GCJ21

GCJ32ER71E106KA12L MURATA | Alldatasheet

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Continued on the following page. Using calipers and micrometers9 Physical Dimension Within the specified dimensions Visual inspection8 External Visual No defects or abnormalities Apply voltage as in the Table for 1000–12 hours at 125–3°C. Let sit for 24–2 hours at room temperature, then measure. The charge/discharge current is less than 50mA.

• Pretreatment Apply test voltage for 60–5 minutes at test temperature. Remove and let sit for 24–2 hours at room temperature. Operational Life The measured and observed characteristics should satisfy the specifications in the following table. Appearance No marking defects Capacitance Change Within –12.5% D.F. 0.05 max. I.R. More than 1,000MΩ or 10MΩ · µF (Whichever is smaller) Apply the rated voltage and DC1.3+0.2/-0V (add 6.8kΩ resistor) at 85–3°C and 80 to 85% humidity for 1000–12 hours. Remove and let sit for 24–2 hours at room temperature, then measure. The charge/discharge current is less than 50mA.
• Pretreatment Perform the heat treatment at 150+0/-10°C for 60–5 minutes and then let sit for 24–2 hours at room temperature. Biased Humidity The measured and observed characteristics should satisfy the specifications in the following table. Appearance No marking defects Capacitance Change Within –12.5% D.F. 0.05 max. I.R. More than 1,000MΩ or 10MΩ · µF (Whichever is smaller) Apply the 24-hour heat (25 to 65°C) and humidity (80 to 98%) treatment shown below, 10 consecutive times. Let sit for 24–2 hours at room temperature, then measure. Moisture Resistance The measured and observed characteristics should satisfy the specifications in the following table. Appearance No marking defects Capacitance Change Within –12.5% D.F. 0.05 max. I.R. More than 10,000MΩ or 100MΩ · µF (Whichever is smaller) Per EIA-4694 Destructive Physical Analysis No defects or abnormalities Fix the capacitor to the supporting jig in the same manner and under the same conditions as (19). Perform the 1000 cycles according to the 4 heat treatments listed in the following table. Let sit for 24–2 hours at room temperature, then measure.
• Pretreatment Perform the heat treatment at 150+0/-10°C for 60–5 minutes and then let sit for 24–2 hours at room temperature. Temperature Cycle The measured and observed characteristics should satisfy the specifications in the following table. Appearance No marking defects Capacitance Change Within –10% D.F. 0.025 max. I.R. More than 10,000MΩ or 100MΩ · µF (Whichever is smaller) Set the capacitor for 1000–12 hours at 150–3°C. Let sit for 24–2 hours at room temperature, then measure.2 High Temperature Exposure (Storage) The measured and observed characteristics should satisfy the specifications in the following table. Appearance No marking defects Capacitance Change Within –10% D.F. 0.05 max. I.R. More than 10,000MΩ or 100MΩ · µF (Whichever is smaller)

1 Pre- and Post-Stress

No. AEC-Q200 Test MethodSpecificationsAEC-Q200 Test Item -10 Humidity 90-98% Humidity 80-98% Humidity 90-98% Humidity 80-98% Humidity 90-98% +10 -2°C Initial measurement Temperature One cycle = 24 hours 0123456789 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 Hours Step 1 -55+0/-3 15–3 Room Temp. 125+3/-0 15–3 Room Temp. Temp. (°C) Time (min.) Rated Voltage Applied Voltage 150% of the rated voltage 120% of the rated voltage DC250V DC630V Medium Voltage for Automotive Soft Termination Type GCJ Series Specifications and Test Methods

Continued from the preceding page. Continued on the following page. (a) Preheat at 155°C for 4 hours. After preheating, im m erse the capacitor in a solution of ethanol (JIS-K-8101) and rosin (JIS- K-5902) (25% rosin in w eight proportion). Im m erse in eutectic solder solution for 5+0/-0.5 seconds at 235–5°C . (b) Should be placed into steam aging for 8 hours–15 m inutes. After preheating, im m erse the capacitor in a solution of ethanol (JIS-K-8101) and rosin (JIS-K-5902) (25% rosin in w eight proportion). Im m erse in eutectic solder solution for 5+0/-0.5 seconds at 235–5°C . (c) Should be placed into steam aging for 8 hours–15 m inutes. After preheating, im m erse the capacitor in a solution of ethanol (JIS-K-8101) and rosin (JIS-K-5902) (25% rosin in w eight proportion). Im m erse in eutectic solder solution for 120 –5 seconds at 260–5°C .

