Option compliant) Optical Data communication transceiver, Model No, GP2W0118YPOF. 2. Outline Refer to the attached drawing No. CY12349i02, page 6. 3. Ratings and characteristics Refer to the attached sheet, page 7 to 9. . 4, Reliability Refer to the attached sheet, page 10. 5. Outgoing inspection Refer to the attached sheet, page 11. 6. Supplements . . 1) This optical data communication transceiver is satisfied with each characteristics of item 3,3, in the optical system shown 2) This product is built-in photodiode, 3) This device confirms eye safety TEC60825-1 class 1. 4) This product shall not contain the following materials. . Also, the following materials shall not be used in the production process for this product. Materials for ODS: CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform) Specific brominated flame retardants (PBBOs, PBBs) 5) This product is Pb free, : : 6) Productmass: Approx. 0,07g 1 7) Package specifications: Refer to the attached sheet, page 13 to 17, 8) This product does not contain the chemical materials regulated by RoHS. Materials for RoHS : Lead and lead compound, Cadmium and cadmium compound, Mercury and mercury compound, * Hexavalent chromium compound, Polybrominated biphenyls, Polybrominated diphenyl ethers 7. Notes 1) - Ifthe surface of detector is smeared with dust or dirt, it may cause-faulty operation. Caution shall be taken to-avoid this. “= And do not touch the detector'surface. , 2) Cleaning conditions : Solvent cleaning : Solvent temperature 45°C or less, Immersion for 3 min or less Ultrasonic cleaning: The effect to device by ultrasonic cleaning differs by cleaning bath size, ultrasonic power output, cleanirig time, PCB size or device mounting condition etc. Please test it in actual using condition and confirm that doesn't occur any defect before starting the ultrasonic cleaning, The cleaning shall be carried out with solvent below, Solvent: | Ethyl alcohol, Methyl alcohol, Isopropyl alcohol 3) Inorder to prevent electrostatic discharge of integrated circuit, human body and soldering iron, etc. shall be grounded. 4) Incase that things touch to the device after mounting, such external force is applied to the device, there is possibility to be caused the mounting defect such as terminal coming off. Please be careful for handling. 5) Don’t do wiring in the territory where a mounting side touches the back of the product except . for the product terminal part. , . 6) Precautions for Soldering Refer to the attached, page 12.

' ED-04G044 GP2W0118YPOF ‘ May: 10, 2004 7) When the system (program) is designed, the Turn Around Time shall be designed by considering 500 z s or more that is specified . by IrDA. Then, this Turn Around Time means the time when this device does not temporarily defect the signal light, since the transmitted light from the transceiver reaches the detector side of the same transceiver. 8) Asitis necessary 200 s or more (at Ta=25°C, no input signal) to return from shut-down mode to ready-operation mode, please consider this point at the system (program) designing. Also, please confirm thoroughly the operation in accrual application. 9) When there is much external disturbing light or the light source is located near this transceiver and the detector face receives » much external disturbing light, there is a case that the pulse other than signal output is generated as noise on output terminal. of this transceiver. “Please consider the lay-out and structure to reduce disturbing light on the detector face. 10) Incase that this sensor is adopted in IR communication system, please use it according to the signal method which is specified by [Serial Infrared Physical Layer Link Specification Version 1.3] published by the Infrared Data Association. Faulty operation may happen, if different signal method than specified one is used. 11) RXD pin out remains at High level output (pull up output) in shutdown mode. 12) Incircuit designing, make allowance for the degradation of the light emitting diode output that results . . from long continuous operation. (50% degradation/ 5 years) 13) Recommended external circuit eS C) (Note) Please choose the most suitable CX | according to the noise level: ; and noise frequency of power supply. . Depend on noise level and noise frequency _— - of power supply, CX does not work well. 1 anne 7 ‘There are cases that some pulse noises Vee sp] Rxp| TxD/LEDA SGND from RXD other than signal will occur in certain communication area. Please check by finish product that there are no problem RK at all communication area and data rate. : If there are any problem, please check : cx 7 : by inserting RX (1 to 15Q) , in the circuit drawing, Veco GND sp RXD TxD * RXD Equipment circuit * 10 Logic table mY — [sp | txp__[Lep RXD Ray “me High | on | — | Not Valid Hy Low fy, jon | Low __| _ | No Signal [on | off | High _| ; |_High | Dont Care | off | Don't Care [oft | oft | pull-up |

