G3VM-101MT

G3VM-XMT OMRON | Alldatasheet

Document overview

• Manufacturer or author: OMRON
• PDF pages: 10

Technical content

G V M M T I M o d u l e G3VM-@MT MOS FET Relay Module 1 pA max. leakage current* contributes to high device reliability

• Equipped with a T-switch function to achieve fA-level minimal leakage current and contributes to measurement performance equivalent to conventional reed relays
• Contact form: 1a (SPST-NO) + T-switch function
• Contributes to reduction of the mounting space on the printed circuit board with a small package * VOFF = 20 V, 50 V, 80 V ■Application Example ■Ordering Information Note: 1. To order tape packaging for relays with surface-mounting terminals, add "(TR01)" to the end of the model number. Tape-cut packaging is packaged without humidity resistance. Use manual soldering to mount them. Note: 2. 500 pcs./reel packing is also available. Please contact your OMRON sales representative. * The AC peak and DC values are given for the load voltage and continuous load current. Absolute Maximum Rating (Ta = 25°C) Note: The product structure is sensitive to static electricity. When handling it, be sure to take measures against static electricity for the workbench, workers, soldering iron, and soldered mounted devices. * The dielectric strength between the input and output was checked by applying voltage between all pins as a group on the input (LED) side and all pins as a group on the output side (MOSFET). RoHS Compliant ■Package (Unit: mm) ■Model Number Legend Package Contact form Terminals Load voltage (peak value) * Continuous load current (peak value) * Tape cut packaging Tape packaging Main Sub Model Minimum package quantity Model Minimum package quantity Module 1a (SPST-NO) Surface- mounting Terminals

20 V 200 mA G3VM-21MT

1 pc. G3VM-21MT (TR01) 100 pcs.60 V 800 mA 400 mA G3VM-61MT G3VM-61MT (TR01)

100 V 550 mA G3VM-101MT G3VM-101MT (TR01)

Item Symbol G3VM-21MT G3VM-61MT G3VM-101MT Unit Measurement conditions Input LED forward current for main control IF Main 30 mA LED forward current for sub control IF Sub 30 mA LED forward current reduction rate ∆IF/°C -0.3 mA/°C Ta ≥ 25°C LED reverse voltage VR 5V Junction temperature Tj 125 °C Output Load voltage (AC peak/DC) VOFF 20 60 100 V Continuous load current (ACpeak/DC) IO Main 200 800 550 mAIO Sub 400 ON current reduction rate ∆IO Main/°C -2 -8 -5.5 mA/°C Ta ≥ 25°C∆IO Sub/°C -4 Pulse ON current IOP 600 2400 1650 mA t=100 ms, Duty=1/10 Junction temperature Tj 125 °C Dielectric strength between I/O * VI-O 500 Vrms AC for 1 min Ambient operating temperature Ta -40 to 110 °C With no icing or condensationAmbient storage temperature Tstg -40 to 125 °C Soldering temperature -2 60 ° C 10 s

• Semiconductor test equipment 3.75±0.1 5±0.1 2.7±0.2 G3VM- @ @ @ @ 1234 1. Load voltage 2: 20 V 6: 60 V 10: 100 V 3. Package M: MOS FET Relay Module 2. Contact form 1: 1a (SPST-NO) Note: See Device Function Modes on page 5. 4. Special function T: T switch function

