GM310-8MM DFI | Alldatasheet
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Technical content
NXP i.MX 8M mini applications processors Gaming Embedded SystemGM310-8MM KEY FEATURES High Security Reliable Data Security (RSA key, SHA256, TPM 2.0) Data Sustaining ARM-Based System NVRAM 256KB and retain data at least 1 Years during AC off Support Yocto Linux 2.5 Rich I/O Connectivity 2 GbE, 2 COM, 3 USB 2.0, 1 Line out, 1 uSD
www.dfi.com DFI reserves the right to change the specifications at any time prior to the product's release. Changes thereafter will be based on the product's revision. Please contact your sales representative for the exact revision offered in your area. All product names mentioned are trademarks of their respective companies. © October 10, 2024 DFI Inc. SPECIFICATION SYSTEM Processor NXP i.MX 8M mini applications processors NXP i.MX 8M mini Quad Cortex-A53 1.8GHz (Commercial) Memory 1GB Memory Down (up to 4GB) Single Channel LPDDR4 GRAPHICS Controller 2D-GC320 3D-GC NanoUL TRA Feature OpenGL ES 2.1 VPU Decode: 1080p60 HEVC, H.264, VP9, VP8 VPU Encode: 1080p60 H.264, VP8 Display 1 x LVDS (HDMI by request) Resolution supports up to 1920 x 1080 @60Hz STORAGE Interface Support eMMC 5.1 8GB on board EXPANSION Interface 1 x Mini-PCIe Support Full/Half Size Wifi + BT / L TE AUDIO Audio Codec Cirrus Logic WM8524 ETHERNET Controller 1 x RTL8111 Ethernet (10/100/1000Mbps) LED Indicators 1 x Status LED I/O Ethernet 2 x GbE (RJ-45) Serial 1 x RS-232/422/485 (Header) 1 x RS-232 (Header) USB 2 x USB 2.0 1 x USB 2.0 (Right Angle) Display 1 x LVDS (HDMI by request) Audio 1 x Header (Line-out) Cooling Fanless GAMING NVRAM 256KB Coin Battery backup to Retain Data for 2 years during AC off DI/DO 4-bit Digital Input 4-bit Digital output SECURITY TPM TPM 2.0 POWER Type 12V DC IN Connector 4-pin Micro-Fit header OS SUPPORT Linux Linux Yocto 2.5 (Kernel 4.14.98) ENVIRONMENT Operating Temperature -5~60°C Storage Temperature -20~85°C Relative Humidity 5%~90% MECHANISM Mounting Wall Mount Dimensions (W x H x D) 143mm x 100 mm x 35 mm Weight 0.45 kg STANDARDS AND CERTIFICATIONS Shock Operation: IEC 60068-2-27 Test Ea: Shock test Half-sine, 3G @ 11ms, 18 Shock ±X, ±Y, ±Z (each axis 3 times) Non-Operation: IEC 60068-2-27 Test Ea: Shock test Half-sine, 5G @ 11ms, 18 Shock ±X, ±Y, ±Z (each axis 3 times) Vibration Operation: IEC 60068-2-64 Test Fh: Vibration Board-Band Random Test Random,1Grms @ 5~500 Hz, 30min. Non-Operation: IEC 60068-2-6 Test Fc: Vibration Sinusoidal Test Sweep sine, 2Grms @ 10~500Hz, 30min. Certifications CE, FCC class A (ongoing)