STGF10NB60SD_06 STMICROELECTRONICS | Alldatasheet

Document overview

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  • PDF pages: 13

Technical content

Datasheet sections

  • 1 Electrical ratings
  • 2 Electrical characteristics
  • 2.1 Electrical characteristics (curves)
  • 3 Test circuit
  • 4 Package mechanical data
  • 5 Revision history

N-channel 10A - 600V - TO-220FP PowerMESH™ IGBT General features ■ Hight input impedance (voltage driven) ■ Low on-voltage drop ■ High current capability ■ Co-packaged with turboswitch™ antiparallel diode

Description

Using the latest high voltage technology based on a patented strip layout, STMicroelectronics has designed an advanced family of IGBTs, the PowerMESH™ IGBTs, with outstanding performances. The suffix “S” identifies a family optimized achieve minimum on-voltage drop for low frequency applications (<1kHz).

Applications

■ Light dimmer ■ Static relays ■ Motor control Internal schematic diagram Type V CES VCE(sat) (Max)@ 25°C IC @100°C STGF10NB60SD 600V <1.8V 7A TO-220FP Order codes Part number Marking Package Packaging STGF10NB60SD GF10NB60SD TO-220FP Tube

1 Electrical ratings

Table 1. Absolute maximum ratings

  1. Pulse width limited by max. junction temperature.

Table 2. Thermal resistance

2 Electrical characteristics

Table 3. Static Table 4. Dynamic

Table 5. Switching on/off (inductive load)

  1. Eon is the tun-on losses when a typical diode is used in the test circuit in figure 2 Eon include diode
  2. Turn-off losses include also the tail of the collector current

Table 6. Collector-emitter diode

2.1 Electrical characterist ics (curves)

Figure 1. Output characteristics Figure 2. Transfer characteristics Figure 3. Transconductance Figure 4. Collector-emitter on voltage vs Figure 5. Collector-emitter on voltage vs Figure 6. Normalized gate threshold vs

Figure 13. Thermal impedance Figure 14. Turn-off SOA

3 Test circuit

Figure 15. Test circuit for inductive load Figure 16. Gate charge test circuit Figure 17. Switching waveforms Figure 18. Diode recovery times waveform

4 Package mechanical data

In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com

A B D E H G F 123F2 L4L5 DIM. mm. inch A 4.4 4.6 0.173 0.181 B 2.5 2.7 0.098 0.106 D 2.5 2.75 0.098 0.108 E 0.45 0.7 0.017 0.027 F 0.75 1 0.030 0.039 F1 1.15 1.7 0.045 0.067 F2 1.15 1.7 0.045 0.067 G 4.95 5.2 0.195 0.204 G1 2.4 2.7 0.094 0.106 H 10 10.4 0.393 0.409 L2 16 0.630 L3 28.6 30.6 1.126 1.204 L4 9.8 10.6 .0385 0.417 L5 2.9 3.6 0.114 0.141 L6 15.9 16.4 0.626 0.645 L7 9 9.3 0.354 0.366 Ø 3 3.2 0.118 0.126 TO-220FP MECHANICAL DATA

5 Revision history

Table 7. Revision history