16 Solderability 95% of the term inations are to be soldered evenly and

continuously. Per AEC -Q 200-00215 ESD Appearance N o m arking defects Capacitance Change W ithin the specified tolerance D.F. 0.025 m ax. I.R. M ore than 10,000M Ω or 100M Ω · µF (W hichever is sm aller) Fix the capacitor to the supporting jig in the sam e m anner and under the sam e conditions as (19). Perform the 300 cycles according to the tw o heat treatm ents listed in the follow ing table (m axim um transfer tim e is 20 seconds). Let sit for 24–2 hours at room tem perature, then m easure.

• Pretreatm ent Perform the heat treatm ent at 150+0/-10°C for 60–5 m inutes and then let sit for 24–2 hours at room tem perature. Thermal Shock The m easured and observed characteristics should satisfy the specifications in the follow ing table. Appearance N o m arking defects Capacitance Change W ithin –10% D.F. 0.025 m ax. I.R. M ore than 10,000M Ω or 100M Ω · µF (W hichever is sm aller) Im m erse the capacitor in a eutectic solder solution at 260–5°C for 10–1 seconds. Let sit at room tem perature for 24–2 hours, then m easure.
• Pretreatm ent Perform the heat treatm ent at 150+0/-10°C for 60–5 m inutes and then let sit for 24–2 hours at room tem perature. Resistance to Soldering Heat The m easured and observed characteristics should satisfy the specifications in the follow ing table. Appearance N o m arking defects Capacitance Change W ithin –10% D.F. 0.025 m ax. I.R. M ore than 10,000M Ω or 100M Ω · µF (W hichever is sm aller) Solder the capacitor to the test jig (glass epoxy board) in the sam e m anner and under the sam e conditions as (19). The capacitor should be subjected to a sim ple harm onic m otion having a total am plitude of 1.5m m , the frequency being varied uniform ly betw een the approxim ate lim its of 10 and 2000H z. The frequency range, from 10 to 2000H z and return to 10H z, should be traversed in approxim ately 20 m inutes. This m otion should be applied for 12 item s in each 3 m utually perpendicular directions (total of 36 tim es).

12 Vibration

Appearance N o defects or abnorm alities Capacitance Change W ithin the specified tolerance D.F. 0.025 m ax. Three shocks in each direction should be applied along 3 m utually perpendicular axes of the test specim en (18 shocks). The specified test pulse should be H alf-sine and should have a duration: 0.5m s, peak value: 1500g and velocity change: 4.7m /s.

11 Mechanical

Appearance N o m arking defects Capacitance Change W ithin the specified tolerance D.F. 0.025 m ax. Per M IL-STD -202 M ethod 215 Solvent 1:1 part (by volum e) of isopropyl alcohol 3 parts (by volum e) of m ineral spirits Solvent 2:Terpene defluxer Solvent 3:42 parts (by volum e) of w ater 1 part (by volum e) of propylene glycol m onom ethyl ether 1 part (by volum e) of m onoethanolam ine

10 Resistance

Appearance N o m arking defects Capacitance Change W ithin the specified tolerance D.F. 0.025 m ax. I.R. M ore than 10,000M Ω or 100M Ω · µF (W hichever is sm aller) No. AEC-Q200 Test MethodSpecificationsAEC-Q200 Test Item Step 1 -55+0/-3 15–3 125+3/-0 15–3 Temp. (°C) Time (min.) M edium Voltage for A utom otive Soft Term ination Type G C J Series Specifications and Test M ethods

