GM850-RPF-H610E

GM850-RPF-Q670E DFI | Alldatasheet

Document overview

• Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
• PDF pages: 4

Technical content

1 DP++(CPU), 1 DP++(MXM), 1 USB Type C(DP

Alt-mode), 1 eDP(MXM), 1 internal HDMI(MXM) AI Accelerated Support MXM GPU module (up to 125W) Reliable Data Security Jurisdiction BIOS, RSA & Hash Verification Design for Gaming system

• Retain NVRAM Data for 5 Years during AC off
• 8 Intrusion Detection, 32 x DIDO, 8 x Meter, iButton x1, cctalk x2

www.dfi.com SPECIFICATION Model Name GM850-RPF-Q670E GM850-RPF-H610E SYSTEM Processor 14th Generation Intel LGA 1700 Socket Processors, TDP support up to 65W Intel Core™ I9-14900 (24 Cores, 36M Cache, up to 5.8 GHz); 65W Intel Core™ I9-14900T (24 Cores, 36M Cache, up to 5.5 GHz); 35W Intel Core™ I7-14700 (20 Cores, 33M Cache, up to 5.4 GHz); 65W Intel Core™ I7-14700T (20 Cores, 33M Cache, up to 5.2 GHz); 35W Intel Core™ I5-14500 (14 Cores, 24M Cache, up to 5.0 GHz); 65W Intel Core™ I5-14500T (14 Cores, 24M Cache, up to 4.8 GHz); 35W Intel Core™ I5-14400 (10 Cores, 20M Cache, up to 4.7 GHz); 65W Intel Core™ I5-14400T (10 Cores, 20M Cache, up to 4.5 GHz); 35W Intel Core™ I3-14100 (4 Cores, 12M Cache, up to 4.7 GHz); 60W Intel Core™ I3-14100T (4 Cores, 12M Cache, up to 4.4 GHz); 35W Intel 300 (2 Cores,6M Cache, 3.9 GHz); 46W Intel 300T (2 Cores, 4M Cache, 3.4 GHz); 35W 13th Generation Intel LGA 1700 Socket Processors, TDP support up to 65W Intel Core™ I9-13900E (24 Cores, 36M Cache, up to 5.2 GHz); 65W Intel Core™ I9-13900TE (24 Cores, 36M Cache, up to 5.0 GHz); 35W Intel Core™ I7-13700E (16 Cores, 30M Cache, up to 5.1 GHz); 65W Intel Core™ I7-13700TE (16 Cores, 30M Cache, up to 4.8 GHz); 35W Intel Core™ I7-13700T (16 Cores, 30M Cache, up to 4.9 GHz); 35W Intel Core™ I5-13500E (14 Cores, 24M Cache, up to 4.6 GHz); 65W Intel Core™ I5-13500TE (14 Cores, 24M Cache, up to 4.5 GHz); 35W Intel Core™ I5-13500T (14 Cores, 24M Cache, up to 4.6 GHz); 35W Intel Core™ I5-13400E (10 Cores, 20M Cache, up to 4.6 GHz); 65W Intel Core™ I3-13100E (4 Cores, 12M Cache, up to 3.3 GHz); 60W Intel Core™ I3-13100TE (4 Cores, 12M Cache, up to 4.1 GHz); 35W Intel Core™ I3-13100T (4 Cores, 12M Cache, up to 4.2 GHz); 35W 12th Generation Intel LGA 1700 Socket Processors, TDP support up to 65W Intel Core™ i9-12900E (16 Cores, 30M Cache, up to 5.0 GHz); 65W Intel Core™ i9-12900TE (16 Cores, 30M Cache, up to 4.8 GHz); 35W Intel Core™ i7-12700E (12 Cores, 25M Cache, up to 4.8 GHz); 65W Intel Core™ i7-12700TE (12 Cores, 25M Cache, up to 4.6 GHz); 35W Intel Core™ i5-12500E (6 Cores, 18M Cache, up to 4.5 GHz); 65W Intel Core™ i5-12500TE (6 Cores, 18M Cache, up to 4.3 GHz); 35W Intel Core™ i3-12100E (4 Cores, 12M Cache, up to 4.2 GHz); 60W Intel Core™ i3-12100TE (4 Cores, 12M Cache, up to 4.0 GHz); 35W Intel Pentium G7400E (2 Cores, 6M Cache, 3.6 GHz); 46W Intel Pentium G7400TE (2 Cores, 6M Cache, 3.0 GHz); 35W Intel Celeron G6900E (2 Cores, 4M Cache, 3.0 GHz); 46W Intel Celeron G6900TE (2 Cores, 4M Cache, 2.4 GHz); 35W Chipset Intel Q670E Chipset Intel H610E Chipset Memory 2x 260-pin SODIMM up to 64GB Dual Channel DDR5 4800MHz 2x 260-pin SODIMM up to 64GB Dual Channel DDR5 4800MHz BIOS AMI SPI 256Mbit AMI SPI 256Mbit GRAPHICS Controller Intel HD Gen 9 Graphics Intel HD Gen 9 Graphics Feature OpenGL 4.5, DirectX 12, OpenCL 2.1 HW Decode: AVC/H.264, MPEG2, VC1/ WMV9, JPEG/MJPEG, HEVC/H265, VP8, VP9 HW Encode: MPEG2, AVC/H264, JPEG, HEVC/H265, VP8, VP9 OpenGL 4.5, DirectX 12, OpenCL 2.1 HW Decode: AVC/H.264, MPEG2, VC1/ WMV9, JPEG/MJPEG, HEVC/H265, VP8, VP9 HW Encode: MPEG2, AVC/H264, JPEG, HEVC/H265, VP8, VP9 Display 1 x DP++ (CPU): Resolution up to 4096x2304 @ 60Hz 1 x DP++ (MXM): Resolution by MXM 1 x USB Type C: DP Alt-mode, Resolution up to 4096x2304 @60Hz 1 x eDP(MXM): Resolution by MXM 1 x Internal HDMI: Resolution by MXM 1 x DP++ (CPU): Resolution up to 4096x2304 @ 60Hz 1 x DP++ (MXM): Resolution by MXM 1 x USB Type C: DP Alt-mode, Resolution up to 4096x2304 @60Hz 1 x eDP(MXM): Resolution by MXM 1 x Internal HDMI: Resolution by MXM Multiple Displays 1 DP++(CPU) + 1 DP++(MXM) +

