G300N50W4 ANAREN | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 7
Technical content
USA/Canada: Toll Free: Europe: (315) 432-8909 (800) 544-2414 +44 2392-232392 Model G300N50W4 REV A 5Z2050 Z E Features: RoHS Compliant 300 Watts 2.4 – 2.5 GHz AlN Ceramic Non-Nichrome Resistive Element Low VSWR 100% Tested Flange Mount Termination
Description
The G 300N50W4 is high performance Aluminum Nitride (AlN) flange mount termination . The performance is specifically tuned for ISM band 2.4-2.5GHz and is intended for use in RF heating applications. The termination is also RoHS compliant! General Specifications Resistive Element Thick Film Substrate AlN Ceramic Mounting Flange Nickel Plated Copper Operating Temperature -50 to +150C (see de rating chart) Tolerance is 0.010”, unless otherwise specified. Designed to meet of exceed applicable portions of MIL-E-5400. All dimensions in inches. Electrical Specifications Resistance Value: 50 Ohms Nominal Power: 300 Watts Frequency Range: 2.4GHz – 2.5GHz Return Loss >25dB: Specification based on unit properly installed using suggested mounting instructions and a 50 ohm nominal impedance. Specifications subject to change. Outline Drawing .975 .12 .5 .375 .675 .25 .488 .120 2x Ø.170 Thru .140 .163 .183 MaxUnless otherwise specified dimensions are in inches Top ViewSide View Front View .280 .040 2x R.040 Bottom View
300 Watts, 50
USA/Canada: Toll Free: Europe: (315) 432-8909 (800) 544-2414 +44 2392-232392 Model G300N50W4 Rev A Typical Performance with 30mil thick PCB and recommended Z-bend lead: G300N50W4 Return Loss Power De-rating: Mounting and Lead Stress Relief Options: *Actual performance could be limited by the solder properties of the application 25 50 75 100 125 150 100 Solder Interface Temperature -°C % Of Rated Power Board lower than lead Board even with lead Board lower than lead Board higher than lead Suggested stress relief methods Scale: None Not recommended application Scale: None Suggested Mounting Procedures: 1. Make sure that the devices are mounted on flat surfaces to optimize the heat transfer 2. Position devices on mounting surface and solder in place using appropriate solder 3. solder leads in place using appropriate solder type with a controlled temperature iron
USA/Canada: Toll Free: Europe: (315) 432-8909 (800) 544-2414 +44 2392-232392 Model G300N50W4 REV A 5Z2050 Recommended Test Fixture Dimensions for 30mil thick Dk 3.5 PCB Heat Sink .005 Gap .140 Landing Pad 50 Transmission Line .142 Landing Pad R.006 Min .02 Z-bend offset .137 .005 Gap A A Section A-A Heat Sink Metal cutback to prevent voltage breakdown/arcing Chip Flange (3mm) Top View Side View .03 PCB Copper/Gnd Copper/Gnd
USA/Canada: Toll Free: Europe: (315) 432-8909 (800) 544-2414 +44 2392-232392 Model G300N50W4 Rev A .279 PCB ground cutback .033 PCB ground cutback .305 .040 R.031 .040 .107 Section B-B Heat Sink B B Bottom View Top View PCB Copper/Gnd
USA/Canada: Toll Free: Europe: (315) 432-8909 (800) 544-2414 +44 2392-232392 Model G300N50W4 REV A 5Z2050 Recommended Test Fixture Dimensions for 20mil thick Dk 3.5 PCB Heat Sink .005 Gap .140 Landing Pad 50 Transmission Line .142 Landing Pad R.006 Min .02 Z-bend offset .02 PCB .137 .005 Gap A A Section A-A Heat Sink Metal cutback to prevent voltage breakdown/arcing Chip Flange (3mm) Top View Side View Copper/Gnd Copper/Gnd
USA/Canada: Toll Free: Europe: (315) 432-8909 (800) 544-2414 +44 2392-232392 Model G300N50W4 Rev A .279 PCB ground cutback .080 PCB ground cutback .305 .090 R.031 .090 .117 Section B-B Heat Sink B B Bottom View Top View PCB Copper/Gnd
USA/Canada: Toll Free: Europe: (315) 432-8909 (800) 544-2414 +44 2392-232392 Model G300N50W4 REV A 5Z2050 Resistive Product Qualification Flanged Visual Insp . Lot Mechanical Insp . N= 50 RF/ Electrical Test N= 50 Lead Pull Test N= 3 Continuous Power Test N= 3 RF/ Electrical Test N= 3 Microsection N= 3 Cycled Power Test N= 3 Electrical Test N= 3 Microsection N= 3