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Technical content

Features

 2-Bit Bi-Directional Translator for SDA and SCL Lines in Mixed-Mode I2C-Bus Applications  Standard-Mode, Fast-Mode, and Fast-Mode-Plus I2C-Bus and SMBus Compatible  Less than 1.5ns Maximum Propagation Delay to Accommodate Standard-Mode and Fast-Mode I2C-Bus Devices and Multiple Masters  Allows Voltage Level Translation Between:  VCCA = 1.0 to 3.6V and VCCB = 1.8- 5.0V  Supports I2C Clock Stretching and Multi-Master  Provides Bi-directional Voltage Translation without Direction Pin  Low 3.5Ω On-State Connection Between Input and Output Ports; Provides Less Signal Distortion  Open-Drain I2C-Bus I/O Ports (A0, A1, B0, and B1)  5V-Tolerant I2C-Bus I/O Ports to Support Mixed- Mode Signal Operation  Lock-Up-Free Operation  Flow-Through Pinout for Simpler Printed-Circuit Board Trace Routing  Packaged in 8-Terminal Leadless MicroPak™ (1.6mm x 1.6mm) and MSOP8 (TSSOP8)

Description

The FXWA9306 is a dual, bi-directional, I 2C-bus and SMBus, voltage-level translator with an enable (OE) input that is operational from 1.0V to 3.6V (V CCA) and 1.8V to 5.5V (VCCB) without requiring a direction pin. As with standard I 2C-bus systems, pull-up resistors are required to provide the logic HIGH levels on the translator’s bus. The FXWA9306 has a standard open- drain configuration of the I2C-bus. The size of these pull- up resistors depends on the system, but each side of the translator must have a pull-up resistor. The device is designed to work with Standard-Mode, Fast-Mode, and Fast Mode Plus I 2C-bus devices in addition to SMBus devices. The maximum frequency is dependent on the RC time constant, but generally supports > 2MHz. All channels have the same electrical characteristics and there is a minimum deviation from one output to another in voltage or propagation delay. This is a benefit over discrete transistor voltage translation solutions, since the fabricati on of the switch is symmetrical. The translator provides excellent ESD protection to lower voltage devices and at the same time protects less-ESD resistant devices. Figure 1. Block Diagram

Ordering Information

Temperature Range Top Mark Package Packing Method FXWA9306L8X -40 to +85°C LT 8-Lead, MicroPak™, 1.6mm Wide 5000 Units on Tape and Reel FXWA9306MUX -40 to +85°C 9306 8-Lead, MSOP Package, 3mm Wide 4000 Units on Tape and Reel

Figure 2. MicroPak™ (Top-Through View ) Figure 3. MSOP (Top-Through View)

1 GND Ground

2 V CCA Low Voltage A-Side Power Supply

3 A 0 A-Side Input or 3-State Output. Connect to V CCA through a pull-up resistor. 4 A 1 A-Side Input or 3-State Output. Connect to V CCA through a pull-up resistor. 5 B 1 B-Side Input or 3-State Output. Connect to V CCB through a pull-up resistor. 6 B 0 B-Side Input or 3-State Output. Connect to V CCB through a pull-up resistor.

7 V CCB High Voltage B-Side Power Supply

8 OE Output Enable Input; connect to V CCB and pull-up through a high resistor.

  1. If the OE pin is driven LOW, t he FXWA9306 is disabled and the A0, A1, B0, and B1 pins are forced into 3-state.
  2. OE references V CCB and the OE logic levels should be at least 1V higher than VCCA, for best translator operation.

