GFP5045TC SMCDIODE | Alldatasheet

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Features

MaximumRatings(limiting values,at25 °Cunless otherwisespecified) Characteristics Symbol Condition Max. Units PeakRepetitiveReverseVoltage WorkingPeakReverseVoltage DCBlockingVoltage VRRM VRWM VR - 45 V AverageRectifiedForwardCurrent IF(AV) Tc=111°C,InDC 50 A PeakOneCycleNon-RepetitiveSurge Current IFSM 8.3ms,halfSinepulse 450 A ElectricalCharacteristics(Ta=25℃ Unlessotherwisespecified) Characteristics Symbol Condition Typ. Max. Units ForwardVoltageDrop* VF1 @50A,Pulse,TJ =25C 0.46 0.52 V ReverseCurrent* IR1 @VR =ratedVR TJ =25C 0.05 0.50 mA JunctionCapacitance CT @VR =5V,TC =25C fSIG =1MHz 8.5 - nF  Lowthermalresistance  Lowerforwardvoltagedrop,lowpowerloss  IsolatePackagedesign,idealforheatdispersion  Highforwardcurrentcapability  Excellentanti-humidity  TrenchMOSSchottkytechnology  Lowprofilepackage  Highforwardsurgecapability  AllSMCpartsaretraceabletothewaferlot  Additionalelectricalandlifetestingcanbeperformed uponrequest  Case:GFP  Hightemperaturesolderingguaranteed  Heated-toolwelding260℃,10seconds  MarkingCode:GFP5045TC GFP

DataSheetN2656.Draft.  China - Germany - Korea - Singapore - UnitedStates  http://www.smc-diodes.com - sales@smc-diodes.com -2- GFP5045TC Characteristics Symbol Condition Specification Units JunctionTemperatureINDCForward Mode,withoutreversebias,t≤1h TJ - -55to+200 C StorageTemperature Tstg - -55to+150 C TypicalThermalResistanceJunctionto Case RJC - 1.5 C/W Thermal-MechanicalSpecifications(Ta=25℃ Unlessotherwisespecified) RatingsandCharacteristicsCurves

DataSheetN2656.Draft.  China - Germany - Korea - Singapore - UnitedStates  http://www.smc-diodes.com - sales@smc-diodes.com -3- GFP5045TC SolderblockSpecification Thecompositionof thetinblockisSn50Pb50. Thesizeofthetin blockis 9(-0.3)*4(-0.2)*1(±0.1) mm. Solderblock tobecentered,notexceedtheflatgroove. OrderingInformation MarkingDiagram Device Package Shipping GFP5045TC GFP 36pcs/Tube OrderP/N Terminals Additional GFP5045TC-S1 TinPlated None GFP5045TC-S2 TinPlated SolderPaste GFP5045TC-S3 TinPlated SolderBlock Where XXXXX isYYWWL GFP5045TC =DeviceCode YY =Year WW =Week L = Lot Number SolderBlock SolderPaste

DataSheetN2656.Draft.  China - Germany - Korea - Singapore - UnitedStates  http://www.smc-diodes.com - sales@smc-diodes.com -4- GFP5045TC MechanicalDimensionsGFP (Millimeters) Symbol Dimensionsinmillimeters Min. Typical Max A 38.2 38.4 B 33.85 34 34.15 C 34.75 34.9 35.05 D 22.98 E 13.9 14 F 17 17.1 G 12.4 12.5 H 10.08 10.23 10.38 I 8.5 8.6 J 5.5 5.6 5.7 K 2.3 2.4 L 4-∅ 1.9 M 0.78 0.8 0.82

DataSheetN2656.Draft.  China - Germany - Korea - Singapore - UnitedStates  http://www.smc-diodes.com - sales@smc-diodes.com -5- GFP5045TC DISCLAIMER: 1-Theinformationgivenherein,includingthespecificationsanddimensions,issubjecttochangewithoutpriornoticetoimproveproduct characteristics.Beforeordering,purchasersareadvisedtocontacttheSMCDiodeSolutionssalesdepartmentforthelatestversionofthe datasheet(s). 2-Incaseswhereextremelyhighreliabilityisrequired(suchasuseinnuclearpowercontrol,aerospaceandaviation,trafficequipment, medicalequipment,andsafetyequipment),safetyshouldbeensuredbyusingsemiconductordevicesthatfeatureassuredsafetyorby meansofusers’fail-safeprecautionsorotherarrangement. 3-InnoeventshallSMCDiodeSolutionsbeliableforanydamagesthatmayresultfromanaccidentoranyothercauseduring operationof theuser’sunitsaccordingtothedatasheet(s).SMCDiodeSolutionassumesnoresponsibilityforanyintellectualpropertyclaimsoranyother problemsthatmayresultfromapplicationsofinformation,productsorcircuitsdescribedinthedatasheets. 4-InnoeventshallSMCDiodeSolutionsbeliableforanyfailureinasemiconductordeviceoranysecondarydamageresultingfromuseata valueexceedingtheabsolutemaximumrating. 5-Nolicenseisgrantedbythedatasheet(s)underanypatentsorotherrightsofanythirdpartyorSMCDiodeSolutions. 6-Thedatasheet(s)maynotbereproducedorduplicated,inanyform,inwholeorpart,withouttheexpressedwrittenpermissionofSMC DiodeSolutions. 7-Theproducts(technologies)describedinthedatasheet(s)arenottobeprovidedtoanypartywhosepurposeintheirapplicationwillhinder maintenanceofinternationalpeaceandsafetynoraretheytobeappliedtothatpurposebytheirdirectpurchasersoranythirdparty.When exportingtheseproducts(technologies),thenecessaryproceduresaretobetakeninaccordancewithrelatedlawsandregulations..