GBL02 ETC2 | Alldatasheet
Document overview
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Technical content
Features
z Glass passivated die construction z Ideal for printed circuit boards z Plastic material used carries UL flammability recognition 94V-0 z High surge current capability z High case dielectric strength of 1500 V RMS z High temperature soldering guaranteed: 265 O C /10 seconds, 0.375” (9.5mm) lead length, 5lbs. (2.3kg) tension 0.077 oz., 2.2 g
Document Number : GBL02 www.smsemi.com Oct 23, 2014 2 GBL02 thru GBL10 0.01 0.1 1.0 I , INSTANTANEOUS FWD CURRENT (A) F V , INSTANTANEOUS FWD VOLTAGE (V) Fig. 2 Typical Forward Characteristics, per element F T = 25°C j Pulse Width = 300 µs 100 150 200 250 1 10 100 I , PEAK FWD SURGE CURRENT (A) FSM NUMBER OF CYCLES AT 60 Hz Fig. 3 Max Non-Repetitive Surge Current T = 150°C j Single Half-Sine-Wave (JEDEC Method) 0.01 0.1 1.0 100 1000 0 20 40 60 80 100 120 140 I , INSTANTANEOUS REVERSE CURRENT (µA) R PERCENT OF RATED PEAK REVERSE VOLTAGE (%) Fig. 5 Typical Reverse Characteristics T = 25°C j T = 100°C j 25 50 75 100 125 150 T , AMBIENT TEMPERATURE (°C) Fig. 1 Forward Current Derating Curve A I , AVERAGE FWD RECTIFIED CURRENT (A) (AV) Resistive or Inductive load 100 1000 0.1 1 10 100 C , CAPACITANCE (pF) j V , REVERSE VOLTAGE (V) Fig. 4 Typical Junction Capacitance R f=1M Hz T = 25°C j j