FX26 HIROSE | Alldatasheet

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2022.8 FX26 Series ■Features 1. Vibration Resistance Design absorbs the amplitude of the boards that occur in the Z direction (connector mating direction) that occurs in a vibration environment. 2. Heat Resistance up to 140℃ The special contact design enables product use under high temperature environments. Additionally the two- point contact design enhances reliability. 3. Board Misalignment Absorption ɾX and Y Directions : ±0.7mm Floating Range ɾZ Direction : ±0.75mm Effective Mating Length 4. Contact Pitch : 1mm 5. Connection Type : Stacking Height : 15mm/18mm/20mm/23mm/25mm 6. Pin Count Variations : 20/30/40/50/60 7. Rated Current : 0.5A/pin 8. Pick and Place Mounting Dustproof and suction caps are installed on standard product. (Reel Packaging) 9. Excellent mating performance with large guide post Large self-alignment range for easy mating operation. 'MPBUJOH 7JCSBUJPO"CTPSC )JHI5FNQ ˆ Suitable for Powertrain

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FX26 Series●140℃ Heat and Vibration Resistant Board-to-Board Floating Connector ■Product Specifi cations Ratings Rated Current : 0.5A Operating Temperature : -40 to 140ˆɹ(Note 1) Storage Temperature Range : -10 to 60ˆ (Note 2) Rated Voltage : 125V AC/DC (Note 3) Operating Humidity Range : 85% Max. relative humidity (No dew condensation) Storage Humidity Range : 60% Max. relative humidity (No dew condensation) Items Specifications Conditions 1ɽ Contact Resistance 65m Њ Max. Measured at 100mA 2ɽ Insulation Resistance 1000M Њ Min. Measured at 250V DC 3ɽ Withstanding Voltage No flashover or breakdown. 375V AC for 1 min. 4ɽ Mating Durability Contact resistance : 75m Њ Max. 10 insertion / extraction cycles. 5ɽ Vibration Resistance No electrical discontinuity of 1Жs or more. Frequency 50 to 100 ˠ 100 to 150 ˠ 150 to 300Hz Acceleration 98 ˠ 98 to 294 ˠ 294m/s2, test for 3 hours in the 3-axis direction for 1 complete cycle. (Note 4) 6ɽ Shock Resistance No electrical discontinuity of 1Жs or more. Acceleration of 980m/s2 ; duration 6ms, sine half-wave, 3 cycles in each of the 3 axes each in both directions. 7ɽ Moisture Resistance Contact Resistance : 75mЊ Max. Insulation Resistance : 1000mЊ Min. Left for 1000 hours at 60ˆ and 90 to 95% RH 8ɽ Temperature Cycles Contact Resistance : 75mЊ Max. Insulation Resistance : 1000MЊ Min. Temperature : -40 ˠ 140ˆ Time : 30 ˠ 30min. for 1,000 cycles 9ɽ Heat Resistance Contact Resistance : 75m Њ Max. Left at 140 ˆ for 1,000 hours Note 1 : Includes the temperature rise due to current flow. Note 2 : Storage refers to to long-term storage of the unused product before mounting on board. Note 3 : The creepage distance is 32V AC when based on IEC 60664-1 Pollution degree 2. Note 4 : The board amplitude of the connector mounting portion is kept below 0.05mm. ■Materials / Finish Part Materials Color / Finish Standard Insulator Polyamide Resin Black UL94V-0 Contact Copper Alloy Contact Portion : Gold Plating Mounting Portion : Gold Plating ʵ Solder Tab Phosphor Bronze Pure Tin Plated ʵ

FX26 Series●140℃ Heat and Vibration Resistant Board-to-Board Floating Connector Product Number Structure Refer to the chart below when determining the product specifications from the product number. Please select from the product numbers listed in this catalog when placing orders.ɹ ˔Straight Header FX26 - 30 P - 1S V ⁞ ⁠ ⁡ ⁢ ˔Straight Receptacle FX26 - 30 S - 1S V2 0 Connection Variations Overview [mm] Receptacle Header Note 1 : correspond to pin counts. Note 2 : Please contact a Hirose representative for release status. Note 3 : This type (height 23, 25mm) is a custom product. Please contact a Hirose representative for more information. ⁞Series ɿFX26 No. of Pos. ⁠Connector Type P : Header S : Receptacle ⁡Contact Pitch ɿ1̼̼ ⁢Product Type SV : Straight Type ⁣Product Height ɿ Mated height [mm] =Numerical value on the header side + Numerical value on the receptacle side FX26-P-1SV FX26-S-1SV15 FX26-S-1SV18 FX26-S-1SV20 FX26-P-1SV5 (Note 3) 2025 1823

FX26 Series●140℃ Heat and Vibration Resistant Board-to-Board Floating Connector ■Part Dimensions Unit ɿ mm Part No. HRS No. No. of Pos. ABCDEFGHJK Packaging Quantity 250 pcs per reel ˔Straight Header ɹʦFX26-**P-1SVʧ Y X 2×2.3±0.05 ˞ɹɹɹ Via prohibited area ɹɹɹɹ Pattern prohibited area 7.7 0.5±0.03 10.1 5.1 P= 1 ̙±0.05 Recommended Land Pattern Diagram 9.3 15.3 3.9 w=0.15±0.03 (14.3) 13.8±0.3 ̖±0.3 ̘±0.2 P=1±0.15 9.6±0.2 5.6±0.2 ̙±0.05 1±0.25 10.15±0.3 ̗±0.3 0.3±0.05 Hole : 2ר1.3±0.05 Ø1-0.05 Ø1.2-0.05 C1.2 0.05 Y 0.05 Y 0.05 X 0.05 X