Continued from the preceding page. Continued on the following page. Solder the capacitor to the test jig (glass epoxy board) as show n in Fig. 3 using a eutectic solder. Then apply 18N force in parallel w ith the test jig for 60 seconds. The soldering should be done by the reflow m ethod and should be conducted w ith care so that the soldering is uniform and free of defects such as heat shock. (in m m ) Fig. 3

19 Terminal

Appearance N o m arking defects Capacitance Change W ithin the specified tolerance D.F. 0.025 m ax. I.R. M ore than 10,000M Ω or 100M Ω · µF (W hichever is sm aller) Solder the capacitor on the test jig (glass epoxy board) as show n in Fig. 1 using a eutectic solder. Then apply a force in the direction show n in Fig. 2 for 5–1 seconds. The soldering should be done by the reflow m ethod and should be conducted w ith care so that the soldering is uniform and free of defects such as heat shock. (in m m ) Fig. 2 Fig. 1

18 Board

Appearance N o m arking defects Capacitance Change W ithin –12.5% Visual inspection. Electrical Characteri- zation Appearance N o defects or abnorm alities Capacitance Change W ithin the specified tolerance The capacitance/Q should be m easured at 25°C at the frequency and voltage show n in the table. D.F. 0.025 m ax. I.R. 25°C M ore than 10,000M Ω or 100M Ω · µF (W hichever is sm aller) M ax. O perating Tem perature···125°C M ore than 1,000M Ω or 10M Ω · µF (W hichever is sm aller) The insulation resistance should be m easured w ith D C 500–50V (D C 250–25V in case of rated voltage: D C 250V) at 25°C and 125°C and w ithin 2 m inutes of charging. Dielectric Strength N o failure N o failure should be observed w hen voltage as in the Table is applied betw een the term inations for 1 to 5 seconds, provided the charge/discharge current is less than 50m A. No. AEC-Q200 Test MethodSpecificationsAEC-Q200 Test Item Capacitance Frequency 1–0.2M H z 1–0.2kH z Voltage AC 0.5 to 5V(r.m .s.) AC 1–0.2V(r.m .s.) C F1000pF C U1000pF Rated Voltage Test Voltage 200% of the rated voltage 150% of the rated voltage D C 250V D C 630V Type a 0.8 2.0 2.0 3.0 4.2 b 3.0 4.4 4.4 6.0 7.2 c 1.3 1.7 2.6 3.3 5.1 G C J21 G C J31 G C J32 G C J43 G C J55 Type a 1.2 2.2 2.2 3.5 4.5 b 4.0 5.0 5.0 7.0 8.0 c 1.65 2.0 2.9 3.7 5.6 G C J21 G C J31 G C J32 G C J43 G C J55 b C 100 a t: 1.6m m 45 45 R 4 20 50 Pressurizing speed: 1.0m m /s Pressurize C apacitance m eter Flexure: V3 (V2: G C J21) c Baked electrode or copper foil Solder resist t: 1.6m m a b M edium Voltage for A utom otive Soft Term ination Type G C J Series Specifications and Test M ethods

Continued from the preceding page. The capacitance change should be m easured after 5 m inutes at each specified tem perature stage. The ranges of capacitance change com pared w ith the above 25°C value over the tem perature ranges show n in the table should be w ithin the specified ranges.

• Pretreatm ent Perform the heat treatm ent at 150+0/-10°C for 60–5 m inutes and then let sit for 24–2 hours at room tem perature. Perform the initial m easurem ent. Capacitance Temperature Character- istics Capacitance Change W ithin –15% Place the capacitor in the beam load fixture as in Fig. 4. Apply force. Fig. 4 Speed at w hich to supply the Stress Load: 2.5m m / s

20 Beam Load Test

The chip should endure the follow ing force. C hip thickness F 1.25m m rank: 15N C hip thickness U 1.25m m rank: 54.5N No. AEC-Q200 Test MethodSpecificationsAEC-Q200 Test Item 0.6 L L Step Temperature (°C) 25–2 -55–3 25–2 125–3 25–2 M edium Voltage for A utom otive Soft Term ination Type G C J Series Specifications and Test M ethods