GBU10005 THINKISEMI | Alldatasheet
Document overview
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- PDF pages: 2
Technical content
Features
- Plastic material has Underwriters Laboratory Flammability Classification 94V-0
- Ideal for printed circuit boards
- Glass passivated chip junction
- Reliable low cost construction utilizing molded plastic technique Mechanical Data
- Case: Molded plastic GBU
- Terminals: leads solderable per MIL-STD-202 Method 208 guaranteed
- Mounting Position: Any GBU Unit: inch (mm) .880(22.3) .160(4.1) .140(3.56) .040(1.02) .030(0.75) .100(2.54) .080(2.03) .080(2.03) .710(18.0) .085(2.16) .310(7.90) .740(18.8) .075(1.90)R .860(21.8) .140(3.5) .130(3.30) .030(0.76) .017(0.45) .085(2.16) .065(1.65) .060(1.52) .690(17.5) .065(1.65) .290(7.40) .720(18.3) Maximum Ratings and Electrical Characteristics (@T A = +25°C, unless otherwise specified.) Single phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%. Characteristic Symbol GBU 10005 GBU 1001 GBU 1002 GBU 1004 GBU 1006 GBU 1008 GBU
1010 Unit
Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage V RRM V RWM V R 50 100 200 400 600 800 1000 V RMS Reverse Voltage V R RMS 35 70 140 280 420 560 700 V Average Forward Rectified Current (Note 4) @ T C = +100°C I AV 10 A Non-Repetitive Peak Forward Surge Current 8.3ms Single Half Sine-Wave Superimposed on Rated Load I FSM 220 A Forward Voltage (per element) @ I F = 5.0A V FM 1.0 V Peak Reverse Current at Rated DC Blocking Voltage @ T C = +25°C @ T C = +125°C I R 5.0 500 μA I t Rating for Fusing (Note 5) I t 200 A s Typical Total Capacitance per Element (Note 6) C T 60 pF Typical Thermal Resistance Junction to Case (Note 4) R θJC 2.2 °C/W Operating and Storage Temperature Range T T STG -55 to +150 °C Notes: 4. Unit mounted on 100mm x 100mm x 1.6mm copper plate heatsink. 5. Non-repetitive, for t > 1.0ms and < 8.3ms. 6. Measured at 1.0MHz and applied reverse voltage of 4.0V DC.