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Technical content
Features
Two 30m Ω (typical) MOSFETs for high effi- ciency at 4A loads 200kHz to 2MHz Switching Frequency 0.8V ± 1% Voltage Reference Over Temperature Synchronizes to External Clock Adjustable Soft Start UV and OV Power Good Output Low Operating and Shutdown Quiescent Cur- rent Safe Start-up into Pre-Biased Output Cycle by Cycle Current Limit, Thermal and Fre- quency Fold Back Protection Thermally Enhanced 3mm × 3mm 16-pin QFN and 4mm × 4mm 16-pin QFN Package QFN4x4 Loads can attain to 5A
Applications
Low-Voltage, High-Density Power Systems Point of Load Regulation for High Performance DSPs, FPGAs, ASICs and Microprocessors Broadband, Networking and Optical Commu- nication Infrastructure
Ordering Information
NUMBER Marking TEMP. RANGE PACKAGE (Green) G5172R41U 5172 -40°C to +85°C TQFN3X3-16 G5172R41D 5172 -40°C to +85°C TQFN3X3-16 G5172R81U 5172 -40°C to +85°C TQFN4X4-16 Note: R4: TQFN3X3-16 R8:TQFN4X4-16 1: Bonding Code U & D: Tape & Reel General Description The G5172 device is a full featured 6.0V, 4A synchro- nous step down current mode converter with two inte- grated MOSFETs. The G5172 enables small designs by integrating the MOSFETs, implementing current mode control to re- duce external component count, reducing inductor size by enabling up to 2MHz switching frequency, and minimizing the IC footprint with a small 3mm x 3mm (4mm x 4mm) thermally enhanced QFN package. The G5172 provides accurate regulation for a variety of loads with an accurate ±1% Voltage Reference (VREF) over temperature. Efficiency is maximized through the integrated 30m Ω MOSFETs and 350µA typical supply current. Using the enable pin, shutdown supply current is reduced to 2µA by entering a shutdown mode. Under voltage lockout is internally set at 2.6V, but can be increased by programming the threshold with a resistor network on the enable pin. The output voltage startup ramp is controlled by the soft start pin. An open drain power good signal indicates the output is within 93% to 107% of its nominal voltage. Frequency fold back and thermal shutdown protects the device during an over-current condition. Pin Configuration Typical Application Circuit TQFN3X3-16/TQFN4X4-16 COMP LX LX LX SS 13RT AGND FB Thermal Pad PG BS EN VIN VINA VIN GND GND Note: Recommend connecting the Thermal Pad to the Ground for excellent power dissipation. VIN 3.3V to 6.0V CI 10µF 48.7KΩ 32.4KΩ CSS 0.01µF RT 182KΩ G5172 RC 20KΩ CC 470PF VIN EN RT COMP SS BS LX FB (0.803V) GND AGND EP CBS 0.1µF LO 1.0µH VOUT 1.8V CD*CO 22*2µF R1 100KΩ 80KΩ CZ* ＊ Option 100KΩ PG ＊ VINA must connect to VIN G5172 0.1µF TQFN3X3-16/TQFN4X4-16 COMP LX LX LX SS 13RT AGND FB Thermal Pad PG BS EN VIN VINA VIN GND GND Note: Recommend connecting the Thermal Pad to the Ground for excellent power dissipation. VIN 3.3V to 6.0V CI 10µF 48.7KΩ 32.4KΩ CSS 0.01µF RT 182KΩ G5172 RC 20KΩ CC 470PF VIN EN RT COMP SS BS LX FB (0.803V) GND AGND EP CBS 0.1µF LO 1.0µH VOUT 1.8V CD*CO 22*2µF R1 100KΩ 80KΩ CZ* ＊ Option 100KΩ PG ＊ VINA must connect to VIN G5172 0.1µF
Ver: 0.2 Nov 17, 2010 TEL: 886-3-5788833 http://www.gmt.com.tw G5174 Global Mixed-mode Technology Inc. High Efficiency, 4A Output, Synchronous Step Down Two 30m Ω (typical) MOSFETs for high effi- ciency at 4A loads 200kHz to 2MHz Switching Frequency 0.8V ± 1% Voltage Reference Over Temperature Synchronizes to External Clock Adjustable Soft Start Low Operating and Shutdown Quiescent Cur- rent Safe Start-up into Pre-Biased Output Cycle by Cycle Current Limit, Thermal and Fre- quency Fold Back Protection Thermally Enhanced TSSOP-14 (FD) Low-Voltage, High-Density Power Systems Point of Load Regulation for High Performance DSPs, FPGAs, ASICs and Microprocessors Broadband, Networking and Optical Commu- nication Infrastructure NUMBER Marking TEMP. RANGE PACKAGE (Green) G5174FA1U G5174 -40°C to +85°C TSSOP-14 (FD) Note: FA :TSSOP-14 (FD) 1: Bonding Code U: Tape & Reel General Description The G5174 device is a full featured 5.5V, 4A synchro- nous step down current mode converter with two inte- grated MOSFETs. The G5174 enables small designs by integrating the MOSFETs, implementing current mode control to re- duce external component count, reducing inductor size by enabling up to 2MHz switching frequency, and minimizing the IC footprint with a thermally enhanced TSSOP-14 (FD) package. The G5174 provides accurate regulation for a variety of loads with an accurate ±1% Voltage Reference (VREF) over temperature. Efficiency is maximized through the integrated 30m Ω MOSFETs and 350µA typical supply current. Using the enable pin, shutdown supply current is reduced to 2µA by entering a shutdown mode. Under voltage lockout is internally set at 2.6V, but can be increased by programming the threshold with a resistor network on the enable pin. The output voltage startup ramp is controlled by the soft start pin. Frequency fold back and thermal shutdown protects the device during an over-current condition. Pin Configuration Typical Application Circuit FB COMP TSSOP-14 (FD) G5174 RT SS LX LX BS EN VIN VINA VIN GND AGND GND Thermal Pad Note: Recommend connecting the Thermal Pad to the Ground for excellent power dissipation. VIN 3.3V to 5.5V CI 10µF 48.7Ω 32.4Ω CSS 0.01µF RT 182KΩ G5174 RC 20KΩ CC 470PF VINA VIN EN RT COMP SS BS LX FB (0.803V) GND AGND EP CBS 0.1µF LO 1.0µH VOUT 1.8V CD*CO 22*2µF R1 100KΩ 80KΩ CZ* ＊ Option FB COMP TSSOP-14 (FD) G5174 RT SS LX LX BS EN VIN VINA VIN GND AGND GND Thermal Pad Note: Recommend connecting the Thermal Pad to the Ground for excellent power dissipation. VIN 3.3V to 5.5V CI 10µF 48.7Ω 32.4Ω CSS 0.01µF RT 182KΩ G5174 RC 20KΩ CC 470PF VINA VIN EN RT COMP SS BS LX FB (0.803V) GND AGND EP CBS 0.1µF LO 1.0µH VOUT 1.8V CD*CO 22*2µF R1 100KΩ 80KΩ CZ* ＊ Option