; 4/7 ED-04G044 GP2WO118YPOF : May 10, 2004 14) Example of system + CX LEDA Veo @ ® Encoder circuit © der circui UART \\apawo118yPOy . , > : ®@ RXD) re <2! Decoder circuit ° sD Gnpd Shut down mode co 15) Example of signal waveform , ' 1 ( \\ { ——— ee | ( “ 1 ] { i i @® Transmitting data waveform . \\ 0 1 0) 1 , ® Encoder circuit output waveform | “yr i’ i : | \\ ! | | , © Transmitter output optical signal waveform \\ ! i i i i ! i ® GP2WOLL8YPOF receiver output wave form | ' \\ \\ i ( i ® Receiving data waveform te fos Lo fe | i i i i ‘ T= —— Data rate Data rate: 2.4kbps, — 9.6kbps 19.2kbps, 38.4kbps 57.6kbps, 115.2kbps

: s/\\7 : ED-04G044 GP2WO118YPOF : May 10, 2004 16) Foot pattern of PCB . ‘ * (1) Dimension are shown for reference, . (2) Unit: mm : Center of mounting area | ~ ; oq ant , be @ 4 ®@/0|6 | Pin | Pin namo Vee 4e8 (@[Groma GND ees Receiver Data Output | RXD__| . . [| baie Da pw TXD | Shield Ground * Connect foot pattern of shield case to GND pattern, , 17) i ‘Recommendable size of solder creamed paste (Reference) : - Q Please open the solder mask as below so that the size of solder creamed paste for this device before reflow soldering must be as large as one of the foot pattern land indicated at 16). . . at . a 9 ae a BAGG ae a IA AWA ; 0.475 1.425 2.375 (Z Soldering paste area 3X Dimension are shown for reference, . . Unit: mm

: 6/7 ED-04G044 GP2WO118YPOF ' May 10, 2004 eu ! ! yy footes) fom) . . +4 H Te) — a : . lau) . | a | \\ . 7.9402 5 7.240.2 oJ a 4 3 lr ; I | Ss 2 an Cl dl a —o Om), MOEA a a Center of detector Center of emitter . ; | | Ht < fou 2-0.5_ D. lo le lo |e .le O's : PO.95XS=4.75 *A.: Distance between PCB of the transociver S SS = 1 and bottom side of the shield case I ; : shall be less than 0.1mm for both up Oh, | » [ and downward direction 1 TAAAIZA ra [Pin [Pinname | Symbol_| 6=0.64 0.15 x P0.95X5=4,75 ° | © | Gromd | - 1) area : Au plating, . | @ | ReceiverData Ouspnt | RXD__| 9) Unspecified tolerance shallbe -+0.2. : | © | TronsmiterData input | TD _| 3) Adhesion of resin to the terminal area shall be allowed Max. 0.2mm. |° ~ 4) Therim of the shield case (3 marked area) should not protrude fiom the PCB, MATERIAL FINISH GP2WO118YPOF i A Terminal :Cu Herminal: Ni(MIN.37 MAX, 20s) [Outline dimension i Shield case:Fe Au(MIN.O. 14m, MAX.1 Ou m) — TW, ry ~ 7 Package:Epoxy resin _ [stielé case:SnCu(MIN.2am,MAX.12¢m) IpRaWING No. /GIY]1 slate io

