FXLN83XXQ NXP | Alldatasheet
Document overview
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- PDF pages: 18
Technical content
Features
Supply voltage (VDD) from 1.71 V to 3.6 V
- Accelerometer operating ranges selectable
- ±2 g or ±8 g (FXLN83x1Q)
- ±4 g or ±16 g (FXLN83x2Q)
- Low current consumption of 180 μA (typical)
- Output Bandwidth Options
- High bandwidth, 2.7 kHz (XY axes), 600 Hz (Z axis), (FXLN837XQ)
- Low bandwidth, 1.1 kHz (XY axes), 600 Hz (Z axis), (FXLN836XQ)
- 3 x 3 x 1 mm, 12-pin QFN package (0.65 mm lead pitch)
- Robust design with high shock survivability (10,000 g)
- Operating temperature from –40 °C to +105 °C
- MSL 1 compliant Typical Applications
- Tamper detection
- White goods: tilt, vibration, and shake detection
- Motion sensing in robotics applications
- Inclinometer, vibrometer
- Activity monitoring in sports and medical devices FXLN83xxQ 12-pin QFN 3 mm x 3 mm x 1 mm Case 2300-01 Top View 5 6 4 7 VDD ST BYP EN YOUT XOUT GND g-Select GND NC NC ZOUT Pin Connections Freescale Semiconductor, Inc. FXLN83xxQ Data Sheet: Technical Data Rev 2.0, 7/2014 Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. © 2014 Freescale Semiconductor, Inc. All rights reserved.
Ordering Information
Part Number Operating Range Bandwidth Temperature Range Package
Description
FXLN8361QR1 ±2/8 g Low –40 °C to +105 °C QFN-12 Tape and reel (1 k) FXLN8362QR1 ±4/16 g Low –40 °C to +105 °C QFN-12 Tape and reel (1 k) FXLN8371QR1 ±2/8 g High –40 °C to +105 °C QFN-12 Tape and reel (1 k) FXLN8372QR1 ±4/16 g High –40 °C to +105 °C QFN-12 Tape and reel (1 k) Related Documentation The FXLN83xxQ device features and operations are described in a variety of reference manuals, user guides, and application notes. To find the most-current versions of these documents: Go to the Freescale homepage at freescale.com. 2. In the Keyword search box at the top of the page, enter the device number FXLN83xxQ. 3. In the Refine Your Result pane on the left, click on the Documentation link. 2 Xtrinsic FXLN83xxQ 3-Axis Low-Power Analog-Output Accelerometer, Rev2.0, 7/2014. Freescale Semiconductor, Inc.
Xtrinsic FXLN83xxQ 3-Axis Low-Power Analog-Output Accelerometer, Rev2.0, 7/2014. Freescale Semiconductor, Inc.
1 General Description
1.1 Block Diagram
Figure 1. FXLN83xxQ block diagram Freescale Semiconductor, Inc.
1.2 Pin Descriptions
Figure 2. Pin locations Table 1. Pin descriptions
1 BYP Internal voltage regulator output capacitor connection Output
2 VDD Supply voltage Power
3 ST1 Self-Test
When ST pin is logic high, the accelerometer is put into self-test mode.
- When ST pin is logic low, the accelerometer is put into normal operating mode. Input
4 EN Power enable pin
- When the EN pin is logic high, the accelerometer is fully functional. Input 5 g-Select Full Scale Range selection: For part numbers FXLN8361QR1 & FXLN8371QR1: When the g-select pin is logic low, the accelerometer is in ±8 g mode
- When the g-select pin is logic high, the accelerometer is in ±2 g mode For part numbers FXLN8362QR1 & FXLN8372QR1:
- When the g-select pin is logic low, the accelerometer is in ±16 g mode
- When the g-select pin is logic high, the accelerometer is in ±4 g mode Input
6 GND Ground Ground
7 GND Ground Ground
8 ZOUT Z-axis analog output Output
9 YOUT Y-axis analog output Output
10 XOUT X-axis analog output Output
11 NC No internal connection, may be left floating or connected to GND —
12 NC No internal connection, may be left floating or connected to GND —
Freescale Semiconductor, Inc.
- The Self-Test function verifies the correct functioning of the sensor and signal path without the need to apply a
1.3 Typical Application Circuit
undesired noise from the power supply).
- C1 is required to stabilize the output of the internal
- Connecting the EN pin to the VDD pin is not a supported
configuration and may prevent the part from starting up. Do not set the EN pin high until VDD > 1 .71 V. Figure 3. Electrical Connections Freescale Semiconductor, Inc.
1.4 Sensing Direction and Output Response
Figure 4. Sensitive Axes Orientation and Response to Gravity Stimulus Freescale Semiconductor, Inc.
2 Device Characteristics
2.1 Absolute Maximum Ratings
conditions for extended periods may affect reliability. Table 2. Absolute maximum ratings Table 3. ESD and latch-up protection characteristics This device is sensitive to mechanical shock, improper handling can cause permanent damage to the part. This is an ESD sensitive device, improper handling can cause permanent damage to the part. Freescale Semiconductor, Inc.
2.2 Mechanical Specifications
Table 4. Mechanical characteristics
- T = 25 °C, ±2 g range (for ±2/8 g product), ±4 g range (for ±4/16 g product) Device Characteristics Xtrinsic FXLN83xxQ 3-Axis Low-Power Analog-Output Accelerometer, Rev2.0, 7/2014. Freescale Semiconductor, Inc.
