GBJ20005 SHUNYE | Alldatasheet
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/c183Glass Passivated Die Construction /c183High Case Dielectric Strength of 1500V RMS /c183Low Reverse Leakage Current /c183Surge Overload Rating to 350A Peak /c183Ideal for Printed Circuit Board Applications /c183Plastic Material - UL Flammability Classification 94V-0 /c183Case: Molded Plastic /c183Terminals: Plated Leads, Solderable per MIL-STD-202, Method 208 /c183Polarity: Molded on Body /c183Mounting: Through Hole for #6 Screw /c183Mounting Torque: 5.0 in-lbs Maximum /c183Weight: 6.6 grams (approx) /c183Marking: Type Number Mechanical Data GBJ Dim Min Max A 29.70 30.30 B 19.70 20.30 C 17.00 18.00 D 3.80 4.20 E 7.30 7.70 G 9.80 10.20 H 2.00 2.40 I 0.90 1.10 J 2.30 2.70 K 3.0 X 45° L 4.40 4.80 M 3.40 3.80 N 3.10 3.40 P 2.50 2.90 R 0.60 0.80 10.80 11.20 All Dimensions in mm B C D EEG H K J I L M N P R S A
■Thermal Characteristics （Ta=25℃ Unless otherwise specified） PARAMETER SYMBOL UNIT GBJ20005 GBJ2001 GBJ2002 GBJ2004 GBJ2006 GBJ2008 GBJ2010 Thermal Resistance Between junction and ambient, Without heatsink RθJ-A ℃/W Between junction and case, With heatsink RθJ-C 1.0 ■Ordering Information (Example) PREFERED P/N PACKING CODE UNIT WEIGHT(g) MINIIMUM PACKAGE(pcs) INNER BOX QUANTITY(pcs) OUTER CARTON QUANTITY(pcs) DELIVERY MODE GBJ20005 THRU GBJ2010 B1 Approximate 6.5 15 750 1500 TUBE GBJ20005 THRU GBJ2010 A1 Approximate 6.5 250 250 2000 BOX ■ Characteristics(Typical) 0.1 0.2 0.5 FIG3: Forward Voltage 1.0 5.0 Ta=25℃ Instantaneous Forward Current（A） Instantaneous Forward Voltage（V） 0 20 40 60 80 100 0.01 0.1 1.0 100 Tj=125℃ Tj=25℃ FIG4:Typical Reverse Characteristics Percent of Rated Peak Reverse Voltage（%） Instantaneous Reverse Current（uA） 2 5 10 20 50 100 150 300 450 FIG2:Surge Forward Current Capability 8.3ms IFSM 8.3ms half sine wave Number of Cycles Peak Forward Surge Current（A） non-repetitive Tj=25℃ 1cycle sine wave R-load with heatsink 70 80 90 100 110 120 130 140 150 FIG1：Io-Tc Curve heatsink Average Forward Output(A) Case Temperature(℃)