; IAT . ED-04G044 GP2WOLI8YPOF May 10, 2004 3. Ratings and characteristics 3.1 Absolute maximum ratings . . HSppivelige | Ve [woo pvp SSCS [LED Suply vege | Vin | 0wn0 dt v| | Peakforwardoument | nw [| mA | Pale width: 78.145, Dutyrao 316 | | Operaiingtemperauwe | Top | 40ionss CP [Stwagetempeatue | Tag _| owas} Sd Soldering reflow time : 10s 3.2 Recommended operating conditions . [Suppiveiage SCV [2036 | VP [LED Supplyvoltage | Vis | 2060 |v | Operating temperature | Topr | 2toiss | [Daarate | BR | to tt52 | bps | 33. Electrical characteristics (Unless otherwise specified Topr=-25°C, Vec=3,3V) MIN. ae at no input signal Output terminal OPEN gece P= [ee [li at Shut-down mode Output terminal OPEN . ihe oupatlage | Vow Wada] ~ 7] =| VPlar200y A Vax2.0~ 360 93 | [Lowleveloupuvatigs | Var_| ~ [= [048 | V[la=200HA,Vor20¥036V 312.3 | OpF |Falltime | te | Te 006 Yas | [Maximum eon danse [Lf at | - | - | om —— BR=I15.2kbps, @ S15" 3K1,2,3 Cptiratowe [Eo |_| =| Wont | win PR" [Rewierlansy [a [= | | | ws | FResivervakowine [tw [=| | 200-| ns [Nein [Rising | Pp 08 [ae | [Falie ef 06 [a | FFekenision vg Ay [350 a0 | 900" om | [Miva oc pue with [tee 20 [~~ 300 | ns | XDpnamskigh |

: 8/17 ED-04G044 GP2WOLI8YPOF . May 10, 2004 <1 Input signal waveform ° (Detector side) , Tl Tl : T2 Y Radiation intensity of transmitter 3.6mW/sr Pheasant Lin Ie AtBR= 24kbps: TI=416.7 us, T2=78.1 1s \\ At BR=115.2kbps: T1=8,68 jz s, T2=1.63 ns 3X2 Output waveform specification (Detector side) . ; if tt totot : ‘ yy rs ne a —— Vo, ; 3X3. Standard optical system (Detector side)

4 Ee : Detector face illuminance < 10lx

a : GP2WOLI8YPOF * 1 Transmitter cH Oscilloscope L 7 6; Indicates horizontal and vertical direction *] Transmitter shall use GP2WO18YPOF (A p=870nm TYP) which is adjusted the radiation intensity at3,6mW/sr, :

; 9/17 . ED-04G044 GP2WO118YPOF May 10, 2004 3X4 Output waveform specification (Emitter side) . . : som po ; \\ ; 1% H ion a . 3X5 Standard optical system (Emitter side) : ; Detector for . GP2wollsypor <——4 $ | | radiation intensity . measuring ~ ~ wnat nen fntinwantter @ + Indicates horizontal and vertical directions . . 3X6 Recommended circuit (Emitter side) Veo=3.3V O : Virm=3.3V s| TXD © GP2WOLISYPOF | Vy. Tx=2.8V ; BR=I152kbps i,

: . 10/17 ED-04G044 GP2WOL18YPOF ‘ May 10, 2004 4. Reliability The reliability of products shall satisfy items listed below. Confidence level : 90% . LTPD : 10 or 20 Test Items Test Conditions Failure Judgement Samples 0) 7 : Criteria Defective(C) L cycle -40°C to +85°C * Temperature cycling GOmin) (G0min) 1-22, 0-0 20 cycles test . ° * High temp, and high : By humidity storage +40°C, 90%RH, 240h n=22, o=0 * a 425°C, Voc=LEDA=33V, 240h Ip <LowX0.8 _ Operation life Pulse width 78.1 15, Duty ratio 3/16 I, >Up X12 wll, oO . 1000m/s*, 6ms Mechanical shock 3 times/“EX, -EY, +Z direction n=l1, c=0 200nv/s", Us: Upper specification limit Variable frequency vibration | 100 to2000 to 100Hz/Approx, for4min, | Low: Lower specification limit | y=11, C= 48min/ X, Y, Z direction : 260°C, 10s, 2times Reflow solder heat Regarding temperature profile, n=I1,c=0 Refer to attached soldering notes. : In the test *mark above, the sample to be tested shall be left at normal temperature and humidity for 2h after it is taken out of the chamber. (No dew point) . ; . . 1