G3VM-@MT MOS FET Relay Module G V M M T I M o d u l e ■Electrical Characteristics (Ta=25°C) *1. ILEAK measurement condition *2. Turn-ON and Turn-OFF Times (Main line) *3. Turn-ON and Turn-OFF Times (Sub line) Item Symbol G3VM-21MT G3VM-61MT G3VM-101MT Unit Measurement conditions Input LED forward voltage for main control VF Main Minimum 2.2 V IF Main=10 mATypical 2.54 2.42 Maximum 2.8 LED forward voltage for sub control VF Sub Minimum 1.1 IF Sub=10 mATypical 1.27 1.21 Maximum 1.4 Capacitance between main control terminals CT Main Typical 15 pF V=0, f=1 MHz Capacitance between sub control terminals CT Sub Typical 30 Trigger LED forward current IFT Main/Sub Maximum 3 mA IO=100 mA Release LED forward current IFC Main/Sub Minimum 0.1 I OFF=10 uA Output Maximum resistance with output ON RON Main Typical 80 .4 0 .8 Ω IF Main=5 mA, t<1 s IO Main=Continuous load current rated valueMaximum 12 0.8 1.5 Current leakage when the main line is open and sub line is close *1 ILEAK Maximum 1p A G3VM-21MT: VDD=20 V G3VM-61MT: VDD=50 V G3VM-101MT: VDD=80 V Capacitance between terminals COFF Typical 0.6 38 23 pF V=0, f=1 MHzMaximum 1- Capacitance between I/O terminals CI-O Typical 1 Insulation resistance between I/O terminals RI-O Minimum 1000 MΩ VI-O=500 VDC, RoH ≤ 60% Typical 108 Main line Turn-ON time tON Main Typical -0 . 7 5 0 . 6 ms G3VM-21MT: VDD=10V, G3VM-61MT/101MT: VDD=20V, IF Main=5 mA, RL=200 Ω Maximum 0.3 2.5 Main line Turn-OFF time tOFF Main Typical -0 . 0 4 Maximum 0.3 0.5 Sub line Turn-ON time tON Sub Typical -0 . 2 0 . 6 G3VM-21MT: VDD=10V, G3VM-61MT/101MT: VDD=20V, IF Main=5 mA, IF Sub=5 mA, RL=200 Ω Maximum 0 . 312 . 5 Sub line Turn-OFF time tOFF Sub Typical -0 . 0 4 Maximum 0.3 0.5 MOS FET RELAY C 456 12 3 IF VDD MOS FET RELAY B MOS FET RELAY A A Force Guard 456 12 3 IF VDD MOS FET RELAY C MOS FET RELAY B MOS FET RELAY A A OR 456 12 3 IF VDDVOUT VOUT t 10% 90% ON t OFF IF MOS FET RELAY C MOS FET RELAY B MOS FET RELAY A IF2 IF3 456 12 3 IF3IF2 VDDVOUT MOS FET RELAY C MOS FET RELAY B MOS FET RELAY A VOUT t 10% 90% ON t OFF

G3VM-@MT MOS FET Relay Module G V M M T I M o d u l e ■Recommended Operating Conditions For usage with high reliability, Recommended Operation Conditions is are measures that take into account the derating of Absolu te Maximum Ratings and Electrical Characteristics. Each item on this list is an independent condition, so it is not simultaneously satisfying conditions. ■Engineering Data Item Symbol G3VM-21MT G3VM-61MT G3VM-101MT Unit Load voltage (AC peak/DC) VDD Maximum 16 48 80 V Operating LED forward current IF Minimum 5 mA Typical 7.5 Maximum 20 Continuous load current (AC peak/DC) IO Main Maximum 200 800 550 IO Sub 400 Ambient operating temperature Ta Minimum -20 Maximum 85 LED forward current vs. Ambient temperature Continuous load current vs. Ambient temperature LED forward current vs. LED forward voltage G3VM-21MT G3VM-61MT G3VM-101MT Continuous load current vs. On-state voltage On-state resistance vs. Ambient temperature G3VM-21MT G3VM-61MT/101MT IF - Ta Ambient temperature Ta (°C) LED forward current IF (mA) (Maximum value) -40 0 20-20 40 60 80 100 120 IO - Ta 100 200 300 400 500 600 700 800 900 -40 -20 0 20 40 60 80 100 120 Ambient temperature Ta (°C) Continuous load current IO (mA) (Maximum value) G3VM-61MT (Main) G3VM-101MT G3VM-21MT G3VM-61MT (Sub) Note: G3VM-61MT Io differs between Main and Sub 1.0 1.5 2.0 2.5 0.1 100 Sub Main Ta=25°C IF - VF LED forward voltage VF (V) LED forward current IF (mA) (Average value) 1.0 1.5 2.0 2.5 Sub Main 0.1 100 IF - VF Ta=25°C LED forward voltage VF (V) LED forward current IF (mA) (Average value) 1.0 1.5 2.0 2.5 Sub Main 0.1 100 IF - VF Ta=25°C LED forward voltage VF (V) LED forward current IF (mA) (Average value) IO - VON G3VM-101MT G3VM-21MT G3VM-61MT -0.6 -0.2 0.2 0.6 On-state voltage VON (V) Continuous load current IO (mA) (Average value) Ta=25°C IF=5 mA, t<1 s -40 -20 0 20 40 60 80 100 120 RON - Ta Io Main=200 mA IF Main=5mA, t<1s Ambient temperature Ta (°C) On-state resistance RON (/g58) (Average value) 0.2 0.4 0.6 0.8 1.2 1.4 -40 -20 0 20 40 60 80 100 120 RON - Ta G3VM-61MT Io Main=800mA G3VM-101MT Io Main=550mA IF Main=5mA, t<1s G3VM-101MT G3VM-61MT Ambient temperature Ta (°C) On-state resistance RON (/g58) (Average value)

