G1426 GMT | Alldatasheet
Document overview
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Technical content
Features
Depop Circuitry Integrated Output Power at 10% THD+N, VDD=5V --2.2W/CH (typical) into a 4ΩΩΩΩ Load Output Power at 1% THD+N, VDD=5V --2W/CH (typical) into a 4ΩΩΩΩ Load --1.2W/CH (typical) into a 8ΩΩΩΩ Load Bridge-Tied Load (BTL) Shutdown Control Available Thermal protection Surface-Mount Power Package 20-Pin TSSOP-P
Applications
Stereo Power Amplifiers for Notebooks or Desktop Computers Multimedia Monitors Stereo Power Amplifiers for Portable Audio Systems General Description The G1426 is a stereo audio power amplifier in 20pin TSSOP package. It can deliver 2W continuous RMS power into 4 Ω load per channel in Bridge-Tied Load (BTL) mode at 5V supply voltage under 1% THD. To simplify the audio system design in the notebook ap- plication, The G1426 supports the Bridge-Tied Load (BTL) mode for driving the speakers. For the low cur- rent consumption applications, the SHDN mode is supported to disable the G1426 when it is idle. The current consumption can be further reduced to below 2µA.
Ordering Information
NUMBER MARKING TEMP. RANGE PACKAGE G1426D5X G1426 -40°C to +85°C TSSOP-20L G1426F2X G1426 -40°C to +85°C TSSOP-20L (FD) Note: X Specify the packing type U: Tape & Reel T: Tube * TSSOP-20L (FD): Thermal Pad Pin Configuration GND/HS +OUTB VDD -OUTB -INB BYPASS SHUTDOWN +OUTA VDD -OUTA -INA GND/HS +INA NC G1426 20Pin TSSOP GND/HS Thermal Pad Top View Bottom View +INB 12 NC GND/HS NC GND/HS GND/HS +OUTB VDD -OUTB -INB BYPASS SHUTDOWN +OUTA VDD -OUTA -INA GND/HS +INA NC G1426 20Pin TSSOP GND/HS Thermal Pad Top View Bottom View +INB 12 NC GND/HS NC GND/HS
Ver: 1.0 Dec 04, 2003 TEL: 886-3-5788833 http://www.gmt.com.tw G1426 Global Mixed-mode Technology Inc. Absolute Maximum Ratings Operating Ambient Temperature Range T Maximum Junction Temperature, TJ…..……….….150°C Storage Temperature Range, TSTG….….-65°C to+150°C Soldering Temperature, 10seconds, TS……….……260°C Power Dissipation (1) Electrostatic Discharge, VESD Human body mode..…………………….-3000 to 3000 (2) Note: (1) : Recommended PCB Layout (2) : Human body model : C = 100pF, R = 1500Ω, 3 positive pulses plus 3 negative pulses
Electrical Characteristics
PARAMETER SYMBOL CONDITION MIN TYP MAX UNIT Supply Current I DD V DD = 5V - 8.5 15 mA DC Differential Output Voltage V O(DIFF) V DD = 5V,Gain = 2 - 5 50 mV IDD in Shutdown I SD V DD = 5V - 0.1 2 µA (AC Operation Characteristics, VDD = 5.0V, TA=+25°C, RL = 4ΩΩΩΩ, unless otherwise noted) PARAMETER SYMBOL CONDITION MIN TYP MAX UNIT THD = 1%, BTL, RL = 4Ω - 2 - THD = 1%, BTL, RL = 8Ω - 1.25 - THD = 10%, BTL, RL = 4Ω - 2.5 - Output power (each channel) see Note P (OUT) THD = 10%, BTL, RL = 8Ω - 1.6 - W PO = 1.6W, BTL, RL = 4Ω - 300 - PO = 1W, BTL, RL = 8Ω - 100 - Total harmonic distortion plus noise THD+N VI = 1V, RL = 10KΩ, G = 1 - 10 - Maximum output power bandwidth B OM G = 10, THD = 1% - 20 - kHz Phase margin R L = 4Ω, Open Load - 65 - ° Power supply ripple rejection PSRR f = 120Hz - 75 - dB Channel-to-channel output separation f = 1kHz - 80 - dB Input impedance ZI - 2 - M Ω Signal-to-noise ratio P O = 500mW, BTL - 90 - dB Output noise voltage V n Output noise voltage - 55 - µV (rms) Note :Output power is measured at the output terminals of the IC at 1kHz.
