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Technical content

Features

„ Depop Circuitry Integrated „ 2.8V to 5.5V Operation „ Output Power at 1% THD+N, VDD=5V --2W (typical) into a 4Ω Load --1.2W (typical) into a 8Ω Load „ Mono Bridge-Tied Load (BTL) „ Shutdown Control Available „ MSOP-10 (FD), TDFN3X3-10 and WLCSP3X3-9 Package Available

Applications

„ PDAs „ Mobile Phone „ Portable Devices „ Notebook General Description The G1901 is a mono class-D audio power amplifier in MSOP-10 (FD), TDFN3X3-10 and WLCSP3X3-9 with thermal pad package. It can drive 2W continuous RMS power into 4Ω load in Bridge-Tied Load (BTL) mode at 5V supply voltage. Its THD is smaller than 1% under the above operation condition. For the low current consumption applications, the SHDN mode is sup- ported to disable the G1901 when it is idle. The cur- rent consumption can be further reduced to below 1µA. Giving the SHUTDOWN pin low level will drive the G1901 entering the shutdown.

Ordering Information

NUMBER MARKING TEMP. RANGE PACKAGE (Green) G1901F61U G1901 -40°C to +85°C MSOP-10 (FD) G1901RE1U 1901 -40°C to +85°C TDFN3X3-10 G1901B91U 1901 -40°C to +85°C WLCSP3X3-9 Note:F6: MSOP-10 (FD) RE: TDFN3X3-10 B9: WLCSP3X3-9 1: Bonding Code U: Tape & Reel Pin Configuration PVDD VO- PGND VO+ SHUTDOWN Note: Recommend connecting the Thermal Pad to the Ground for excellent power dissipation. IN+ GND VDD NC MSOP-10 (FD) G1901 65I N - Thermal Pad TDFN3X3-10 G1901 3 8 3 8 Thermal Pad PVDD VO- PGND VO+ SHUTDOWN IN+ GND VDD NC IN- G1901 Bottom View WLCSP3X3-9 A3 A2 A1 B2 B1 C2 C1 VO- GND IN+ PGND PVDD VDD VO+ SHUTDOWN IN- PVDD VO- PGND VO+ SHUTDOWN PVDD VO- PGND VO+ SHUTDOWN Note: Recommend connecting the Thermal Pad to the Ground for excellent power dissipation. IN+ GND VDD NC MSOP-10 (FD) G1901 65I N - Thermal Pad TDFN3X3-10 G1901 3 8 3 8 Thermal Pad PVDD VO- PGND VO+ SHUTDOWN IN+ GND VDD NC IN- G1901 Bottom View WLCSP3X3-9 A3 A2 A1 B2 B1 C2 C1 VO- GND IN+ PGND PVDD VDD VO+ SHUTDOWN IN-