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Technical content

Features

  • Efficient, High Fidelity 1 or 2−Channel WDRC Signal Processing
  • Fully Programmable via Serial Data Interface
  • One DLL Operation
  • Four Trimmer Inputs plus V olume Control or Programmer Controlled
  • Flexible Trimmer/Parameter Assignments
  • Three−Terminal Trimmers
  • Wideband Level Detection
  • Choice of Two AGC−I Parametric Adjustment Strategies
  • 6, 12 or 24 dB/Octave Band Split Filter or Configurable as Single−Channel Compressor
  • In−Channel, Low−Level Squelch Control (1:2 Expansion)
  • Output Compression Limiting (AGC−O)
  • Flexible Pre− and Post−Emphasis Filters
  • Three Independent Memories
  • Pulse−Density−Modulated Output Stage Drives Zero−Bias 2−Terminal Receivers
  • These Devices are Pb−Free and are RoHS Compliant Standard Packaging
  • Hybrid Typical Dimensions: 0.150 x 0.250 x 0.046 in. (3.81 x 6.35 x 1.17 mm) www.onsemi.com

20 PAD

GA3227−E1 XXXXXX GA3227 = Specific Device Code E1 = RoHS Compliant Hybrid XXXXXX = Work Order Number (Bottom View) GND2 SDA MGND TR3 VREG OUT−OUT+ 11 10 18 19 20 98 7 TR4 VB PGND VBP TIN VINVREG2 GND VC TR1 TR2 MS2 MS1 See detailed ordering and shipping information on page 11 of this data sheet.

ORDERING INFORMATION

Figure 1. Consolidator GA3227 Hybrid Block Diagram Table 1. ABSOLUTE MAXIMUM RATINGS should not be assumed, damage may occur and reliability may be affected. WARNING: Electrostatic Sensitive Device − Do not open packages or handle except at a static−free workstation. except under controlled conditions.

Table 2. ELECTRICAL CHARACTERISTICS − PART 1 performance may not be indicated by the Electrical Characteristics if operated under different conditions.

  1. Total System Gain consists of: Wideband System Gain + High and Low Independent Channel Gains + Converter Gain.

Total System Gain is calibrated during Cal/Config process.

  1. Volume control is log taper, trimmers are linear taper.

performance may not be indicated by the Electrical Characteristics if operated under different conditions.

  1. Total System Gain consists of: Wideband System Gain + High and Low Independent Channel Gains + Converter Gain.

Total System Gain is calibrated during Cal/Config process.

  1. Volume control is log taper, trimmers are linear taper.

Table 3. ELECTRICAL CHARACTERISTICS − PART 2

performance may not be indicated by the Electrical Characteristics if operated under different conditions.

  1. Total System Gain consists of: Wideband System Gain + High and Low Independent Channel Gains + Converter Gain and accuracy of this

parameter is dependent on accuracy of the components. *Peak output is defined as largest sine wave possible at the resonant frequency of the receiver. Figure 2. Test Circuit Note: All resistors in ohms and all capacitors in farads, unless otherwise stated.

Figure 5. Typical Assembly Diagram channel device with linear or WDRC processing. pin using industry−standard programming boxes. 24 kHz 20−bit digital audio signal. bands are then summed back into a wide−band signal.

the telecoil gain compensation. circuitry to prevent unintentional level toggling. shaping. The filter coefficients can be entered in IDS. programmable as a level measured as dB from full scale. attack and release time constants. programmable mode, the switch must be set to pull−down. static switch which is selectable using ARKonline.

  • Momentary Switch on MS
  • Momentary Switch on MS, static switch on MS2 (jump to Memory C)
  • Static switch on MS and MS2
  • Static switch on MS, static switch on MS2 (jump to Memory C) Momentary Switch on MS This mode uses a single momentary switch on MS to change memories. Using this mode causes the part to toggle among memories A, B and C. Momentary Switch on MS, Static Switch on MS2 (Jump to Memory C) This mode uses a static switch on MS2 and a momentary switch on MS to change memories. If the static switch is OPEN, the part starts in memory A and toggles between memory A and B. If the static switch on MS2 is set to HIGH, the part automatically jumps to the memory C (occurs on startup or during normal operation). In this setup, the momentary switch’s state is ignored. This prevents memory select beeps from occurring. When MS2 is set to OPEN, the part loads in the last select memory.