1 USB Type C(DP Alt-mode) + 1 eDP(MXM) +

1 internal HDMI(MXM)

1 DP++(CPU) + 1 DP++(MXM) +

1 internal HDMI(MXM) STORAGE Interface 1 x SATA 3.0 1 x 2.5” SSD Bay 1 x SATA 3.0 1 x 2.5” SSD Bay EXPANSION Interface 1 x M.2 2280 M Key (PCIE Gen3x4, SATA3) 1 x M.2 2230 E Key (PCIE Gen3x, USB 2.0, support Intel CNVi) 1 x MXM Type-A/B/B+ (up to 125W) 1 x M.2 2242/3042/3052 B Key (PCIE Gen3x1, USB 3.2 Gen2, USB 2.0) 1 x M.2 2280 M Key (PCIE Gen3x4, SATA3) 1 x M.2 2230 E Key (PCIE Gen3x, USB 2.0, support Intel CNVi) 1 x MXM Type-A/B/B+ (up to 125W) 1 x M.2 2242/3042/3052 B Key (PCIE Gen3x1, USB 3.2 Gen1, USB 2.0) AUDIO Audio Codec Realtek ALC888S Realtek ALC888S ETHERNET Controller 1 x Intel I226LM(vPro) (10/100/1000/2500Mbps) 1 x Intel I226V (10/100/1000/2500Mbps) 1 x Intel I219V (10/100/1000/2500Mbps) 1 x Intel I226V (10/100/1000/2500Mbps) LED Indicators 1 x Power LED 1 x HDD LED 1 x Power LED 1 x HDD LED

www.dfi.com SPECIFICATION Model Name GM850-RPF-Q670E GM850-RPF-H610E I/O Ethernet 2 x 2.5GHz RJ45 2 x 2.5GHz RJ45 Serial 2 x RS-232/422/485 (DB-9) 2 x RS-232 (TX,RX)/ccTalk (Microfit) 2 x RS-232/422/485 (DB-9) 2 x RS-232 (TX,RX)/ccTalk (Microfit) USB 4 x USB 3.2 Gen2 or 3 x USB 3.2 Gen2 + 1 x USB Type C 2 x USB 3.2 Gen2 + 2 x USB 2.0 or 2 x USB 3.2 Gen2 + 1 x USB Type C Display 1 x DP++ 1 x DP++(MXM) 1 x HDMI (MXM) 1 x USB Type C 1 x DP++ 1 x DP++(MXM) 1 x HDMI (MXM) 1 x USB Type C Audio 1 Audio Jack (Line-out/Mic-in) 1 Audio Jack (Line-out/Mic-in) Cooling 1 x 8cm System Fan, with replaceable air filter 1 x 8cm System Fan, with replaceable air filter WATCHDOG TIMER Output & Interval System Reset, Programmable via Software from 1 to 255 Seconds System Reset, Programmable via Software from 1 to 255 Seconds GAMING Intrusion Detection 8 x Intrusion detection Operates With and Without AC Power Logs Date/ Time of latest 64 events Coin Battery backup to Retain Data for 5 years during AC off 8 x Intrusion detection Operates With and Without AC Power Logs Date/ Time of latest 64 events Coin Battery backup to Retain Data for 5 years during AC off NVRAM Supports up to 16Mbyte Coin Battery backup to Retain Data for 5 years during AC off Support Battery voltage monitoring & Warn- ing Supports up to 16Mbyte Coin Battery backup to Retain Data for 5 years during AC off Support Battery voltage monitoring & Warn- ing DI/DO 32-bit Digital Input 32-bit OC output (29-bit x 500mA, disconnect detection up to 8 meters; 3-bit x 3A) 32-bit Digital Input 32-bit OC output (29-bit x 500mA, disconnect detection up to 8 meters; 3-bit x 3A) iButton Support iButton 1-wire protocol Support iButton 1-wire protocol SECURITY TPM TPM 2.0 TPM 2.0 POWER Type 19~24V DC IN 19~24V DC IN Connector 4-pin Terminal or 4P ATX straight PWR conn 4-pin Terminal or 4P ATX straight PWR conn OS SUPPORT Microsoft Windows IoT Enterprise 10 L TSB Windows 11 IoT Enterprise(64-bit)_23H2 Windows IoT Enterprise 10 L TSB Windows 11 IoT Enterprise(64-bit)_23H2 Linux Linux Ubuntu 20.04 Linux Ubuntu 20.04 Software Supplied with gaming function SDK Supplied with gaming function SDK ENVIRONMENT Operating Temperature 0~45°C 0~45°C Storage Temperature -20~85°C -20~85°C Relative Humidity 5%~90% 5%~90% MECHANISM Mounting Wall Mount Wall Mount Dimensions (W x H x D) 230 x 140 x 240 mm 230 x 140 x 240 mm Weight 3.1 kg 3.1 kg STANDARDS AND CERTIFICATIONS Shock Operation: IEC 60068-2-27 Test Ea: Shock test Half-sine, 3G @ 11ms, 18 Shock ±X, ±Y, ±Z (each axis 3 times) Non-Operation: IEC 60068-2-27 Test Ea: Shock test Half-sine, 5G @ 11ms, 18 Shock ±X, ±Y, ±Z (each axis 3 times) Operation: IEC 60068-2-27 Test Ea: Shock test Half-sine, 3G @ 11ms, 18 Shock ±X, ±Y, ±Z (each axis 3 times) Non-Operation: IEC 60068-2-27 Test Ea: Shock test Half-sine, 5G @ 11ms, 18 Shock ±X, ±Y, ±Z (each axis 3 times) Vibration Operation: IEC 60068-2-64 Test Fh: Vibration Board-Band Random Test Random,1Grms @ 5~500 Hz, 30min. Non-Operation: IEC 60068-2-6 Test Fc: Vibration Sinusoidal Test Sweep sine, 2Grms @ 10~500Hz, 30min. Operation: IEC 60068-2-64 Test Fh: Vibration Board-Band Random Test Random,1Grms @ 5~500 Hz, 30min. Non-Operation: IEC 60068-2-6 Test Fc: Vibration Sinusoidal Test Sweep sine, 2Grms @ 10~500Hz, 30min. Certifications CE, FCC class A (ongoing) CE, FCC class A (ongoing)

www.dfi.com DFI reserves the right to change the specifications at any time prior to the product's release. Changes thereafter will be based on the product's revision. Please contact your sales representative for the exact revision offered in your area. All product names mentioned are trademarks of their respective companies. © October 31, 2024 DFI Inc. Optional Items Part Number Description MXM Quadro T1000 612-M3T100-100G 50W, 896 CUDA Cores, 2.6 TFLOPS, 0~55°C MXM Quadro RTX A500 612-M3A500-000G 35W, 2048 CUDA Cores, 6.54 TFLOPS, 0~55°C MXM Quadro RTX A1000 612-M3A100-000G 60W, 2048 CUDA Cores, 6.66 TFLOPS, 0~55°C MXM Quadro RTX A2000 612-M3A200-000G 60W, 2560 CUDA Cores, 8.64 TFLOPS, 0~55°C MXM Quadro RTX3000 612-M3T300-000G 80W, 1920 CUDA Cores, 5.3 TFLOPS, 0~55°C MXM Quadro RTX A4500 612-M3A450-000G 115W, 5888 CUDA Cores, 17.66 TFLOPS, 0~55°C MXM Cooler A71-110100-000G MXM cooler for RTX3000 87x106.35x34mm MXM Cooler TBD MXM cooler for T1000 73x60x32.1mm OPTIONAL ITEMS