G1117-XX GMT | Alldatasheet

Document overview

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Technical content

Features

„ Space Saving SOT-223 Package „ Internal Short Circuit Current Limiting „ Internal Over Temperature Protection „ Output Current in Excess of 1A

Applications

„ Post Regulation for Switching DC/DC Con- verter „ High Efficiency Linear Regulator „ Battery Charger „ Battery Powered Instrumentation „ Motherboard General Description The G1117-XX is a low dropout linear regulator with a dropout of 1.3V at 1A of load current. It is available in four fixed voltage: 1.5V, 1.8V, 2.5V, 3.3 and 3.5V versions. The G1117-XX provides over temperature and over current protection circ uits to prevent it from being damaged by abnormal operating conditions. The G1117-XX is available in SOT-223 packages. A minimum of 10 µF tantalum electrolytic capacitor is required at the output to improve the transient response and stability.

Ordering Information

(Pb free) MARKING TEMP. RANGE PACKAGE 1 2 3 G1117-15T43U G1117-15T43Uf 1117-15 -40°C~85°C TO-252 GND V OUT V IN G1117-18T43U G1117-18T43Uf 1117-18 -40°C~85°C TO-252 GND V OUT V IN G1117-25T43U G1117-25T43Uf 1117-25 -40°C~85°C TO-252 GND V OUT V IN G1117-33T43U G1117-33T43Uf 1117-33 -40°C~85°C TO-252 GND V OUT V IN G1117-35T43U G1117-35T43Uf 1117-35 -40°C~85°C TO-252 GND V OUT V IN G1117-15T63U G1117-15T63Uf 1117-15 -40°C~85°C SOT-223 GND V OUT V IN G1117-18T63U G1117-18T63Uf 1117-18 -40°C~85°C SOT-223 GND V OUT V IN G1117-25T63U G1117-25T63Uf 1117-25 -40°C~85°C SOT-223 GND V OUT V IN G1117-33T63U G1117-33T63Uf 1117-33 -40°C~85°C SOT-223 GND V OUT V IN G1117-35T63U G1117-35T63Uf 1117-35 -40°C~85°C SOT-223 GND V OUT V IN * For other package types and pin options, please contact us at sales@gmt.com.tw Order Number Identification GXXXX-XX XX X X Packing Type P i n O p t i o n Package Type V o l t a g e P a r t N u m b e r PACKAGE TYPE PIN OPTION PACKING T4: TO-252 1 2 3 U : Tape & Reel T6: SOT-223 3: GND V OUT V IN Package Type Typical Application [Note 4]: Type of COUT Top View 1 2 3 SOT-223 VIN G1117-XX 1µF VOUT IO COUT 10µF GND VIN VOUT Top View 1 2 3 TO-252 Top View 1 2 3 SOT-223 VIN G1117-XX 1µF VOUT IO COUT 10µF GND VIN VOUT Top View 1 2 3 TO-252

Ver: 1.5 Apr 18, 2006 TEL: 886-3-5788833 http://www.gmt.com.tw G1117-XXGlobal Mixed-mode Technology Inc. Absolute Maximum Ratings (Note 1) Power Dissipation Internally Limited (Note 2) Storage Temperature Range . . . -65°C ≤ TJ ≤+150°C Thermal Resistance Junction to Ambient, (θJA) Thermal Resistance Junction to Case, (θJC) Operating Conditions (Note 1) Note (1): See Recommended Minimum Footprint

Electrical Characteristics

Operating Conditions: VIN ≤ 6V, TJ = 25°C unless otherwise specified. [Note3] PARAMETER CONDITION MIN TYP MAX UNIT Output Voltage 10mA< IOUT < 1A 2% V O 3% V Line Regulation (V OUT + 1.5V) < VIN < 6V, IOUT = 10mA --- 3 30 mV Load Regulation V IN = 5V, 10mA < IOUT < 1A --- 35 50 mV Dropout Voltage ΔVOUT = 2%, IOUT = 1A --- 1.3 1.4 V Short Circuit Current --- 1.6 --- A Quiescent Current 0.3 0.6 1.5 mA Ripple Rejection f = 120Hz, C OUT = 10μF Tantalum, Vripple = 2VP-P, IOUT = 100mA --- 50 --- dB Thermal Resistor Junction-to-Ambient (No heat sink; No air flow) SOT-223; Recommended Minimum Footprint --- 116 --- °C/W Thermal Shutdown Junction Temperature --- 150 --- °C Note 1: Absolute Maximum Ratings are limits beyond whic h damage to the device may occur. Operating C onditions are conditions under which the device functions but the specifications might not be guaranteed. For guaranteed specifications and test conditions see the Electrical Characteristics. Note 2: The maximum power dissipation is a function of the maximum junction temperature, TJmax ; total thermal resistance, θJA, and ambient temperature TA. The maximum allowable power dissipation at any ambient temperature is T jmax-TA / θJA. If this dissipation is exceeded, the die temperature will rise above 150 °C and IC will go into thermal shutdown. For the G1117-XX in SOT-223 package; θJA is 116 °C/W; in the TO-252 package, θJA is 86 °C/W (See recommend minimum footprint). The safe operation in SOT-223, TO-252 package, it can see “Typical Performance Characteristics ” (Safe Operating Area). Note3: Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible. Note4: The type of output capacitor should be tantalum or aluminum. Definitions Output Voltage The G1117-XX provides in four fixed voltages = 1.5V, typically 600μA. Dropout Voltage The input/output Voltage differential at which the regulator output no longer maintains regulation against further reductions in input voltage. Measured when the output drops 2% below its nominal value. Dropout voltage is affected by junction temperature, load current and minimum input supply requirements. Line Regulation The change in output voltage for a change in input voltage. The measurement is made under conditions of low dissipation or by using pulse techniques such that average chip temperature is not significantly affected. Load Regulation The change in output voltage for a change in load cur- rent at constant chip temperature. The measurement is made under conditions of low dissipation or by using pulse techniques such that average chip temperature is not significantly affected. Maximum Power Dissipation The maximum total device dissipation for which the regulator will operate within specifications. Quiescent Bias Current Current which is used to operate the regulator chip and is not delivered to the load.