G3VM-@MT MOS FET Relay Module G V M M T I M o d u l e *1. Ambient temperature condition: 25°C *2. The high-frequency characteristics depend on the mounting board. Be sure to check operation in actual equipment before use. Trigger LED forward current vs. Ambient temperature Turn ON, Turn OFF time vs. LED forward current Current leakage vs. Load voltage Turn ON, Turn OFF time vs. Ambient temperature Current leakage vs. Ambient temperature Output terminal capacitance vs. Load voltage High-frequency Characteristics (Isolation) *1, *2 High-frequency Characteristics (Insertion Loss) *1, *2 G3VM-21MT G3VM-21MT 0.2 0.4 0.6 0.8 1.2 1.4 1.6 -40 -20 0 20 40 60 80 100 120 IFT - Ta Main G3VM-101MT G3VM-21MT G3VM-61MT Ambient temperature Ta (°C) Trigger LED forward current IFT (mA) (Average value) IO=100 mA, t<1 s 0.2 0.4 0.6 0.8 1.2 1.4 1.6 -40 -20 0 20 40 60 80 100 120 IFT - Ta Sub G3VM-101MT G3VM-21MT G3VM-61MT Ambient temperature Ta (°C) Trigger LED forward current IFT (mA) (Average value) IO=100 mA, t<1 s 0.01 0.1 11 0 100 tON, tOFF - IF tON tOFF Main VDD=10 V (G3VM-21MT) VDD=20 V (G3VM-61MT/101MT) RL = 200 /g58 Ta=25°C G3VM-101MT G3VM-21MT G3VM-61MT LED forward current IF (mA) Turn ON, Turn OFF time tON, tOFF (ms) (Average value) 0.01 0.1 11 0 100 tON, tOFF - IF tON tOFF Sub G3VM-21MT G3VM-61MT G3VM-101MT LED forward current IF (mA) Turn ON, Turn OFF time tON, tOFF (ms) (Average value) VDD=10 V (G3VM-21MT) VDD=20 V (G3VM-61MT/101MT) RL = 200 /g58 Ta=25°C 0.01 0.02 0.03 0.04 0.05 0.06 0.07 0.08 0.09 0.1 02 0 4 0 6 0 8 0 1 0 0 ILEAK - VOFF G3VM-101MT G3VM-21MT G3VM-61MT Load voltage VOFF (V) Current leakage ILEAK (pA) (Average value) Ta=25°C 0.01 0.1 -40 -20 0 20 40 60 80 100 120 tON, tOFF - Ta Main VDD=10 V (G3VM-21MT) VDD=20 V (G3VM-61MT/101MT) RL = 200 /g58 IF = 5 mA tON tOFFG3VM-101MT G3VM-21MT G3VM-61MT Ambient temperature Ta (°C) Turn ON, Turn OFF time tON, tOFF (ms) (Average value) 0.01 0.1 -40 -20 0 20 40 60 80 100 120 tON, tOFF - Ta Sub tON tOFF G3VM-101MT G3VM-61MT G3VM-21MT VDD=10 V (G3VM-21MT) VDD=20 V (G3VM-61MT/101MT) RL = 200 /g58 IF = 5 mA Ambient temperature Ta (°C) Turn ON, Turn OFF time tON, tOFF (ms) (Average value) VOFF=20V -40 -20 2004 0 60 80 100 120 ILEAK - Ta VOFF= 20 V (G3VM-21MT) VOFF= 50 V (G3VM-61MT) VOFF= 80 V (G3VM-101MT) G3VM-101MT G3VM-21MT G3VM-61MT 0.01 0.1 Ambient temperature Ta (°C) Current leakage ILEAK (pA) (Average value) 0.2 0.1 0.4 0.3 0.6 0.5 0.8 0.7 0.9 1.0 1.1 0 10 20 30 405 15 25 35 COFF - VOFF G3VM-101MT G3VM-21MT G3VM-61MT Load voltage VOFF (V) Output terminal capacitance COFF/COFF(0V) (Average value) Ta=25°C Frequency (GHz) Isolation (dB) (Average value) -60 -50 -40 -30 -20 -10 0.0001 0.001 0.01 0.1 1 Frequency (GHz) Insertion Loss (dB) (Average value) 0.0001 0.001 0.01 0.1 1 -10

