STGF19NC60HD STMICROELECTRONICS | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 14
Technical content
Datasheet sections
- 1 Electrical ratings
- 2 Electrical characteristics
- 2.1 Electrical characteristics (curves)
- 3 Test circuit
- 4 Package mechanical data
- 5 Revision history
N-channel 600V - 9A - TO-220FP Very fast PowerMESH™ IGBT General features ■ Low on-voltage drop (Vcesat) ■ Low CRES / CIES ratio (no cross-conduction susceptbility) ■ Very soft ultra fast recovery antiparallel diode
Description
Using the latest high voltage technology based on a patented strip layout, STMicroelectronics has designed an advanced family of IGBTs, the PowerMESH™ IGBTs, with outstanding performances. The suffix "H" identifies a family optimized for high frequency applications in order to achieve very high switching performances (reduced tfall) mantaining a low voltage drop.
Applications
■ High frequency motor controls ■ SMPS and PFC in both hard switch and resonant topologies ■ Motor drivers Internal schematic diagram Type VCES VCE(sat) (max)@25°C IC @100°C STGF19NC60HD 600V < 2.5V 9A TO-220FP Order codes Part number Marking Package Packaging STGF19NC60HD GF19NC60HD TO-220FP Tube
1 Electrical ratings
Table 1. Absolute maximum ratings
- Calculated according to the iterative formula:
Table 2. Thermal resistance
2 Electrical characteristics
Table 3. Static Table 4. Dynamic
2.1 Electrical characterist ics (curves)
Figure 1. Output characteristics Figure 2. Transfer characteristics Figure 3. Transconductance Figure 4. Collector-emitter on voltage vs Figure 5. Gate charge vs gate-source voltage Figure 6. Capacitance variations
3 Test circuit
Figure 16. Test circuit for inductive load Figure 17. Gate charge test circuit Figure 18. Switching waveform Figure 19. Diode recovery time waveform
4 Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com
A B D E H G F 123F2 L4L5 DIM. mm. inch A 4.4 4.6 0.173 0.181 B 2.5 2.7 0.098 0.106 D 2.5 2.75 0.098 0.108 E 0.45 0.7 0.017 0.027 F 0.75 1 0.030 0.039 F1 1.15 1.7 0.045 0.067 F2 1.15 1.7 0.045 0.067 G 4.95 5.2 0.195 0.204 G1 2.4 2.7 0.094 0.106 H 10 10.4 0.393 0.409 L2 16 0.630 L3 28.6 30.6 1.126 1.204 L4 9.8 10.6 .0385 0.417 L5 2.9 3.6 0.114 0.141 L6 15.9 16.4 0.626 0.645 L7 9 9.3 0.354 0.366 Ø 3 3.2 0.118 0.126 TO-220FP MECHANICAL DATA
5 Revision history
Table 8. Revision history 05-Aug-2006 1 Initial release.