FXPS7550A4S_V01 NXP | Alldatasheet

Document overview

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Technical content

Datasheet sections

  • 1 General description
  • 2 Features and benefits
  • 3 Applications
  • 3.1 Automotive
  • 3.2 Industrial
  • 3.3 Medical/Consumer
  • 4 Ordering information
  • 4.1 Ordering options
  • 5 Block diagram
  • 6 Pinning information
  • 6.1 Pinning
  • 6.2 Pin description
  • 7 Functional description
  • 7.1 Voltage regulators
  • 7.2 Pressure sensor signal path
  • 7.2.2 Digital signal processor (DSP)
  • 7.2.2.1 Decimation sinc filter
  • 7.2.2.2 Signal trim and compensation
  • 7.2.2.3 Low-pass filter
  • 7.3 Analog output function
  • 7.3.1 Analog output signal chain
  • 7.3.2 Analog output transfer function
  • 8 Maximum ratings
  • 9 Operating range
  • 10 Static characteristics
  • 11 Dynamic characteristics
  • 12 Media compatibility—pressure sensors
  • 13 Application information
  • 14 Package outline
  • 15 Soldering
  • 16 Mounting recommendations
  • 17 References
  • 18 Revision history

Analog absolute pressure sensor, 20 kPa to 550 kPa Rev. 1.2 — 3 November 2023 Product data sheet

1 General description

The FXPS7550A4S high-performance, high-precision absolute pressure sensor consists of a compact capacitive micro-electro-mechanical systems (MEMS) device coupled with a digital integrated circuit (IC) producing a fully calibrated analog output. This sensor is ideal for many automotive applications such as manifold air pressure (MAP), turbo MAP, comfort seating, and other applications requiring operating absolute pressure ranges up to 550 kPa. The sensing element is based on NXP's high precision capacitive pressure cell technology. The architecture benefits from redundant pressure transducers as an expanded quality measure. It delivers highly accurate ratiometric analog readings of absolute pressure while operating from either a 3.3 V or 5.0 V power supply. The sensor operates over a pressure range of 20 kPa to 550 kPa and over a wide temperature range of –40 ºC to 130 ºC. The sensor comes in an industry-leading 4 mm x 4 mm x 1.98 mm, restriction of hazardous substances (RoHS) compliant, high-power quad flat no-lead (HQFN) package[1] suitable for small printed circuit board (PCB) integration. Its AEC-Q100[2] compliance, high accuracy, reliable performance, and high media resistivity make it ideal for use in automotive, industrial, and consumer applications.

2 Features and benefits

  • Absolute pressure range: 20 kPa to 550 kPa
  • Operating temperature range: –40 °C to 130 °C
  • Analog output for monitoring of the absolute pressure signal
  • Pressure transducer and digital signal processor (DSP) – Internal self-test
  • Capacitance to voltage converter with anti-aliasing filter
  • Sigma delta ADC plus sinc filter
  • 800 Hz or 1000 Hz low-pass filter for absolute pressure
  • Lead-free, 16-pin HQFN, 4 mm x 4 mm x 1.98 mm package

3 Applications

3.1 Automotive

  • Manifold air pressure – MAP, TurboMAP
  • Small engine control
  • Liquid propane gas (LPG) or compressed natural gas (CNG) engine management

3.2 Industrial

  • Compressed air
  • Manufacturing line control
  • Gas metering
  • Weather stations

3.3 Medical/Consumer

  • Blood pressure monitor
  • Medicine dispensing systems
  • White goods

4 Ordering information

Table 1. Ordering information

4.1 Ordering options

Table 2. Ordering options [1] Product under development, consult your NXP sales representatives for samples. FXPS7550A4S All information provided in this document is subject to legal disclaimers. © 2023 NXP B.V. All rights reserved.