G3VM-@MT MOS FET Relay Module G V M M T I M o d u l e ■Connection Example 1

• Device Functional Modes * * H: Optional setting, L: 0 V, X: don't care
• Timing Diagram * Both MOS FET relay A, C and MOS FET relay B may be ON at the same time. This products is recommended to use with dry switching (No Load & No Source when switching) to prevent short circuiting.
• Measurement Circuit Note: Above image are pin numbers 1-6. ■Connection Example 2
• Device Functional Modes * ●Timing Diagram * Both MOS FET relay A, C and MOS FET relay B may be ON at the same time. For that reason, even if pins 4, 5 and 6 are all connected, please design the circuit so that equipment damage does not occur.
• Measurement Circuit Circuit Control MOS FET RELAY A, C (Main line) MOS FET RELAY B (Sub line) ON H ON OFF OFF L OFF ON -X O FF O FF Control MOS FET RELAY A, C MOS FET RELAY B ON OFF ON OFF tON tOFF tON tOFF tON tONtOFF Driver signal, DC source etc. 456 12 3 DUT Current control resistance Current control resistance MOS FET RELAY C MOS FET RELAY B MOS FET RELAY A +Vcc IF Main IF Sub MOS FET RELAY A, C (Main line) MOS FET RELAY B (Sub line) H L ON OFF LH O FF O N LL O FF O FF IF Main tON tOFF MOS FET RELAY A, C MOS FET RELAY B ON OFF ON OFF IF Sub tON tOFF tON tOFF tON tOFF Driver signal, DC source etc. 456 12 3 DUT IF Sub IF Main MOS FET RELAY C MOS FET RELAY B MOS FET RELAY A DC source etc. 456 12 3 DUT Guard IF Sub IF Main MOS FET RELAY C MOS FET RELAY B MOS FET RELAY A OR

G3VM-@MT MOS FET Relay Module G V M M T I M o d u l e ■Appearance / Terminal Arrangement / Internal Connections