- Analog acceleration output pin loading = 3.3 nF capacitors on X and Y axes, with 8.2 nF capacitor on Z axis (HBW configuration) Analog acceleration output pin loading = 9.1 nF capacitors on X, Y and Z axes (LBW configuration)
- No analog acceleration output pin loading other than external BW setting capacitor
- No BYP pin loading other than bypass capacitor and 150 μA DC current draw through resistive divider. 1. Limits verified by characterization only. 2. High and Low Bandwidth modes are configured in non-volatile Memory (NVM) at the factory
2.3 Electrical Specifications
Table 5. Electrical characteristics
- Output load = 3.3 nF capacitors on X and Y axes, with 8.2 nF capacitor on Z axis (HBW configuration)
- Output load = 9.1 nF capacitors on X, Y and Z axes (LBW configuration)
- Output loading other than external capacitor: high impedance
- No electrical loading on BYP pin other than output capacitor and 150 μA (max)
- DC output current for ADC reference input
- T = 25°C, ±2 g range (for ±2/8 g product), ±4 g range (for ±4/16 g product) 1. Limits verified by characterization only. 2. Apply VDD first. Then, Turn-on time is defined by the delay between when the EN pin is set to high and the time at which a pin's output value reaches 90% of its final value. 3. g-Select pin transition from high to low. Time for output value to reach 90% of final value. Device Characteristics 10 Xtrinsic FXLN83xxQ 3-Axis Low-Power Analog-Output Accelerometer, Rev2.0, 7/2014. Freescale Semiconductor, Inc.
- BYP pin is not connected
3 Printed Circuit Board Layout and Device Mounting
Printed Circuit Board (PCB) layout and device mounting are critical to the overall performance of the design. The footprint for the surface mount packages must be the correct size as a base for a proper solder connection between the PCB and the package. This, along with the recommended soldering materials and techniques, will optimize assembly and minimize the stress on the package after board mounting. Freescale application note AN1902, "Assembly Guidelines for QFN and DFN
3.1 Printed Circuit Board Layout
The following recommendations are a guide to an effective PCB layout. See Figure 5 for footprint dimensions. The PCB land should be designed with Non-Solder Mask Defined (NSMD) as shown in Figure 5.
- No additional via pattern underneath package.
- No components or vias should be placed at a distance less than 2 mm from the package land area. This may cause additional package stress if it is too close to the package land area.
- Signal traces connected to pads should be as symmetric as possible. Put dummy traces on the NC pads in order to have same length of exposed trace for all pads.
- No copper traces should be on the top layer of the PCB under the package. This will cause planarity issues with board mount. Freescale QFN sensors are compliant with Restrictions on Hazardous Substances (RoHS), having halide-free molding compound (green) and lead-free terminations. These terminations are compatible with tin-lead (Sn-Pb) as well as tin-silver-copper (Sn-Ag-Cu) solder paste soldering processes. Reflow profiles applicable to those processes can be used successfully for soldering the devices. Printed Circuit Board Layout and Device Mounting Xtrinsic FXLN83xxQ 3-Axis Low-Power Analog-Output Accelerometer, Rev2.0, 7/2014. Freescale Semiconductor, Inc.
Figure 5. Footprint
3.2 Overview of Soldering Considerations
The information provided here is based on experiments executed on QFN devices. These experiments cannot represent exact conditions present at a customer site. design optimizations are recommended to develop an application-specific solution. during the solder reflow process. Stencil thickness should be 100 or 125 µm.
- The PCB should be rated for the multiple lead-free reflow condition with a maximum 260 °C temperature. Printed Circuit Board Layout and Device Mounting 12 Xtrinsic FXLN83xxQ 3-Axis Low-Power Analog-Output Accelerometer, Rev2.0, 7/2014. Freescale Semiconductor, Inc.
- Use a standard pick-and-place process and equipment. Do not use a hand soldering process. Do not use a screw-down or stacking to mount the PCB into an enclosure. These methods could bend the PCB, which would put stress on the package.
3.3 Halogen Content
This package is designed to be Halogen Free, exceeding most industry and customer standards. Halogen Free means that no homogeneous material within the assembly package shall contain chlorine (Cl) in excess of 700 ppm or 0.07% weight/weight or bromine (Br) in excess of 900 ppm or 0.09% weight/weight.
4 Package Information
The FXLN83xxQ device uses a 12-lead QFN package, case number 2300-01.
4.1 Device Marking
P = Prototype, 8 = Production 71, 72, 61, or 62 Figure 6. Device Marking Description
Package Information
Xtrinsic FXLN83xxQ 3-Axis Low-Power Analog-Output Accelerometer, Rev2.0, 7/2014. Freescale Semiconductor, Inc.
4.2 Tape and Reel Information
Figure 7. Tape dimensions Figure 8. Tape and reel orientation 14 Xtrinsic FXLN83xxQ 3-Axis Low-Power Analog-Output Accelerometer, Rev2.0, 7/2014. Freescale Semiconductor, Inc.
4.3 Package Description
Xtrinsic FXLN83xxQ 3-Axis Low-Power Analog-Output Accelerometer, Rev2.0, 7/2014. Freescale Semiconductor, Inc.
This drawing is located at freescale.com. 16 Xtrinsic FXLN83xxQ 3-Axis Low-Power Analog-Output Accelerometer, Rev2.0, 7/2014. Freescale Semiconductor, Inc.
5 Revision History
number Revision date Description 1.0 11/2013 Initial release. 1.1 7/2014 Revised to match current Freescale standard Figure 3, added note #3 2.0 7/2014 Changed document type from Advance Information to Technical Data
Revision History
Xtrinsic FXLN83xxQ 3-Axis Low-Power Analog-Output Accelerometer, Rev2.0, 7/2014. Freescale Semiconductor, Inc.
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