5 Block diagram

Figure 1. Block diagram of FXPS7550A4S

6 Pinning information

6.1 Pinning

17 ANALOG_OUT

Figure 2. Pin configuration for 16-pin HQFN FXPS7550A4S All information provided in this document is subject to legal disclaimers. © 2023 NXP B.V. All rights reserved.

6.2 Pin description

2, 8, 9, 10 TEST Pins 2, 8, 9, and 10 are test pins and must be left unterminated in the application. 3 TEST Pin 3 is required to be tied to VCC for device operation. 4, 15 VSS Pins 4 and 15 are the supply return nodes and are connected internally to the die attach pad (pin 17). 5, 11 TEST Pins 5 and 11 are test pins and must be tied to VSS. 6, 7, 14 NC Pins 6, 7 and 14 are not internally connected and can be left unconnected in the application. 12 ANALOG_OUT Pin 12 provides a ratiometric analog output proportional to the absolute pressure sensor data. these pins and VSS, as shown in the application diagram. 17 PAD Pin 17 is the die attach flag and must be connected to VSS. Table 3. Pin description

7 Functional description

7.1 Voltage regulators

for VCC, as shown in Figure 12. A reference generator provides a reference voltage for the ΣΔ converter. FXPS7550A4S All information provided in this document is subject to legal disclaimers. © 2023 NXP B.V. All rights reserved.

Figure 3. Voltage regulation and monitoring

7.2 Pressure sensor signal path

input to the DSP. A simplified block diagram is shown in Figure 4. FXPS7550A4S All information provided in this document is subject to legal disclaimers. © 2023 NXP B.V. All rights reserved.

Figure 4. ΣΔ converter block diagram The sigma delta modulator operates at a frequency of 1 MHz, with the transfer function in Equation 1.

7.2.2 Digital signal processor (DSP)

within the DSP is shown in Figure 5. Figure 5. Signal chain diagram

7.2.2.1 Decimation sinc filter

sinc filters; the first with a decimation ratio of 24 and the second with a decimation ratio of 4. FXPS7550A4S All information provided in this document is subject to legal disclaimers. © 2023 NXP B.V. All rights reserved.

Figure 6. Sinc filter response

7.2.2.2 Signal trim and compensation

The device includes digital trim to compensate for sensor offset, sensitivity, and nonlinearity over temperature.

7.2.2.3 Low-pass filter

function and coefficients shown in Equation 3.

1000 Hz (dB)

Table 4. IIR low pass filter coefficients FXPS7550A4S All information provided in this document is subject to legal disclaimers. © 2023 NXP B.V. All rights reserved.

Figure 9. 1000 Hz, 4-pole, low-pass filter response Figure 10. 1000 Hz, 4-pole output signal delay

7.3 Analog output function

7.3.1 Analog output signal chain

The device provides an analog output ratiometric to the supply voltage. The analog output is enabled by default.

  • The non-interpolated PABS sensor data output is saturated to 10 bits and converted to an unsigned value.
  • The 10-bit sensor value is input into a summer clocked at 10 MHz.
  • The carry from the summer circuit generates a PCM output.
  • The PCM signal is filtered by a 2-pole active low pass filter to generate an analog signal.

7.3.2 Analog output transfer function

The FXPS7550A4S device provides an analog output voltage ratiometric to the supply voltage. FXPS7550A4S All information provided in this document is subject to legal disclaimers. © 2023 NXP B.V. All rights reserved.

their magnitude by applying the ratio of (VCC / 5 V) to each of these parameters. and then applying the error percentages to obtain these variations if needed. The analog output transfer function for a 5.0 V supply is as shown in Figure 11. Figure 11. Analog output transfer function

8 Maximum ratings

it. Absolute maximum ratings are stress ratings only; functional operation at these ratings is not guaranteed. Exposure to absolute maximum ratings conditions for extended periods might affect device reliability. voltages to this high-impedance circuit. Table 5. Maximum ratings FXPS7550A4S All information provided in this document is subject to legal disclaimers. © 2023 NXP B.V. All rights reserved.