• Appearance Note 1. The actual product is marked differently from the image shown here. Note 2. "G3VM" does not appear in the model number on the relay.
• Terminal Arrangement/Internal Connections (Top view) ■Dimensions (Unit: mm) Note: The actual product is marked differently from the image shown here. Model name *Pin 1 mark Lot No. 0299M1 546 231 2TO * Actual model name marking for each model Model Marking G3VM-21MT 2T0 G3VM-61MT 6T0 G3VM-101MT AT0 456 12 3 Please visit our website, which is noted on the last page.CAD DataCAD Data 5±0.1 3.75±0.1 2.7±0.2 6-0.85±0.1 2.4±0.1 6-0.55±0.1 (0.23)(0.23) 1.6±0.1 12 3 456 6-1 2.1 2.4 1.6 6-0.7 Surface-Mounting Terminals Weight: 0.11 g Actual Mounting Pad Dimensions (Recommended Value, Top view) Unless otherwise specified, the dimensional tolerance is ± 0.1 mm. CAD Data

G3VM-@MT MOS FET Relay Module G V M M T I M o d u l e ■Safety Precautions Always turn OFF the power supply before wiring a relay. Not doing so may cause electrical shock. Do not touch the current-carrying parts of the pin section of a product while the power is being supplied. An electrical shock may occur. 1. Do not apply overvoltages or overcurrents to the input or output circuits of the product. The product may fail or ignite. 2. Perform soldering and wiring correctly according to specified soldering conditions. Using a product with incomplete soldering may cause overheating when power is applied, possibly resulting in burning.

• Derating You must consider derating to achieve the required system reliability. To use a product with high reliability, consider derating the maximum ratings and recommended operating conditions, and allow sufficient leeway in designs based on testing operation in the actual application under the actual operating conditions whenever possible. (1) Maximum Ratings The maximum ratings must never be exceeded even instantaneously. This applies individually to each of the ratings. If any of the maximum ratings is exceeded, the internal parts of the product may deteriorate or the chip may be destroyed. To ensure high reliability in using a product, sufficiently derate the maximum voltage, current, and temperature ratings when designing the application. (2) Recommended Operating Conditions The recommended operating conditions are to ensure that the product turns ON and OFF reliably. To ensure high reliability in using a product, consider the recommended operating conditions when you design the application. (3) Fail-Safe Design We recommend that you implement fail-safe measures in the design of the application if the failure of, deterioration of characteristics in, or functional errors in the product will have a serious affect on the safe operation of the system.
• Countermeasures for static electricity There is a risk of damage to internal elements and impairment of functionality if static electricity is discharged to the pins due to product handling or otherwise. Reduce the generation of static electricity as much as possible, and implement appropriate measures to prevent charge accumulation near the product.
• Typical Product Driving Circuit Examples The LED input side of the MOS FET is driven by current. If applying a voltage, add resistance in series with the circuit, so the specified current is applied. This resistance is referred as "LED current limiting resistance."
• To ensure that the product operates correctly, use the following formula to calculate the limiting resistance, and design the circuit accordingly. Note: To set the value of IF(ON), check the trigger LED current and recommended operation LED forward current indicated in the catalogue for each model, and set a high value with leeway.
• To ensure that the product resets reliably, calculate the reset voltage using the formula below, and control so that the voltage is lower than this value. Note: For the IF(OFF) value, set a value that is lower with leeway than the reset LED forward current indicated for each model in the catalogue.
• If the drive transistor has a large leakage current that may cause malfunctioning, add a bleeder resistance. WARNING Precautions for Safe Use Precautions for Correct Use 10 to 100 kΩ (bleeder resistor) Leak pass L +Vcc VF VIN VOL/OH 10 to 100 kΩ (bleeder resistor) L +Vcc VF VIN VOL/OH at MAIN ON/SUB OFF at MAIN OFF/SUB ON C-MOS C-MOS at MAIN ON/SUB OFF L +Vcc VF VIN VOL/OH C-MOS Leak pass L +Vcc VF VIN VOL/OH at MAIN OFF/SUB ON Transistor R1 = VCC − VOL − VF(ON) IF VF(OFF)=VCC − IF(OFF)R1 − VOH

