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Technical content

Features

„ 7mA Quiescent Current. „ Ground-Referenced Outputs Eliminate DC-Bias Voltages on Headphone Ground Pin „ Popless Function Embedded „ 70mW Per Channel into 16Ω loads „ Low Distortion „ Large Output Voltage Swing. „ ±1.8V to ±3.6V Dual Power Operating Range „ Low Power Consumption. „ Over-Temperature Protection „ UVLO Embedded „ TDFN2X2-8 &TQFN3X3-16 Packages

Applications

„ Cellular Phone „ Notebooks „ PDAs „ MP3 Players „ Portable Audio Equipment General Description The G1412 stereo headphone driver is designed for portable equipment where board space is limited. The G1412 uses the dual external power supplies PVDD/NVDD to produce a ground-reference output, eliminating the need for large DC-blocking capacitors, saving cost, board space, and component height. The G1412 is a dual channel, low voltage, low power, and high performance amplifiers, which can deliver up to 70mW per channel into a 16Ω load with small THD+N performance. The G1412 operates from a dual ±1.8V to ±3.6V sup- plies, consumes only 7mA of supply current. With ex- cellent AC performance (small THD), it can be designed into a wide range of headphone driving application.

Ordering Information

NUMBER MARKING TEMP. RANGE PACKAGE (Green) REMARK G1412RC1U 1412 -40 °C ~ +85°C TDFN2X2-8 G1412R41U 1412 -40 °C ~ +85°C TQFN3X3-16 OBSOLETE Note: RC :TDFN2X2-8 R4:TQFN3X3-16 1: Bonding Code U: Tape & Reel Pin Configuration Typical Application Circuit LEFT AUDIO INPUT RIGHT AUDIO INPUT LEFT AUDIO OUTPUT RIGHT AUDIO OUTPUT NVDD RI RF RI RF GAIN = - ( ) RF RI TDFN2X2-8 G1412 OUTL PGND NVDD OUTR INR SHDN INL PVDD Thermal Pad G1412 TQFN3X3-16 INL NC1 SHDNR 12 NC NC SHDNL NC PGND PVDD

8 INR

Note: Recommend connecting the Thermal Pad to the Ground for excellent power dissipation. LEFT AUDIO INPUT RIGHT AUDIO INPUT LEFT AUDIO OUTPUT RIGHT AUDIO OUTPUT NVDD RI RF RI RF GAIN = - ( ) RF RI TDFN2X2-8 G1412 OUTL PGND NVDD OUTR INR SHDN INL PVDD Thermal Pad G1412 TQFN3X3-16 INL NC1 SHDNR 12 NC NC SHDNL NC PGND PVDD Note: Recommend connecting the Thermal Pad to the Ground for excellent power dissipation.