© 2012 Semiconductor Components Industries, LLC. www.onsemi.com FXWA9306 • Rev. 2 3 FXWA9306 — Bi-Directional I2C-Bus® and SMBus Voltage-Level Translator Absolute Maximum Ratings Stresses exceeding the absolute maximum ratings may dam age the device. The device may not function or be operable above the recommended operating conditions and st ressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Symbol Parameter Min. Max. Units VCCA, VCCB Supply Voltage –0.5 7.0 V VIN DC Input Voltage A Port –0.5 7.0 B Port –0.5 7.0 Control Input (OE) –0.5 7.0 VO Output Voltage (3) An Outputs 3-State –0.5 7.0 V Bn Outputs 3-State –0.5 7.0 An Outputs Active –0.5 V CCA + 0.5V Bn Outputs Active –0.5 V CCB + 0.5V ICH DC Channel Current 90 mA IIK DC Input Diode Current At V IN < 0V –50 mA IOK DC Output Diode Current At VO < 0V –50 mA At VO > VCC +50 IOH / IOL DC Output Source/Sink Current –50 +50 mA ICC DC V CC or Ground Current per Supply Pin ±100 mA TSTG Storage Temperature Range –65 +150 °C ILATCHUP Latch-up Performance Above V CC and below GND at 125°C +100 mA ESD Electrostatic Discharge Capability Human Body Model, JESD22-A114-A > 4000 V Human Body Model, Pin to Pin, B Port(4) > 8000 Charged Device Model, JESD22-A115-A > 1000 Notes: 3. I O absolute maximum rating must be observed. 4. Test conditions: B0 and B1 vs. V CCB, B0 and B1 vs. GND, VCCB vs. GND Recommended Operating Conditions The Recommended Operating Conditions table defines th e conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datash eet specifications. ON Semiconductor does not recommend exceeding them or designing to Absolute Maximum Ratings. Symbol Parameter Min. Max. Units VCCA Power Supply Operating 1.0 5.5 V VCCB Power Supply Operating 1.8 5.5 V VIN Input Voltage A Port 0 5.5 V B Port 0 5.5 Control Input (OE) 0 5.5 JA Thermal Resistance, Junction to Ambient 470 C°/W ISW(pass) Pass Switch Current 0 64 mA TA Free Air Operating Temperature –40 +85 °C Notes: 5. All unused inputs and I/O pins must be held at V CCI or GND. 6. V CCA < VCCB -1V for best results in level-shifting applications.

© 2012 Semiconductor Components Industries, LLC. www.onsemi.com FXWA9306 • Rev. 2 4 FXWA9306 — Bi-Directional I2C-Bus® and SMBus Voltage-Level Translator Unless otherwise noted, values are at TA = –40°C to +85°C; all typical values are at TA = 25°C. Symbol Parameter Conditions Min. Typ. Max. Unit VIK Input Clamping Voltage I I = -18mA; VI(OE) = 0V -1.2 V IIH High-Level Input Current V I = 5V; VI(OE) = 0V 5 µA Ci(OE) OE Pin Input Capacitance V I = 3V or 0V 7.1 pF Ci/O(off) Off-State I/O Pin Capacitance A0, A1, B0, B1 VO = 3V or 0V; VI(OE) = 0V 4 6 pF Ci/O(on) On-State I/O Pin Capacitance A0, A1, B0, B1 VO = 3V or 0V; VI(OE) = 3V 9.3 12.5 pF RON(7) On-State Resistance A0/B0, A1/B1 VI = 0V; IO = 64mA Ω VI(OE) = 3V 3.0 6.0 VOL Voltage Output Low VCCA = 1V, VPUD = 5V, IOL = 3mA (B->A Dir) VIN (B0 or B1) = 0.1V 0.15 V VIN (B0 or B1) = 0.2V 0.25 VIN (B0 or B1) = 0.3V 0.35 VIN (B0 or B1) = 0.4V 0.45 Notes: 7. Measured by the voltage drop between the A0 and B0 or A1 and B1 terminals at the indicated current through the switch. On-state resistance is determined by the lowest voltage of the two terminals.

