STGB8NC60K STMICROELECTRONICS | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 17
Technical content
Datasheet sections
- 1 Electrical ratings
- 2 Electrical characteristics
- 2.1 Electrical characteristics (curves)
- 3 Test circuit
- 4 Package mechanical data
- 5 Packaging mechanical data
- 6 Revision history
Features
■ Lower on voltage drop (Vcesat) ■ Lower CRES / CIES ratio (no cross-conduction susceptibility) ■ Very soft ultra fast recovery antiparallel diode ■ Short circuit withstand time 10µs
Applications
■ High frequency motor controls ■ SMPS and PFC in both hard switch and resonant topologies ■ Motor drivers
Description
Using the latest high voltage technology based on a patented strip layout, STMicroelectronics has designed an advanced family of IGBTs, the PowerMESH™ IGBTs, with outstanding performances. The suffix “K” identifies a family optimized for high frequency motor control applications with short circuit withstand capability. Figure 1. Internal schematic diagram Table 1. Device summary
1 Electrical ratings
Table 2. Absolute maximum ratings
- Calculated according to the iterative formula:
- Pulse width limited by max junction temperature
Table 3. Thermal resistance
2 Electrical characteristics
Table 4. Static Table 5. Dynamic
Table 6. Switching on/off (inductive load) Table 7. Switching energy (inductive load)
- Eon is the turn-on losses when a typi cal diode is used in the test circuit in figure 2. If the IGBT is offered in
- Turn-off losses include also the tail of the collector current
2.1 Electrical characteri stics (curves)
Figure 2. Output characteristics Figure 3. Transfer characteristics Figure 4. Transconductance Figure 5. Collector-emitter on voltage vs Figure 6. Gate charge vs gate-source voltage Figure 7. Capacitance variations
3 Test circuit
Figure 17. Test circuit for inductive load Figure 18. Gate charge test circuit Figure 19. Switching waveform Figure 20. Diode recovery time waveform
4 Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com
A 4.40 4.60 0.17 3 0.181 b 0.61 0. 88 0.024 0.0 34 b1 1.14 1.70 0.044 0.066 c0 . 4 9 0.70 0.01 9 0.027 D 15.25 15.75 0.6 0.62 D1 1.27 0.050 E 10 10.40 0. 393 0.409 e 2.40 2.70 0.0 94 0.106 e1 4. 95 5.15 0.1 94 0.202 F1 . 2 3 1.32 0.04 8 0.051 H1 6.20 6.60 0.244 0.256 J1 2.40 2.72 0.0 94 0.107 L1 3 14 0.511 0.551 L1 3.50 3.93 0.137 0.154 L20 16.40 0.645 L302 8.90 1.1 37 ∅P 3.75 3.85 0.147 0.151 Q2 . 6 5 2 . 95 0.104 0.116
DIM. mm. inch A 2.2 2.4 0.086 0.094 A1 0.9 1.1 0.035 0.043 A2 0.03 0.23 0.001 0.009 B 0.64 0.9 0.025 0.035 b4 5.2 5.4 0.204 0.212 C 0.45 0.6 0.017 0.023 C2 0.48 0.6 0.019 0.023 D 6 6.2 0.236 0.244 D1 5.1 0.200 E 6.4 6.6 0.252 0.260 E1 4.7 0.185 e 2.28 0.090 e1 4.4 4.6 0.173 0.181 H 9.35 10.1 0.368 0.397 L 1 0.039 (L1) 2.8 0.110 L2 0.8 0.031 L4 0.6 1 0.023 0.039 R 0.2 0.008 V2 0° 8° 0° 8° DPAK MECHANICAL DATA 0068772-F
D²PAK mechanical data Dim mm inch Min Typ Max Min Typ Max A 4.4 4.6 0.17 3 0.181 A1 2.4 9 2.69 0.098 0.106 A2 0.0 3 0.23 0.001 0.00 9 B 0.7 0. 93 0.027 0.0 36 B2 1.14 1.7 0.044 0.067 C 0.45 0.6 0.017 0.02 3 C2 1.2 3 1.36 0.04 8 0.053 D 8.95 9.350 . 352 0. 368 D1 8 0.315 E 10 10.4 0. 393 0.409 E1 8.5 0. 334 G4 . 88 5.28 0.1920 . 2 0 8 L1 5 1 5 . 85 0.5 90 0.625 L2 1.27 1.4 0.50 0.55 L3 1.4 1.75 0.055 0.6 8 M2 . 4 3.2 0.0 940 . 1 2 6 R 0.4 0.015 V2 0° 4°
Packaging mechanical data STGB8NC60K - STGD8NC60K - STGP8NC60K
5 Packaging mechanical data
- on sales type DIM. mm inch MIN. MAX. MIN. MAX. A 330 12.992 B 1.5 0.059 C 12.8 13.2 0.504 0.520 D 20.2 0795 G 24.4 26.4 0.960 1.039 N 100 3.937 T 30.4 1.197 BASE QTY BULK QTY 1000 1000 REEL MECHANICAL DATA DIM. mm inch MIN. MAX. MIN. MAX. A0 10.5 10.7 0.413 0.421 B0 15.7 15.9 0.618 0.626 D 1.5 1.6 0.059 0.063 D1 1.59 1.61 0.062 0.063 E 1.65 1.85 0.065 0.073 F 11.4 11.6 0.449 0.456 K0 4.8 5.0 0.189 0.197 P0 3.9 4.1 0.153 0.161 P1 11.9 12.1 0.468 0.476 P2 1.9 2.1 0.075 0.082 R 50 1.574 T 0.25 0.35 0.0098 0.0137 W 23.7 24.3 0.933 0.956 TAPE MECHANICAL DATA
STGB8NC60K - STGD8NC60K - STGP8NC60K Packaging mechanical data TAPE AND REEL SHIPMENT DPAK FOOTPRINT DIM. mm inch MIN. MAX. MIN. MAX. A 330 12.992 B 1.5 0.059 C 12.8 13.2 0.504 0.520 D 20.2 0.795 G 16.4 18.4 0.645 0.724 N 50 1.968 T 22.4 0.881 BASE QTY BULK QTY 2500 2500 REEL MECHANICAL DATA DIM. mm inch MIN. MAX. MIN. MAX. A0 6.8 7 0.267 0.275 B0 10.4 10.6 0.409 0.417 B1 12.1 0.476 D 1.5 1.6 0.059 0.063 D1 1.5 0.059 E 1.65 1.85 0.065 0.073 F 7.4 7.6 0.291 0.299 K0 2.55 2.75 0.100 0.108 P0 3.9 4.1 0.153 0.161 P1 7.9 8.1 0.311 0.319 P2 1.9 2.1 0.075 0.082 R 40 1.574 W 15.7 16.3 0.618 0.641 TAPE MECHANICAL DATA All dimensions are in millimeters
6 Revision history
Table 8. Document revision history