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Technical content
Features
Build-in one micro-steps drive mode is possible from 2-2 phase stepper drive to maximum 256 resolution micro-steps. Built in 2 full-swing/constant voltage drivers switched by serial control with brake function Built in 1 constant current drivers for shutter or IRIS Low on-resistance (1.2Ω, sum of on-resistance of upside and bottom side) Output current：IOUT<=0.8A(max.) for each channel Build-in thermal shutdown (TSD, 150 °C) All power supply systems (VCC, VM12, VM3, VM45) can be set up with an independent power supply Power save mode corresponds by serial control setup PI (photo interrupter drive) 3 channel built-in. Small 28TQFN (4 ×4mm) is adopted Build-in POR (power on reset).
Applications
Stepping motor driver/ DC motor driver motor d r i v e r f o r D S C General Description G2002/G2002B is a 5+1-channel H-Bridge motor drivers IC for the digital camera and so on. It has one micro-stepping driver, two full-swing/constant voltage drivers and one full-swing/constant current drivers. G2002 /G2002B can be operated in serial control mode or partial exterior control mode. When operating in partial exterior control mode, the mode of each CH is fixed by initial serial control setting. When operating in serial control mode, the mode of each driver can be setting by serial control.
Ordering Information
NUMBER MARKING TEMP. RANGE PACKAGE (Green) G2002RV1U 2002 -20 °C to +85°C TQFN4X4-28 G2002BRV1U 2002B -20 °C to +85°C TQFN4X4-28 Note: RV: TQFN4X4-28 1: Bonding Code U: Tape & Reel Pin Configurations CH12:Micro_stepping CH3 :CV/FS CH4 :CV/FS CH5 :CC only G2002/G2002B TQFN4X4-28 RNF5 OUT5B VM45 OUT4A P13 OUT4B OUT1A OUT1B VM12 OUT2A OUT2B OUT3A 6 16 IN5 OSCIN IN4 GND EXT OUT5A 25SLD VM3 VCC SCLK SDAT Thermal Pad (PGND12,PGND3) PI2 MOB/SDO P1115 IN328 OUT3B Note: Recommend connecting the Thermal Pad to the Ground for excellent power dissipation. G2002/G2002B TQFN4X4-28 RNF5 OUT5B VM45 OUT4A P13 OUT4B OUT1A OUT1B VM12 OUT2A OUT2B OUT3A 6 16 IN5 OSCIN IN4 GND EXT OUT5A 25SLD VM3 VCC SCLK SDAT Thermal Pad (PGND12,PGND3) PI2 MOB/SDO P1115 IN328 OUT3B Note: Recommend connecting the Thermal Pad to the Ground for excellent power dissipation.