GBJ20005_1 DIODES | Alldatasheet

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Features

20A GLASS PASSIVATED BRIDGE RECTIFIER GBJ Dim Min Max A 29.70 30.30 B 19.70 20.30 C 17.00 18.00 D 3.80 4.20 E 7.30 7.70 G 9.80 10.20 H 2.00 2.40 I 0.90 1.10 J 2.30 2.70 K 3.0 X 45° L 4.40 4.80 M 3.40 3.80 N 3.10 3.40 P 2.50 2.90 R 0.60 0.80 S 10.80 11.20 All Dimensions in mm B C D EEG H K J I L M N P R S A Characteristic Symbol GBJ 20005 GBJ 2001 GBJ 2002 GBJ 2004 GBJ 2006 GBJ 2008 GBJ

2010 Unit

Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage V RRM VRWM VR 50 100 200 400 600 800 1000 V RMS Reverse Voltage VR(RMS) 35 70 140 280 420 560 700 V Average Forward Rectified Output Current @ T C = 110°C IO 20 A Non-Repetitive Peak Forward Surge Current, 8.3 ms single half-sine-wave superimposed on rated load IFSM 240 A Forward Voltage per element @ I F = 10A VFM 1.05 V Peak Reverse Current @ T A = 25°C at Rated DC Blocking Voltage @ T C = 125°C IR 500 µA I2t Rating for Fusing (t < 8.3 ms) (Note 1) I2t 240 A 2s Typical Total Capacitance per Element (Note 2) CT 60 pF Typical Thermal Resistance Junction to Case (Note 3) R/c113JC 0.8 °C/W Operating and Storage Temperature Range Tj,T STG -55 to +150 °C /c183Case: GBJ /c183Case Material: Molded Plastic. UL Flammability Classification Rating 94V-0 /c183Moisture Sensitivity: Level 1 per J-STD-020C /c183Terminals: Plated Leads, Solderable per MIL-STD-202, Method 208 /c183Lead Free Plating (Tin Finish). /c183Polarity: Molded on Body /c183Mounting: Through Hole for #6 Screw /c183Mounting Torque: 5.0 in-lbs Maximum /c183Marking: Type Number /c183Weight: 6.6 grams (approximate) Mechanical Data /c183Glass Passivated Die Construction /c183High Case Dielectric Strength of 1500VRMS /c183Low Reverse Leakage Current /c183Surge Overload Rating to 240A Peak /c183Ideal for Printed Circuit Board Applications /c183UL Listed Under Recognized Component Index, File Number E94661 /c183Lead Free Finish/RoHS Compliant (Note 4) Single phase, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%. Maximum Ratings and Electrical Characteristics @ TA = 25°C unless otherwise specified Notes: 1. Non-repetitive, for t > 1ms and < 8.3 ms. 2. Measured at 1.0 MHz and applied reverse voltage of 4.0V DC. 3. Unit mounted on 300 x 300 x 1.6mm Cu plate heat sink. 4. RoHS revision 13.2.2003. Glass and High Temperature Solder Exemptions Applied, see EU Directive Annex Notes 5 and 7.

DS21220 Rev. 8 - 2 2 of 3 GBJ20005-GBJ2010 www.diodes.com 0.01 0.1 1.0 V , INSTANTANEOUS FORWARD VOLTAGE (V) Fig.2 T ypical Forward Characteristics (per element) F I , INSTANTANEOUS FORWARD CURRENT (A)F 100 T=2 5 ° Cj 100 1 10 100 I , PEAK FORWARD SURGE CURRENT (A)FSM NUMBER OF CYCLES AT 60 Hz Fig. 3 Maximum Non-Repetitive Sur ge Current 150 250 200 Single half-sine-wave T= 2 5 ° Cj 100 1 10 100 C , TOTAL CAPACITANCE (pF) T V , REVERSE VOLTAGE (V) Fig.4 T ypical Total Capacitance, Per Element R f=1 M H z T= 2 5 ° Cj 0.1 1.0 100 1000 0 20 40 60 80 100 PERCENT OF RATED PEAK REVERSE VOLTAGE (%) Fig.5 T ypical Reverse Characteristics T= 5 0 ° Cj T = 125°Cj T = 100°Cj T= 2 5 ° Cj 25 50 75 100 125 150 I , AVERAGE RECTIFIED CURRENT (A)O T , CASE TEMPERATURE (°C) Fig. 1 Forward Current Deratin g Curve C Without heatsink With heatsink Resistive or Inductive load

DS21220 Rev. 8 - 2 3 of 3 GBJ20005-GBJ2010 www.diodes.com

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(Note 5) IMPORTANT NOTICE LIFE SUPPORT Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to any product herein. Diodes Incorporated does not assume any liability arising out of the application or use of any product described herein;neither does it convey any license under its patent rights, nor the rights of others. The user of products in such applications shall assume all risks of such useand will agree to hold Diodes Incorporated and all the companies whose products are represented on our website, harmless against all damages. Diodes Incorporated products are not authorized for use as critical components in life support devices or systems without the expressed written approval of the President of Diodes Incorporated.