: 1/7 ED-04G044 GP2WO118YPOF . May 10, 2004 5. Outgoing inspection (1) Inspection lot o Inspection shall be carried out per each delivery lot. (2) Inspection method . . Asingle sampling plan, normal inspection level II based on ISO 2859 shall be adopted. . Inspection items and test method AQU(%) : Major defect 2 Inverse polarity on terminal. ° ol 3 Soldering defect . . 4 — Electrical characteristic defect in parameter 3,3, 1 Appearance defect : . Split, Chip, Scratch, One which affects the characteristics Stain, Blur of parameter 3.3 shall be defect.

, ; . 3 DAT ED-04G044 GP2WO118YPOF . : May 10, 2004 Precautions for Soldering , ; 1, Incase of solder reflow Please carry out only two times soldering at the temperature and the time within the temperature profile as shown , in the figure below. Reflow interval shall be within three days under conditions, 10 to 30°C, 70%RH or less, MAX 260 os 220 : | ae iil| on 1500 / | ; MAX 120s MAX 60s! 2. Other precautions An infrared lamp used to heat up for soldering may cause a localized temperature rise in the resin. So keep the package temperature within that specified in Item 1. Also avoid immersing the resin part in the solder. Even if within the temperature profile above, there is the possibility that the gold wire in package is broken in caso that the deformation of PCB gives the affection to lead pins. Please use after confirmation the conditions fully by actual solder reflow machine. . 3. Soldering , + Soldering iron shall be less than 25W, and temperature of point of soldering iron shall use at less than 300°C, + Soldering time shall be within 5s, ; + Soldered product shall treat at normal temperature.

, : 13/17 . . ED-04G044 GP2WOLI8YPOF May 10, 2004 Taping specifications 1. Application ° This packing specification sheets specify the taping specifications for GP2W0118Y POF. 2. Taping method 2-1. Taping material Cot es SD . ; 2-2, Tape structure and Dimensions (Refer to the attached sheet, page 15.) . The tape shall have a structure in which a cover tape is sealed heat-pressed on the carrier tape of conductive PC, 2-3. Reel structure and Dimensions (Refer to the attached sheet, page 16.) , ‘The taping reel shall be conductive PPE with its dimensions as shown in the attached drawing. 2-4, Direction of product insertion (Refer to the attached sheet, page 16.) Product direction in carrier tape shall be that electrode side of product places on the pull-out side of the tape and lens side of product places on the cover tape side, » 2-5, The way to repair taped failure devices ‘The way to repair taped failure devices cut a bottom of carrier tape with a cutter, and afier replacing to good devices, . the cutting portion shall be sealed with adhesive tape. In this case, device will not be refilled. 3. Adhesiveness of cover tape The exfoliation force between carrier tape and cover tape shall be 0,2N to IN for the angle from 160° to 180° . ss Rolling method and quantity ays we 4 . . Wind the tape back on the reel so that the cover tape will be outside the tape. Attach more than 20cm of blank tape to the trailer and the leader of the tape and fix the both ends with adhesive tape. One reel shall contain 2000pes, except for the item 2-5 above. Continuous lack of components more than 2 shall not be acceptable. ‘ 5. Safety protection during shipping , Thete shall'be no deformation of component or degradation of electrical characteristics due to shipping.