Table 5. Maximum ratings...continued [1] Parameter verified by parametric and functional validation. [2] Parameter verified by qualification testing (Per AEC-Q100 Rev H or per NXP specification). [3] Functionality verified by modeling, simulation and/or design verification. [5] CDM tested at ±750 V for corner pins and ±500 V for all other pins. This device is sensitive to mechanical shock. Improper handling can cause permanent damage to the part. This is an ESD sensitive device. Improper handling can cause permanent damage to the part.

9 Operating range

VCC_min ≤ (VCC - VSS) ≤ VCC_max, TL ≤ TA ≤ TH, ΔT ≤ 25 °C/min, unless otherwise specified. TA VCC = 5.0 V, unless otherwise stated. Table 6. Electrical characteristics — supply and I/O [1] Parameter tested at final test. [2] Functionality verified by modeling, simulation and/or design verification. [3] Parameter verified by parametric and functional validation. FXPS7550A4S All information provided in this document is subject to legal disclaimers. © 2023 NXP B.V. All rights reserved.

10 Static characteristics

VCC_min ≤ (VCC - VSS) ≤ VCC_max, TL ≤ TA ≤ TH, ΔT ≤ 25 °C/min, unless otherwise specified. PACC_HiT Absolute pressure accuracy VCC = 5.0 V. PACC_Typ Absolute pressure accuracy VCC = 5.0 V. PACC_LoT Absolute pressure accuracy VCC = 5.0 V. Table 7. Static characteristics [1] Parameter verified by pass/fail testing at final test. [2] Functionality verified by modeling, simulation and/or design verification. [3] Parameter verified by characterization. [4] Parameter tested at final test. [5] Parameter verified by functional evaluation. FXPS7550A4S All information provided in this document is subject to legal disclaimers. © 2023 NXP B.V. All rights reserved.

11 Dynamic characteristics

VCC_min ≤ (VCC – VSS) ≤ VCC_max, TL ≤ TA ≤ TH, ΔT ≤ 25 °C/min, unless otherwise specified. Table 8. Dynamic characteristics [1] Functionality verified by modeling, simulation and/or design verification. [2] Parameter verified by functional evaluation.

12 Media compatibility—pressure sensors only

For more information regarding media compatibility information, contact your local sales representative. published in this data sheet. cause the device to cease operating in the worst case. contact an NXP sales representative. molecules may collect, form bubbles and possibly result in delamination of the gel from the material it protects. listed in the data sheet. In rare cases, the bubble may bend the bond wires and result in a permanent shift. Figure 12. Application diagram of FXPS7550A4 FXPS7550A4S All information provided in this document is subject to legal disclaimers. © 2023 NXP B.V. All rights reserved.

Table 9. External component recommendations FXPS7550A4S All information provided in this document is subject to legal disclaimers. © 2023 NXP B.V. All rights reserved.

Figure 13. Package outline HQFN (SOT1573-1) FXPS7550A4S All information provided in this document is subject to legal disclaimers. © 2023 NXP B.V. All rights reserved.

Figure 14. Package outline detail HQFN (SOT1573-1) FXPS7550A4S All information provided in this document is subject to legal disclaimers. © 2023 NXP B.V. All rights reserved.

Figure 15. Package outline note HQFN (SOT1573-1) FXPS7550A4S All information provided in this document is subject to legal disclaimers. © 2023 NXP B.V. All rights reserved.

15 Soldering

Figure 16. SOT1573-1 PCB design guidelines - Solder mask opening pattern FXPS7550A4S All information provided in this document is subject to legal disclaimers. © 2023 NXP B.V. All rights reserved.

Figure 17. SOT1573-1 PCB design guidelines - I/O pads and solderable area FXPS7550A4S All information provided in this document is subject to legal disclaimers. © 2023 NXP B.V. All rights reserved.