G3VM-@MT MOS FET Relay Module G V M M T I M o d u l e

• Protection from Surge Voltage on the Input Pins
• If any reversed surge voltage is imposed on the input pins, insert a diode in parallel with the input pins as shown in the following circuit diagram and do not impose a reversed voltage of 3 V or higher.
• Protection from Spike Voltage on the Output Pins
• If there is an inductive load or other condition that will cause overvoltage that exceeds the absolute maximum rating between the output pins, connect a protective circuit to limit the overvoltage.
• Load Connection (1) Do not short-circuit the input and output pins while the prod- uct is operating or it may malfunction. (2) Do not connect the input and output in reverse. (3) Do not construct a circuit so that overcurrent and burning occur if the 4, 5 and 6 pins are short-circuited.
• Transportation (1) When transportation and installing the product, do not drop the product or subject it to abnormal vibration or shock. It may cause deterioration of product characteristics, malfunc- tion or failure. (2) Avoid transportation in the following conditions as it may cause failure or deterioration of characteristics.
• Circumstance subject to water or oil.
• Circumstance subject to high temperature or high humid- ity.
• Circumstance where the temperature changes radically and condensation occurs.
• State the product is not packed.
• Cleaning Flux from the Products (1) Clean flux from the product so that there will be no residue of reactive ions, such as sodium or chlorine. Some organic solvents will react with water to produce hydrogen chloride or other corrosive gases, which may cause deterioration of the products. (2) When washing off the flux with water, make sure that there will be no residue of reactive ions, particularly sodium or chlorine. (3) During water washing, do not scrub the marks on the surface of the product with a brush or your hand while there is clean- ing liquid on the product. The marks may come off. (4) Clean the flux from the products with the chemical action of the solvent for submersed cleaning, shower cleaning, or steam cleaning. To minimize the effect on the products, do not place the product in the solvent or steam for more than 1 minute at a temperature of 50°C. (5) If you use ultrasonic cleaning, keep the time short. If the cleaning time is too long, the sealing characteristics of the molded resin and frame materials may deteriorate. The recommended basic conditions are given below. Recommended Conditions for Ultrasonic Cleaning: Frequency: 27 to 29 kHz Ultrasonic wave output: 300 W max. (0.25 W/cm 2 max.) Cleaning time: 30 s max. Also, suspend the products in the cleaning solution so that the product and PCB do not come into direct contact with the ultra- sonic transducer. (6) Dry thoroughly after washing so that there is no residue of washing liquid.
• Solder Mounting Perform solder mounting under the following recommended conditions to prevent the temperature of the MOS FET Relays from rising. (Lead-free solder) SnAgCu recommended profile Note 1. We recommend that you verify the suitability of solder mounting under actual conditions. Note 2. When product is ordered with (TR01), tape package product is deliv- ered in moisture-proof packaging. If ordered without (TR01), tape-cut product is delivered in non moisture-proof packaging. Mount a tape cut product by manual soldering. Tape cut products absorb moisture be- cause a non moisture-proof package is used. Risk of package cracking or other damage due to thermal stress if reflow soldering is performed. Manual Soldering (Once Only) Perform manual soldering at 260°C for 10 s or less.
• Storage Conditions (1) Store the products where they will not be subjected to water leaks or direct sunlight. (2) When transporting or storing the product, observe all precau- tions on the packaging boxes. (3) Keep the storage location at normal temperature, normal humidity, and normal pressure. Guidelines for the tempera- ture and humidity are 5 to 35°C and a relative humidity of 45% to 75%. (4) Do not store the product in locations that are subject to corro- sive gases, such as hydrogen sulfide gas, or to salt spray, and do not store them where there is visually apparent dust, iron powder or dirt. Main Sub Surge Voltage Protection Circuit Example Spike Voltage Protection Circuit Example 60 to 120 60 to 150