Table 4. DYNAMIC EXAMPLE WITH 3 VALID MEMORIES This mode uses two static switches to change memories. memory before reaching the final memory. Table 5. SWITCH FOR MS and MS2

This mode uses two static switches to change memories. last valid memory when the static switch on MS2 is HIGH. memories (even if four valid memories are programmed). Table 6. STATIC SWITCH ON MS, STATIC SWITCH memory before reaching the final memory. when switching MS when MS2 is HIGH. the part defaults to memory A. produce tones to indicate a memory change. settings and can be individually selected for each memory. memory change beeping code is deciphered in Table 7. Table 7. MEMORY CHANGE BEEPING CODE selection change, or to warn the user of low battery voltage. and the audio output is muted. above the turn−ON threshold again. turn−ON threshold after shutdown. changes over to deep−reset mode after 5 minutes.

www.onsemi.com The fourth option is to have the gain reduced as the battery voltage drops. When the supply falls below the low battery threshold the low battery tones will be emitted and the wideband gain will be reduced by 3 dB. As the battery voltage continues to drop, the low battery tones will continue and the wideband gain will continue to be reduced until the turn−OFF threshold is reached when the device will shut down. An additional option configurable via ARKonline is to have the gain reduced as the battery voltage drops. When the supply falls below the low battery threshold, the low battery tones are emitted and the wideband gain is reduced by 3 dB. As the battery voltage continues to drop, the low battery tones continue and the wideband gain continues to be reduced until the turn −OFF threshold is reached as the device shuts down. Current Consumption Typical current consumption of the Consolidator GA3227 Digital, as stated in the Electrical Characteristics section, is measured at a specific configuration and settings. Software Full software support is provided for every stage of development from design to manufacturing to fitting. For details, refer to the Getting Started with ARK Software Guide. SDA Communication The Consolidator GA3227 Digital is programmed via the SDA pin using industry standard programming boxes. During parameter changes the main audio signal path of the hybrid is temporarily disabled and replaced with a low gain bypass path to avoid the generation of disturbing audio transients. Once the changes are complete, the main audio path is re−activated. Any changes made during programming are lost at power−off unless they are explicitly burned to EEPROM memory. Power Management The Consolidator GA3227 Digital was designed to accommodate high power applications. AC ripple on the supply can cause instantaneous reduction of the battery’s voltage, potentially disrupting the circuit’s function. The Consolidator GA3227 has a separate power supply and ground connection for the output stage. This enables hearing instrument designers to accommodate external RC filters to minimize any AC ripple from the supply line. Reducing this AC ripple greatly improves the stability of the circuit and prevents unwanted reset of the circuit caused by spikes on the supply line. For more information on properly designing a filter to reduce supply ripple, refer to the Using DSP Hybrids in High Power Applications Initial Design Tips information note. Device Package Shipping† GA3227−E1 20 Pad Hybrid 25 Units / Bubble Pack GA3227−E1−T 20 Pad Hybrid 250 Units / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Hybrid Jig Ordering Information To order a Hybrid Jig Evaluation Board for Consolidator GA3227 contact your Sales Account Manager or FAE and use part number GA3227GEVB.

Table 8. PAD POSITION AND DIMENSIONS

www.onsemi.com PACKAGE DIMENSIONS Dimension units are in inches. Dimensions in parentheses are in millimeters, converted from inches and include minor rounding errors. 1.000 inches = 25.4 mm Dimension tolerances: ±0.005 (±0.10) unless otherwise stated.

  • = location of Pin 1 RoHS compliant hybrid, MSL#4, 240°C peak reflow, SAC305 This Hybrid is designed for either point−to−point manual soldering or for reflow according to ON Semiconductor’s reflow process. 0.250 (6.35) 0.150 (3.81)

0.050 MAX

(1.27) 0.015 (0.635) 0.015 (0.635) GA3227−E1 XXXXXX ON Semiconductor and the are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidia ries in the United States and/or other countries. SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 GA3227/D HRX is trademark of Semiconductor Components Industries, LLC. ARKonline is a registered trademark of Semiconductor Components Industries, LLC. LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative