G133G

UPG133G NEC | Alldatasheet

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Technical content

µµµµµPG133G

DESCRIPTION

UPG133G is an L-Band SPDT (Single Pole Double Throw) GaAs FET switch which was developed for digital cellular or cordless telephone application. The device can operate from 100 MHz to 2.5 GHz, having the low insertion loss. It housed in an original 8 pin SSOP that is smaller than usual 8 pin SOP and easy to install and contributes to miniaturizing the system. It can be used in wide-band switching applications.

FEATURES

• Maximum transmission power : 0.25 W (typ.)
• Low insertion loss : 0.6 dB (typ.) at f = 2 GHz
• High switching speed : 10 ns
• Small package : 8 pins SSOP APPLICATION
• Digital cordless telephone : PHS, PCS, DECT etc.
• Digital hand-held cellular phone, WLAN

ORDERING INFORMATION

PART NUMBER PACKAGE PACKING FORM µPG133G-E1 8 pin plastic SSOP Carrier tape width 12 mm. QTY 2kp/Reel. For evaluation sample order, please contact your local NEC sales office. ABSOLUTE MAXIMUM RATINGS (T A = 25 ˚C) Control Voltage V CONT –6 to +0.6 V Input Power P in 25 dBm Total Power Dissipation P tot 0.2 W Operating Case Temperature T opt –65 to +90 ˚C Storage Temperature T stg –65 to +150 ˚C CAUTION: The IC must be handled with care to prevent static discharge because its circuit is composed of GaAs MES FET. L-BAND SPDT SWITCH Document No. P10733EJ2V0DS00 (2nd edition) Date Published April 1996 P Printed in Japan

µµµµµPG133G PIN CONNECTION DIAGRAM (Top View) SPDT SWITCH IC SERIES PRODUCTS PART Pin (1dB) LINS ISL VCONT PACKAGE APPLICATIONSNUMBER (dBm) (dB) (dB) (V) µPG130GR +34 0.5 @1G 32 @1G –5/0 8 pin SOP PDC, IS-136, PHS µPG131GR +30 0.6 @2G 23 @2G –4/0 (225 mil) PHS, PCS, WLAN µPG130G +34 0.5 @1G 32 @1G –5/0 8 pin SSOP PDC, IS-136, PHS µPG131G +30 0.6 @2G 23 @2G –4/0 (175 mil) PHS, PCS, WLAN µPG132G +30 0.6 @2G 22 @2G +3/0 PHS, PCS, WLAN µPG133G +25 0.6 @2G 20 @2G –3/0 DIVERSITY etc Remark: As for detail information of series products, please refer to each data sheet. EQUIVALENT CIRCUIT IN OUT1 GND VCONT1 VCONT2 GND OUT2 1. VCONT2 2. OUT2 3. GND 4. GND 5. IN 6. GND 7. OUT1 8. V CONT1

µµµµµPG133G RECOMMENDED OPERATING CONDITIONS PARAMETER SYMBOL MIN. TYP. MAX. UNIT Control Voltage (ON) V CONT –0.2 0 +0.2 V Control Voltage (OFF) V CONT –5.0 –3.0 –2.7 V Input Power Level P in 21 24 dBm ELECTRICAL CHARACTERISTICS (T A = 25 ˚C) CHARACTERISTICS SYMBOL MIN. TYP. MAX. UNIT TEST CONDITION Insertion Loss L INS 0.6 1.0 dB 0.8Note1 f = 2.5 GHz Isolation ISL 20 dB 20Note1 f = 2.5 GHz Input Return Loss RL in 11 20 dB f = 100 MHz to 2 GHz Output Return Loss RL out 11 20 dB V CONT1 = 0 V Input Power at 1dB Pin (1dB)Note2 21 25 dBm VCONT2 = –3 V Compression Point or Switching Speed t sw 10 ns V CONT1 = –3 V Control Current I CONT 50 µA VCONT2 = 0 V Notes 1: Characteristic for reference at 2.0 to 2.5 GHz 2: Pin (1dB) is measured the input power level when the insertion loss increase more 1dB than that of linear range. All other characteristics are measured in linear range. NOTE ON CORRECT USE

• Insertion loss and isolation of the IN-OUT2 is better than that of IN-OUT1, because No. 7 pin (OUT1) is placed to same side of No. 5 pin (IN).
• The distance between IC’s GND pins and ground pattern of substrate should be as shorter as possible to avoid parasitic parameters.