Ver: 1.5 Apr 18, 2006 TEL: 886-3-5788833 http://www.gmt.com.tw G1117-XXGlobal Mixed-mode Technology Inc. Typical Performance Characteristics VIN= 5V, CIN=1μF, COUT=10μF, TA=25°C, unless otherwise noted. (G1117-25) Ground Current vs. Load Current 0.00 0.20 0.40 0.60 0.80 1.00 1.20 1.40 1.60 1.80 2.00 0 100 200 300 400 500 600 700 800 900 1000 Load Current (mA) Ground Current (mA) Output Voltage vs. Load Current 2.480 2.500 2.520 2.540 2.560 2.580 2.600 0 100 200 300 400 500 600 700 800 900 1000 Load Current (mA) Ootput Voltage (V) Dropout Voltage vs. Load Current 100 200 300 400 500 600 700 800 900 1000 1100 1200 0 100 200 300 400 500 600 700 800 900 1000 Load Current (mA) Dropout Voltage (mV) Line Transient Load Transient Ch1: Vin (offset=5.0V) Ch2: Vout (offset=2.50V) CIN = 1uF Iout=100mA Ch1: Iout (1A/div) Ch2: Vout (offset=2.50V)

Ver: 1.5 Apr 18, 2006 TEL: 886-3-5788833 http://www.gmt.com.tw G1117-XXGlobal Mixed-mode Technology Inc. Typical Performance Characteristics (continued) 0.5 1.5 2.5 3.5 25 35 45 55 65 75 85 TAMB (oC) Max. Dissipation Power (W) A=0.5 A=1.0 A=1.5 A=2.0 A=2.5 A=3.0 A=3.5 A=4.0 A=4.5 A=5.0 0.5 1.5 2.5 3.5 PCB Top Copper Area (in2) Max. Dissipation Power (W) TO-252 Max. Power Dissipation vs. PCB Top Copper Area TO-252 Max. Power Dissipation vs. TAMB ( Still Air) Unit:in2 SOT-223 Max. Power Dissipation vs. PCB Top Copper Area TAMB (Still Air) Recommend Minimum Footprint TO-252 SOT-223 0.5 1.5 2.5 PCB Top Copper Area (in2) Max. Dissipation Power (W) 0.5 1.5 2.5 25 45 65 85 TAMB (oC) Max. Dissipation Power (W) A=0.5 A=1.0 A=1.5 A=2.0 A=2.5 A=3.0 A=3.5 A=4.0 A=4.5 A=5.0 SOT-223 Max. Power Dissipation vs. PCB Top Copper Area Unit:in2

Ver: 1.5 Apr 18, 2006 TEL: 886-3-5788833 http://www.gmt.com.tw G1117-XXGlobal Mixed-mode Technology Inc.

Package Information

TO-252 (T4) Package MILLIMETERS INCHES SYMBOL MIN. MAX. MIN. MAX. A 2.19 2.38 0.086 0.094 A1 0.89 1.27 0.035 0.050 b 0.64 0.89 0.025 0.035 C 0.46 0.58 0.018 0.023 D 5.97 6.22 0.235 0.245 E 6.35 6.73 0.250 0.265 E1 5.21 5.46 0.205 0.215 e 2.26BSC 0.09BSC e1 3.96 5.18 0.156 0.204 F 0.46 0.58 0.018 0.023 L1 0.89 2.03 0.035 0.080 L2 0.64 1.02 0.025 0.040 L3 2.40 2.80 0.095 0.110 H 9.40 10.40 0.370 0.410 θ 0° 4 ° 0 ° 4 ° F A E D b e Ce1 H θ F A E D b e Ce1 H θ

Ver: 1.5 Apr 18, 2006 TEL: 886-3-5788833 http://www.gmt.com.tw G1117-XXGlobal Mixed-mode Technology Inc. SOT-223 (T6) Package MILLIMETERS INCHES SYMBOLS MIN MAX MIN MAX A 1.55 1.80 0.061 0.071 A1 0.02 0.12 0.0008 0.0047 B 0.60 0.80 0.024 0.031 B1 2.90 3.10 0.114 0.122 C 0.24 0.32 0.009 0.013 D 6.30 6.70 0.248 0.264 E 3.30 3.70 0.130 0.146 e 2.30 BSC 0.090 BSC e1 4.60 BSC 0.181 BSC H 6.70 7.30 0.264 0.287 L 0.90 MIN 0.036 MIN L2 0.06 BSC 0.0024 BSC α 0° 10 ° 0 ° 10 ° Taping Specification PACKAGE Q ’TY/REEL SOT-223 2,500 ea TO-252 2,500 ea GMT Inc. does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and GMT Inc. reserves the right at any time without notice to change said circuitry and specifications. A B 13°(4X) e E D H C α 13°(4X) L Feed Direction Feed Direction Feed Direction Feed Direction Feed Direction Feed Direction