Figure 18. SOT1573-1 PCB design guidelines - Solder paste stencil FXPS7550A4S All information provided in this document is subject to legal disclaimers. © 2023 NXP B.V. All rights reserved.

16 Mounting recommendations

A plugged port exhibits no change in pressure and can be cross checked in the user software. Refer to NXP application note AN1902[1] for proper printed circuit board attributes and recommendations.

17 References

Modifications: • Section 12, inserted a new disclaimer note. Table 10. Revision history FXPS7550A4S All information provided in this document is subject to legal disclaimers. © 2023 NXP B.V. All rights reserved.

NXP Semiconductors FXPS7550A4S Analog absolute pressure sensor, 20 kPa to 550 kPa Legal information Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term 'short data sheet' is explained in section "Definitions". [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL https://www.nxp.com. Definitions Draft — A draft status on a document indicates that the content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included in a draft version of a document and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at https://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. FXPS7550A4S All information provided in this document is subject to legal disclaimers. © 2023 NXP B.V. All rights reserved. Product data sheet Rev. 1.2 — 3 November 2023

NXP Semiconductors FXPS7550A4S Analog absolute pressure sensor, 20 kPa to 550 kPa Suitability for use in automotive applications — This NXP product has been qualified for use in automotive applications. If this product is used by customer in the development of, or for incorporation into, products or services (a) used in safety critical applications or (b) in which failure could lead to death, personal injury, or severe physical or environmental damage (such products and services hereinafter referred to as “Critical Applications”), then customer makes the ultimate design decisions regarding its products and is solely responsible for compliance with all legal, regulatory, safety, and security related requirements concerning its products, regardless of any information or support that may be provided by NXP. As such, customer assumes all risk related to use of any products in Critical Applications and NXP and its suppliers shall not be liable for any such use by customer. Accordingly, customer will indemnify and hold NXP harmless from any claims, liabilities, damages and associated costs and expenses (including attorneys’ fees) that NXP may incur related to customer’s incorporation of any product in a Critical Application. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Translations — A non-English (translated) version of a document, including the legal information in that document, is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. Security — Customer understands that all NXP products may be subject to unidentified vulnerabilities or may support established security standards or specifications with known limitations. Customer is responsible for the design and operation of its applications and products throughout their lifecycles to reduce the effect of these vulnerabilities on customer’s applications and products. Customer’s responsibility also extends to other open and/or proprietary technologies supported by NXP products for use in customer’s applications. NXP accepts no liability for any vulnerability. Customer should regularly check security updates from NXP and follow up appropriately. Customer shall select products with security features that best meet rules, regulations, and standards of the intended application and make the ultimate design decisions regarding its products and is solely responsible for compliance with all legal, regulatory, and security related requirements concerning its products, regardless of any information or support that may be provided by NXP. NXP has a Product Security Incident Response Team (PSIRT) (reachable at PSIRT@nxp.com) that manages the investigation, reporting, and solution release to security vulnerabilities of NXP products. NXP B.V. — NXP B.V. is not an operating company and it does not distribute or sell products. Trademarks Notice: All referenced brands, product names, service names, and trademarks are the property of their respective owners. NXP — wordmark and logo are trademarks of NXP B.V. I2C-bus — logo is a trademark of NXP B.V. FXPS7550A4S All information provided in this document is subject to legal disclaimers. © 2023 NXP B.V. All rights reserved. Product data sheet Rev. 1.2 — 3 November 2023

NXP Semiconductors FXPS7550A4S Analog absolute pressure sensor, 20 kPa to 550 kPa Tables Figures Fig. 16. SOT1573-1 PCB design guidelines - Solder Fig. 17. SOT1573-1 PCB design guidelines - I/O Fig. 18. SOT1573-1 PCB design guidelines - Solder FXPS7550A4S All information provided in this document is subject to legal disclaimers. © 2023 NXP B.V. All rights reserved. Product data sheet Rev. 1.2 — 3 November 2023