µµµµµPG133G TYPICAL CHARACTERISTICS (T A = 25 ˚C) Note This data is including loss of the test fixture. + 2.0 + 1.0 – 1.0 – 2.0 – 3.0 VCONT1 = –3 V VCONT2 = 0 V Pin = 0 dBm 100 M 200 M 500 M 1 G 2 G 3 G f - Frequency - Hz LINS IN OUT1 OUT2 50 Ω LINS - Insertion Loss - dB IN-OUT1 INSERTION LOSS vs. FREQUENCY –10 –20 – 30 – 40 – 50 VCONT1 = 0 V VCONT2 = –3 V Pin = 0 dBm 100 M 200 M 500 M 1 G 2 G 3 G f - Frequency - Hz ISL IN OUT1 OUT2 50 Ω ISL - Isolation - dB IN-OUT1 ISOLATION vs. FREQUENCY + 10 –10 – 20 – 30 – 40 VCONT1 = –3 V VCONT2 = 0 V Pin = 0 dBm 100 M 200 M 500 M 1 G 2 G 3 G f - Frequency - Hz RL in IN OUT1 OUT2 50 Ω RL in - Input Return Loss - dB IN-OUT1 INPUT RETURN LOSS vs. FREQUENCY + 10 –10 – 20 – 30 – 40 100 M 200 M 500 M 1 G 2 G 3 G f - Frequency - Hz RL OUT IN OUT1 OUT2 50 Ω RL out - Output Return Loss - dB IN-OUT1 OUTPUT RETURN LOSS vs. FREQUENCY VCONT1 = –3 V VCONT2 = 0 V Pin = 0 dBm

µµµµµPG133G + 2.0 + 1.0 – 1.0 – 2.0 – 3.0 VCONT1 = –3 V VCONT2 = 0 V Pin = 0 dBm 100 M 200 M 500 M 1 G 2 G 3 G f - Frequency - Hz LINS IN OUT1 OUT2 50 Ω LINS - Insertion Loss - dB IN-OUT2 INSERTION LOSS vs. FREQUENCY –10 –20 – 30 – 40 – 50 VCONT1 = 0 V VCONT2 = –3 V Pin = 0 dBm 100 M 200 M 500 M 1 G 2 G 3 G f - Frequency - Hz ISL - Isolation - dB IN-OUT2 ISOLATION vs. FREQUENCY + 10 –10 – 20 – 30 – 40 100 M 200 M 500 M 1 G 2 G 3 G f - Frequency - Hz RL in IN OUT1 OUT2 50 Ω RL in - Input Return Loss - dB IN-OUT2 INPUT RETURN LOSS vs. FREQUENCY + 10 –10 – 20 – 30 – 40 100 M 200 M 500 M 1 G 2 G 3 G f - Frequency - Hz RL OUT IN OUT1 OUT2 50 Ω RL out - Output Return Loss - dB IN-OUT2 OUTPUT RETURN LOSS vs. FREQUENCY ISL IN OUT1 OUT2 50 Ω VCONT1 = 0 V VCONT2 = –3 V Pin = 0 dBm VCONT1 = 0 V VCONT2 = –3 V Pin = 0 dBm

µµµµµPG133G Pin - Input Power - dBm IN OUT1 OUT2 50 Ω Pout - Output Power - dB IN-OUT2 Pin vs. Pout VCONT1 = 0 V VCONT2 = –3 V f = 1.9 GHz VCONT1 = 0 V VCONT2 = –3 V f = 2 GHz P in = +20 dBm Signal input (CW) 1.0 0.8 0.6 LINS (dB) –50 –60 –70 2fo, 3fo Harmonics (dBC) 3fo 2fo –100 –50 +50 +100 INSERTION LOSS, 2fo, 3fo vs. AMBIENT TEMPERATURE VCONT1 = 0 V VCONT2 = –3 V f = 2GHz Non-modulated signal input (CW) TA = –50 ˚C TA = +25 ˚C TA = +90 ˚C P in (dBm) Pout (dBm) INPUT POWER vs. OUTPUT POWER TA (˚C) LINS

