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AVX GiGUARD ESD PROTECTION DIODES CUTTING EDGE MINIATURE LEADLESS TVS DIODES FOR ESD PROTECTION OF HIGH SPEED SIGNAL LINES Version 17.2

GiGuard - ESD Protection for High Speed Circuits AVX Bi-directional Leadless Transient Voltage Suppressor Diodes Provide ESD Protection for High Speed Communication and Data Lines GENERAL DESCRIPTION Utilizing the latest in TVS Technology combined with a unique leadless package, the new GiGuard series of ESD Suppression Diodes offers Clamping Voltages below 12v and cap values as low as 0.3pfd. This combination of excellence both protects sensitive ICs during ESD events and preserves the integrity of the protected high speed signals. The AVX GG series fits perfectly onto the same PCB solder pads as standard EIA 0201/0402 components. The GG series complies with IEC 61000-4-2(ESD), Level 4+ (±20kV air, ±20kV contact discharge), IEC 61000-4-4 (electrical fast transient -EFT) (20A, 5/50 ns), very fast charged device model (CDM) ESD and cable discharge event (CDE).

APPLICATIONS

  • USB 2.0/3.0
  • Tablets/Cell Phones Touch Screens
  • Network Communications
  • Gigabyte Ethernet
  • High Def Multimedia Interface (HDMI)
  • Mobile Phone Touchscreen

FEATURES

  • Low Capacitance (.3pF to 17pF typ)
  • Low Vc (<12v @ 1a)
  • Bi-Directional protection
  • Leadless 0201/0402 case size
  • 125ºC Operating Temp/ 150ºC Storage 0201 Case Size 0201 0402 GG Series Voltage Rating 05 = 5V 100 Nominal Cap 0R3 = 0.3pF 2R5 = 2.5pF 5R0 = 5.0pF 100 = 10pF 170 = 17pF N Cap Tolerance 4 = ±2pF C = ±.25pF N = ±30% Packaging 2 = 7" Reel 0201 = 15K/Reel 0402 = 10K/Reel P Finish P = 100% Tin HOW TO ORDER CIRCUIT DIAGRAM

ELECTRICAL CHARACTERISTICS

Vrwm Cnom Cap (pF) Vbr IL P pp Ipp Vair Vcon Vd8k Vd Vdip AVX Part Number (V) (pF) Min Max Min (V) (µa) (W) (A) (KV) KV) (@8KV) (@Ipp=1a) (@Ipp) (V) (V) (V) GG020105100N2P 5 10 7 13 5.5 <0.1 60 6 ±20 ±20 ≤12 ≤8 ≤12 GG0402055R042P 5 5 3 7 5.2 <0.1 60 4 ±15 ±15 ≤15 ≤12 ≤16 GG040205100N2P 5 10 7 13 5.5 <0.1 96 8 ±25 ±25 ≤12 ≤8 ≤12 GG040205170N2P 5 17 11.9 22 5.1 <0.1 80 8 ±30 ±30 ≤12 ≤6.5 ≤10 Characteristic Test Description Symbol Units Nominal Reverse Working Voltage V wrm V Reverse Min. Breakdown Voltage @ 1ma V br V Reverse Leakage Current @Vwrm IL ua Peak Pulse Power (tp=8x20us) P pp W Peak Pulse Current (tp=8x20us) I pp A ESD Rating - Air (150pf, 330Ω network) V air KV ESD Rating - Contact (150pf, 330Ω network) V con KV Characteristic Test Description Symbol Units Max Clamp Voltage @ Ipp = 16a V d16 V Max ESD Clamp Voltage @ 8KV V d8k V Max Clamp Voltage @ Ipp = 1a V d V Max Clamp Voltage @ Ipp V dip V Nominal Capacitance (Vr=0v, f=1Mhz) C nom pF Allowable Capacitance Range Cap (pF min-max

GiGuard - ESD Protection for High Speed Circuits Characteristic Curves - Typical GG020105100N2P (10PF) GG0402050R3C2P (0.3PF)

GG0402055R042P (5.0PF) GiGuard - ESD Protection for High Speed Circuits Characteristic Curves - Typical GG0402052R542P (2.5PF)

GG040205170N2P (17PF) GiGuard - ESD Protection for High Speed Circuits Characteristic Curves - Typical GGS040205100N2P (10PF)

B D A C A GiGuard - ESD Protection for High Speed Circuits TEMPERATURE DERATING DIMENSIONS RECOMMENDED REFLOW SOLDER PAD L W T t Size Length (L) Width (W) Thick (T) Termination (t) mm (inches) Size A B C D mm (inches) RECOMMENDED SOLDER REFLOW PROFILES Recommended Reflow Profiles Time / secs Component Temperature / ºC 100 125 150 175 200 225 250 275 0 20 40 60 80 100 120 140 160 180 200 220 240 260 280 300 320 340 360 380 400 420 Pb Free Recommended Pb Free Max with care Sn Pb Recommended Hand Soldering Cautions In hand soldering of the Devices. Large temperature gradient between preheated the Devices and the tip of soldering iron may cause electrical failures and mechanical damages such as cracking or breaking of the devices. The soldering shall be carefully controlled and carried out so that the temperature gradient is kept minimum with following recommended conditions for hand soldering. RECOMMENDED SOLDERING CONDITION 1 (1) Solder: 0.12~0.18mm Thread solder (Sn96.5:Ag3.5) with soldering flux in the core Rosin-based and non-activated flux is recommended. (2) Preheating: The Devices shall be preheated so that Temperature Gradient between the devices and the tip of soldering iron is 150℃ or below. (3) Soldering Iron: Rated Power of 20w max with 3mm soldering tip in diameter. Temperature of soldering iron tip 300ºCmax, 3-5sec (The required amount of solder shall be melted in advance on the soldering tip.) (4) Cooling: After soldering. The Devices shall be cooled gradually at room ambient temperature. RECOMMENDED SOLDERING CONDITION 2 – WITHOUT PREHEATING (1) Temperature of soldering iron tip 300℃max, 3-5sec. (2) Solder iron tip shall not directly touch to Devices. (3) Solder iron tip shall be fully preheated before soldering while soldering iron tip to the external electrode of Devices.

GiGuard - ESD Protection for High Speed Circuits PACKAGING SPECIFICATION REEL DIMENSIONS

  • Carrier tape and transparent cover tape should be heat-sealed to carry the products, and the reel should be used to reel the carrier tape.
  • The adhesion of the heat-sealed cover tape shall be 25~60 grams with nominal of 40 grams.
  • Both the head and the end portion of the taping shall be empty for reel package and SMT auto-pickup machine. And a normal paper tape shall be connected in the head of taping for the operator to handle. mm (inches) Case A 0 B0 K0 D PP 2 P0 WE F -0.05 (0.002) mm (inches) Reel Size A B C D E W W 1

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