30 MAX

Time (s) Reflow repititions: Up to twice 245 217 3°C/s 6°C/s 250°C PEAK 200 150 Surface Temperature of Package (°C)

G3VM-@MT MOS FET Relay Module G V M M T I M o d u l e (5) Store the product in a location that has a relatively stable temperature. Radical changes in temperature during storage will cause condensation, which may oxidize or corrode the leads and interfere with solder wetting. (6) If you remove products from the packages and then store them again, use storage containers that have measures to prevent static electricity. (7) Do not under any circumstances apply any force to the prod- ucts that would deform or alter them in any way. (8) This product is warranted for one year from the date of pur- chase or the date of delivery to the specified location. If the products are stored for more than about one year under normal conditions, we recommend that you confirm solder- ability before you use the products.

• Usage Conditions <Mounting> Do not install the product with oil or metal powder. This may cause insulation deterioration. <Temperature> The electrical characteristics of the products are limited by the application temperature. If you use them at temperatures outside of the operating temperature range, the electrical characteristics of the products will not be achieved and the products may deteriorate. For that reason, you must determine the temperature characteristics in advance and apply derating* to the design of the application. (*Derating reduces stress.) Consider derating in the operating temperature conditions and apply the recommended operating temperature as a guideline. <Humidity> To ensure long-term reliability, consider derating the operating humidity conditions and operate within the following humidity range. When operating in a high-humidity environment, moisture intrusion may cause deterioration or failure of the internal semiconductor elements. Also, in systems with high signal source impedance, leakage current between the board and product reeds can cause a malfunction. When operating in a low-humidity environment, suppress the generation of static electricity as much as possible and take appropriate measures to prevent static electricity buildup around the product. Static electricity discharge may damage the semiconductors inside the element and prevent normal operation. <Replace>
• Be sure to turn off the power when replacing parts. There is a risk of electric shock. <Disposal>
• This product uses compound semiconductors containing GaAs (gallium arsenide). Do not destroy, cut, crush or chemi- cally decompose the product as the powder and vapor gener- ated are harmful to the human body.
• Considerations when handling Products <Moisture proof package, MSL5> Surface mount products may have a crack when thermal stress is applied during surface mount assembly after they absorb atmospheric moisture. Therefore, please observe the following precautions. (1) This moisture proof bag may be stored unopened within 12 months at the following conditions. Temperature: 5°C to 30°C Humidity: 90% (Max.) (2) After opening the moisture proof bag, the devices should be assembled within 48 hours in an environment of 5°C to 30°C / 60%RH or below. (3) If upon opening, the moisture indicator card shows humidity 30% or above (Color of indication changes to pink) or the expiration date has passed, the devices should be baked in taping with reel. After baking, use the baked devices within 48 hours, but perform baking only once. Baking conditions: 120±5°C. For 72 hours. Expiration date: 12 months from sealing date, which is imprinted on the label affixed. (4) Repeated baking can cause the peeling strength of the tap- ing to change, then leads to trouble in mounting. Further- more, prevent the devices from being destructed against static electricity for baking of it. (5) If the packing material of laminate would be broken the her- meticity would deteriorate. Therefore, do not throw or drop the packed devices. (6) Tape-cut products are packaged without humidity resistance. Use manual soldering to mount them. (MSL not supported) -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 Allowable range 35°C/70% 85°C/7% Temperature Ta (°C) Relative humidity (%) Note: No icing or condensation within the operating temperature range.

G3VM-@MT MOS FET Relay Module G V M M T I M o d u l e Please check each region's Terms & Conditions by region website. OMRON Corporation Electronic and Mechanical Components Company Regional Contact Cat. No. K317-E1-02 0521(1119) Americas Europe Asia-Pacific China Korea Japan In the interest of product improvement, specifications are subject to change without notice. © OMRON Corporation 2019-2021 All Rights Reserved.