µµµµµPG133G TEST BOARD R R IN 0.9 mm width. 0.4 mm thickness teflon glass R = 50 Ω NEC G130/131 OUT1 OUT2 VCONT1 VCONT2 Using the same board that of PG130/131G µ TEST CIRCUIT 50 Ω VCONT2 = 0 V/–3 V 1 000 pF OUT2 ZO = 50 Ω 50 Ω ZO = 50 Ω ZO = 50 Ω OUT1 1 000 pF VCONT1 = –3 V/0 V IN

µµµµµPG133G µµµµµPG133G TRUTH TABLE OF SWITCHING BY CONDITION OF CONTROL VOLTAGE VCONT1

0 V –3 V

–3 V 8-PIN PLASTIC SHRINK SOP (175 mil) (Unit mm) 3.0 MAX. 1.8 MAX. 1.5 ±0.1 0.1 ±0.1 0.575 MAX. 0.65 0.10 0.3 +0.10 –0.05 M 0.15 +0.10 –0.05 0.5 ±0.2 3.2 ±0.1 0.15 4.94 ±0.2 0.87 ±0.2 Detail of lead end IN OUT1 OUT2 OUT2 IN OUT1 IN OUT1 OUT2 OUT2 IN OUT1

µµµµµPG133G Floating the µµµµµPG133G It is possible to use the µPG133G with only a single +3 V supply by employing a technique known as “floating”. When the IC is floated using a +3 V supply, the voltage levels used to control the switch are elevated above ground by +3 V. When the µPG133G is floated it is necessary to use DC blocking (C2, C3, C5) and grounding (C1, C4) capacitors. This enables the IC to isolated so that +3 V can be applied to RF line. The value for DC blocking capacitors should be chosen to accommodate the frequency of operation. Grounding capacitors are required to float the IC above ground. The value for grounding capacitor should be chosen to accommodate the frequency of operation. It is not recommended to float the µPG133G for wide band application. (Floating the µPG133G with +3 V/0 V supply at 2 GHz-band, BW ≤ 50 MHz) PIN CONNECTIONS VCONT2 VCONT1 OUT2 GND OUT1 IN GND 1. VCONT2 2. OUT2 3. GND 4. GND 5. IN 6. GND 7. OUT1 8. V CONT1 C1, C4 = 10 pF below : Grounding capacitor C2, C3, C5 = 100 pF : DC blocking capacitor The distance between grounding capacitor and IC’s GND pins, grounding capacitor and ground of the substrate should be as shorter as possible to avoid the parasitic parameters. IC’s GND pin, No. 3, No. 4 and No. 6 are connected inside of the IC.

µµµµµPG133G RECOMMENDED SOLDERING CONDITIONS This product should be soldered in the following recommended conditions. Other soldering methods and conditions than the recommended conditions are to be consulted with our sales representatives. [µµµµµPG133G] Soldering process Soldering conditions Recommended condition symbol Infrared ray reflow Package peak temperature: 230 ˚C IR30-00-2 Hour: within 30 s. (more than 210 ˚C) Time: 2 time, Limited days: no.Note Hour: within 40 s. (more than 200 ˚C), Time: 2 time, Limited days: no.Note Wave Soldering Soldering tub temperature: less than 260 ˚C, Hour: within 10 s. WS60-00-1 Time: 1 time, Limited days: no.Note Pin part heating Pin area temperature: less than 300 ˚C, Hour: within 10 s. Limited days: no.Note Note It is storage days after opening a dry pack, the storage conditions are 25 ˚C, less than 65 %, RH. Caution The combined use of soldering method is to be avoided (However, except the pin area heating method).

µPG133G [MEMO]

µµµµµPG133G No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customer must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: “Standard“, “Special“, and “Specific“. The Specific quality grade applies only to devices developed based on a customer designated “quality assurance program“ for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices in “Standard“ unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact NEC Sales Representative in advance. Anti-radioactive design is not implemented in this product. M4 94.11 Caution The Great Care must be taken in dealing with the devices in this guide. The reason is that the material of the devices is GaAs (Gallium Arsenide), which is designated as harmful substance according to the Japanese law concerned. Keep the law concerned and so on, especially in case of removal.