© 2012 Semiconductor Components Industries, LLC. www.onsemi.com FXWA9306 • Rev. 2 5 FXWA9306 — Bi-Directional I2C-Bus® and SMBus Voltage-Level Translator TA = –40°C to +85°C. Direction is from B port to A port (translating down). Values guaranteed by design. Symbol Parameter Conditions Load Condition: Min: Max. Units tPLH Low-to-High Propagation Delay, from (Input) B0 or B1 to (Output) A0 or A1 V I(OE) = 3.3V; VIH = 3.3V; VIL = 0V; VM = 1.15V; VCCA = 2.3V CL = 15pF 0 0.60 ns CL = 30pF 0 1.20 CL = 50pF 0 2.00 tPHL High-to-Low Propagation Delay, from (Input) B0 or B1 to (Output) A0 or A1 CL = 15pF 0 0.75 ns CL = 30pF 0 1.50 CL = 50pF 0 2.00 tPLH Low-to-High Propagation Delay, from (Input) B0 or B1 to (Output) A0 or A1 V I(OE) = 2.5V; VIH = 2.5V; VIL = 0V; VM = 0.75V; VCCA = 1.5V CL = 15pF 0 0.60 ns CL = 30pF 0 1.20 CL = 50pF 0 2.00 tPHL High-to-Low Propagation Delay, from (Input) B0 or B1 to (Output) A0 or A1 CL = 15pF 0 0.75 ns CL = 30pF 0 1.50 CL = 50pF 0 2.00 tPLH Low-to-High Propagation Delay, from (Input) A0 or A1 to (Output) B0 or B1 V I(OE) = 3.3V; VIH = 2.3V; VIL = 0V; VTT = 3.3V; VM = 1.15V; VCCA = 2.3V; RL = 300Ω CL = 15pF 0 0.50 ns CL = 30pF 0 1.00 CL = 50pF 0 1.75 tPHL High-to-Low Propagation Delay, from (Input) A0 or A1 to (Output) B0 or B1 CL = 15pF 0 0.80 ns CL = 30pF 0 1.65 CL = 50pF 0 2.75 tPLH Low-to-High Propagation Delay, from (Input) A0 or A1 to (Output) B0 or B1 VI(OE) = 2.5V; VIH = 1.5V; VIL = 0V; VTT = 2.5V; VM = 0.75V; VCCA = 1.5V; RL = 300Ω CL = 15pF 0 0.50 ns CL = 30pF 0 1.00 CL = 50pF 0 1.75 tPHL High-to-Low Propagation Delay, from (Input) A0 or A1 to (Output) B0 or B1 CL = 15pF 0 1.00 ns CL = 30pF 0 2.00 CL = 50pF 0 3.30

Figure 4. Load Circuit

  1. S1 = translating up (A-to-B direction), S2 = translating down (B-to-A direction).
  2. C L includes probe and jig capacitance.
  3. All input pulses are supplied by generators having the following characteristics: PRR < 10MHz; ZO = 50Ω;
  4. The outputs are measured one at a time , with one transmission per measurement.

© 2012 Semiconductor Components Industries, LLC. www.onsemi.com FXWA9306 • Rev. 2 7 FXWA9306 — Bi-Directional I2C-Bus® and SMBus Voltage-Level Translator

Application Information

Figure 5. Application (Switch Always Enabled) Figure 6. Application (Switch Enable Control)

  1. The applied voltages at V CCA and VPU(D) should be such that VCCB is at least 1V higher than VCCA for best

the OE input. A filter capacitor on VCCB is recommended. direction control is needed. has a maximum output voltage equal to VPU(D). Table 1. Application Operating Conditions (refer to Figure 6) All typical values are at TA = 25°C. through the FXWA9306 device.

Table 2. Application Operating Conditions Calculated for VOL = 0.35V; assumes output driver VOL = 0.175V at stated current.

  1. +10% to compensate for V CC range and resistor tolerance.

higher frequencies if used correctly. FXWA9306 close to the processor. flight to reduce ringing and reflections. higher the frequency the device can use. reduce overshoot in some cases. either side of the bus when both sides are connected. is disabled and provides level translation when active. of the delays added to the translator. pull-up supply voltage (V PU(D)) by the pull-up resistors. functions as the A1/B1 channel.

Figure 7. 8-Lead MicroPak™, 1.6mm Wide

Figure 8. 8-Lead MSOP, 3.0mm Wide

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