; 14/17 . ED-04G044 GP2WOIL8YPOF May 10, 2004 Taping moisture-proof packing, 1. Application : This packing specification sheets apply to the moist-proof packing for the GP2W0118YPOF in the taping package. 2. Packaging specifications :

2.1 Packaging material :

: ; 2.2 Packaging method , . (1) Seal the aluminum laminated bag that contains tape reel (contains 2,000 devices per reel) and siccative. (2) Fill necessary information to the label and paste it on the aluminum laminate bag, (3) Pack 4 aluminum laminated bags (contains | reel each) into the designated packing case, where paper pads are placed on the bottom and top of the packing case, as well as each layer of the aluminum laminated bags, Minimum order/shipment q'ty should be 1 laminated bag. . (4) The packing case would be then sealed with the craft tape, with indication of model name quantity, and outgoing inspection date on the case. (Total of 8,000pcs. per carton) * Except for the case that device is removed: " 3. Storage and Treatment after Unsealed : fe cuney byecgy 5 3:1 Storage conditions The delivered produict should be stored with the conditions shown below; Storage temperature : 10 to 30°C . . Humidity : below 70%RH . ‘The warranty term for the shipped product shall be for | year after shipping to the designated place by the ordered customer.

3.2 Treatment after open '

(1) After unsealed, devices should be mounted under the temperature condition of 10 to 30°C, at the humidity condition of below 70%RH, within 3 days. - Q In case that long term storage is needed, devices should either be stored in dry box, or re-sealed to moist-proof bag with siccative and leave them in the environment where the temperature is 10 to 30°C, at the humidity condition of below 70%RH, Devices must be mounted within 2 weeks. .

33 Baking before mounting

In the event that the devices are not maintained in the storage conditions described above, or the enclosed siccative indicator already turned its color to pink, baking must be applied before devices are to be mounted. ‘The case that GP2WO0118YPS was not mounted under the temperature condition of 10 to 30°C, at humidity condition of 70%RH or lower within 3 days after Ist time reflow , baking process must be applied before 2nd time reflow.: Please also note that baking should only be applied once, Recommended condition : 100 to 110°C, 12 to 24 hours 3X Baking will not properly done in packing condition. To complete the baking properly, devices should either be temporary mounted to PCB with adhesive, or placed to the metal tray. . (The temporary mounting shall not be done by soldering, but by adhesive etc.) . .

: ED-04G044 GP2WO0118YPOF May 10, 2004 2-1, Tape structure and Dimensions . i F E D : G J I . Ci )—-)- QO C5 |_| i i i i 7 7 i i . i 1 1 1 i i H Ly i _ Pom en oe o- - | 1 i} L i 1 : ! ' ! . | i i I 1 . K 16.0 75 175 8.0 2.0 40 ENE Eee ols | 82 032 23 22 ols

, 16/17 ED-04G044 GP2WOLL8YPOF ' May 10, 2004 2-2. Reel structure and Dimensions f ; © [> eS | {= : “Check word poe foe fee Pa tee Tie fie | [mm | ssa | i7ssio | too | soa | aos | s24s10 2-3. Direction of product insertion : Paull-out direction [ eA Oo 0 0 0 Y Label :

; : 1717 ED-04G044 GP2WOLL8YPOF May 10,2004. ; Pads (Total Ssheets) Product in tape-reel . Indicator ‘ . Tape-reel in aluminum an ——— Siccative 4 . Jaminated bag or Total 4 sets) Aluminum Me : Son ° laminated bag Label Date Model No. . Tape-reel in aluminum Packing case Label Quantity laminated bag Date nose : FA > é a’ > - ‘Model No. * 329 laa . Package method . (1) Seal the aluminum laminated bag included the tape reel with 2000pes. and siccative, (2) Fillup the model name, quantity etc. in the blank of label and paste on the bag. (3) Put the four moisture-proof laminated bag in the ruled case. Put the pad between the bags, and top and bottom. (4) The case seals with kraft tape, and indicate model No., quantity and date. (8000pes/package) : Total packaged mass: Approx 3.3kg Name GP2WO118YPOF Packing specification