Ver: 1.0 Dec 04, 2003 TEL: 886-3-5788833 http://www.gmt.com.tw G1426 Global Mixed-mode Technology Inc. Pin Description PIN NAME I/O FUNCTION
1 SHUTDOWN I Shutdown mode control signal input, places entire IC in shutdown mode when held
high, IDD is below 2µA. 2,7,10,19,20 GND/HS Ground connection for circuitry, directly connected to thermal pad. 3 +OUTA O A channel + output 4,17 VDD Supply voltage for circuitry. 5 -OUTA O A channel - output 6 -INA I A channel input signal 8 +INA I A channel positive input of OPAMP, biasing DC operation of OPAMP
9 NC I NC
11 NC I NC
12 NC NC
13 +INB I B channel positive input of OPAMP, biasing DC operation of OPAMP 14 BYPASS Connect to voltage divider for internal mid-supply bias. 15 -INB I B channel input signal 16 -OUTB O B channel - output 18 +OUTB O B channel + output
Supply ripple rejection ratio Crosstalk Closed loop response 17 I DD Supply current PD Power dissipation TOTAL HARMONIC DISTORTION PLUS NOISE TOTAL HARMONIC DISTORTION PLUS NOISE vs OUTPUT POWER vs FREQUENCY vs Output power 19,20 FIGURE THD +N Total harmonic distortion plus noise vs Frequency 2,4,6,9,11 vs Output power 1,3,5,7,8,10 vs Frequency 13 vs Frequency 12 vs Frequency 14 vs Frequency vs supply voltage 15 P O Output power vs supply voltage 16 vs Load resistance 18 0.01 0.02 0.05 0.1 0.2 0.5 3m 35m 10m 20m 50m 100m 200m 500m 1 2 W VDD=5V RL=3Ω BTL Av=-2V/V 1kHz 20kHz 20Hz 0.01 0.02 0.05 0.1 0.2 0.5 20 20k50 100 200 500 1k 2k 5k 10k Hz Po=1.8W VDD=5V RL=3Ω BTL Av=-2V/V Figure 1 Figure 2 Global Mixed-mode Technology Inc. G1426 Ver: 1.0 Dec 04, 2003 TEL: 886-3-5788833 http://www.gmt.com.tw4
Ver: 1.0 Dec 04, 2003 TEL: 886-3-5788833 http://www.gmt.com.tw G1426 Global Mixed-mode Technology Inc. Block Diagram Application Circuits Amp A1 Amp A2 20kΩ 20kΩ 20kΩ -O U T A +OUT A Amp A1 Amp A2 20kΩ 20kΩ 20kΩ -O U T B +OUT B VDD RF 20kΩ 20kΩC1 1µF Audio Input Audio Input 1µF 20kΩ CS 1µF TANT 4,17 -IN A +IN A Bypass -IN B15 13 +IN B CB 0.33µF RF 20kΩ 9,11,12 NC
1 Shutdown
2,7,10,19,20 RL RL 50kΩ VDD/2 50kΩ Amp A1 Amp A2 20kΩ 20kΩ 20kΩ -O U T A +OUT A Amp A1 Amp A2 20kΩ 20kΩ 20kΩ -O U T B +OUT B VDD RF 20kΩ 20kΩC1 1µF Audio Input Audio Input 1µF 20kΩ CS 1µF TANT 4,17 -IN A +IN A Bypass -IN B15 13 +IN B CB 0.33µF RF 20kΩ 9,11,12 NC 2,7,10,19,20 RL RL 50kΩ VDD/2 50kΩ AmpA1 AmpA2 20kΩ 20kΩ 20kΩ -O U T A +OUT A AmpA1 Amp A2 20kΩ 20kΩ 20kΩ -O U T B +OUT B VDD 4,17 -IN A +IN A Bypass -IN B15 13 +IN B 9,11,12 NC 2,7,10,19,20 50kΩ VDD/2 50kΩ AmpA1 AmpA2 20kΩ 20kΩ 20kΩ -O U T A +OUT A AmpA1 Amp A2 20kΩ 20kΩ 20kΩ -O U T B +OUT B VDD 4,17 -IN A +IN A Bypass -IN B15 13 +IN B 9,11,12 NC 2,7,10,19,20 50kΩ VDD/2 50kΩ
Ver: 1.0 Dec 04, 2003 TEL: 886-3-5788833 http://www.gmt.com.tw G1426 Global Mixed-mode Technology Inc.
Package Information
NOTE: 1. Package body sizes exclude mold flash protrusions or gate burrs 2. Tolerance ±0.1mm unless otherwise specified 3. Coplanarity : 0.1mm 4. Controlling dimension is millimeter. Converted inch dimensions are not necessarily exact. 5. Follow JEDEC MO-153 DIMENSION IN MM DIMENSION IN INCH E1 E D b C L θ e y A E1 E D b C L θ e yy A
Ver: 1.0 Dec 04, 2003 TEL: 886-3-5788833 http://www.gmt.com.tw G1426 Global Mixed-mode Technology Inc. TSSOP-20L (FD) Package NOTE: 1. Package body sizes exclude mold flash protrusions or gate burrs 2. Tolerance ±0.1mm unless otherwise specified 3. Coplanarity : 0.1mm 4. Controlling dimension is millimeter. Converted inch dimensions are not necessarily exact. 5. Die pad exposure size is according to lead frame design. 6. Follow JEDEC MO-153 DIMENSION IN MM DIMENSION IN INCH Taping Specification GMT Inc. does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and GMT Inc. reserves the right at any time without notice to change said circuitry and specifications. Feed Direction Typical TSSOP Package Orientation Feed Direction Typical TSSOP Package Orientation E1 E D b C L θ e Note 5 y A E1 E D b C L θ e Note 5 yy A