FX26 Series●140℃ Heat and Vibration Resistant Board-to-Board Floating Connector ■Part Dimensions Unit ɿ mm Part No. HRS No. No. of Pos. ABCDEFGHJK Packaging Quantity 200 pcs per reel Note 1 : Pin counts with the HRS No. left blank can be developed upon request. For details contact a Hirose sales representative. ʦFX26-**P-1SV5ʧ Y X ˞ɹɹɹ Via prohibited area ɹɹɹɹ Pattern prohibited area 2×2.3±0.05 7.7 0.5±0.03 10.1 5.1 P= 1 ̙±0.05 9.3 15.3 3.9 w=0.15±0.03 (14.3) 13.8±0.3 ̖±0.3 ̘±0.2 P=1±0.15 9.6±0.2 5.6±0.2 ̙±0.05 1±0.25 15.15±0.3 ̗±0.3 0.3±0.05 Hole : 2ר1.3±0.05 Ø1-0.05 Ø1.2-0.05 C1.2 0.05 Y 0.05 Y 0.05 X 0.05 X Recommended Land Pattern Diagram

FX26 Series●140℃ Heat and Vibration Resistant Board-to-Board Floating Connector ■Part Dimensions Unit ɿ mm Part No. HRS No. No. of Pos. ABCDEFGH Packaging Quantity 200 pcs per reel ˔Straight Receptacle ɹʦFX26-**S-1SV20ʧ Y X 2×2.2±0.05 8.8 0.55±0.03 6.5 1.5 P= 1 ̙±0.05 7.8±0.3 ̖±0.3 P=1±0.15 6±0.2 2±0.2 $±0.15 %±0.05 &±0.3 1±0.25 16.7±0.3 ̗±0.2 3.75±0.15 (7.8) Hole : 2ר1.3±0.05 Ø1.2-0.05 Ø1-0.05 0.05 Y 0.05 Y 0.05 X 0.05 X Recommended Land Pattern Diagram

FX26 Series●140℃ Heat and Vibration Resistant Board-to-Board Floating Connector ■Part Dimensions Unit ɿ mm Part No. HRS No. No. of Pos. ABCDEFGH Packaging Quantity 200 pcs per reel FX26-60S-1SV18 Note 1 : Pin counts with the HRS No. left blank are currently under development. For details contact a Hirose sales representative. ʦFX26-**S-1SV18ʧ Y X 2×2.2±0.05 8.8 0.55±0.03 6.5 1.5 P= 1 ̙±0.05 7.8±0.3 ̖±0.3 P=1±0.15 6±0.2 2±0.2 $±0.15 %±0.05 &±0.3 1±0.25 14.7±0.3 ̗±0.2 3.75±0.15 (7.8) Hole : 2ר1.3±0.05 Ø1.2-0.05 Ø1-0.05 0.05 Y 0.05 Y 0.05 X 0.05 X Recommended Land Pattern Diagram

FX26 Series●140℃ Heat and Vibration Resistant Board-to-Board Floating Connector ■Part Dimensions Unit ɿ mm Part No. HRS No. No. of Pos. ABCDEFGH Packaging Quantity 250 pcs per reel Note 1 : Pin counts with the HRS No. left blank are currently under development. For details contact a Hirose sales representative. ʦFX26-**S-1SV15ʧ Y X 2×2.2±0.05 8.8 0.55±0.03 6.5 1.5 P= 1 ̙±0.05 7.8±0.3 #±0.3 P=1±0.15 6±0.2 2±0.2 %±0.15 &±0.05 '±0.3 1±0.25 11.7±0.3 $±0.2 3.75±0.15 (7.8) Hole : 2ר1.3±0.05 Ø1.2-0.05 Ø1-0.05 0.05 Y 0.05 Y 0.05 X 0.05 X Recommended Land Pattern Diagram

FX26 Series●140℃ Heat and Vibration Resistant Board-to-Board Floating Connector ■Embossed Packaging Diagram ˔Straight Header ɹʦFX26-P-1SVʧ ɹʦFX26-P-1SV5ʧ ˔Straight Receptacle ɹʦFX26-S-1SV20ʧ ɹʦFX26-S-1SV18ʧ ɹʦFX26-**S-1SV15ʧ Embossed Cover Tape Embossed Carrier TapePart (With Suction Cap) (Ø380) ̛max(Ø80) 1.7ɹ0 ʴ0.15 (D) (0.5) (7.3) ̘±0.3 ̗±0.1 ̖±0.1 P=24±0.1 2±0.15 P=4±0.1 Ø13±0.2 Ø21±0.8 Ø1.5ɹ0 ʴ0.1 1.5ɹ0 ʴ0.1 ̚ʴ0.4ɹ0 ˙Reel Diagram Part (With Suction Cap) Embossed Carrier Tape Embossed Cover Tape ̚ʴ0.4ɹ0 Ø1.5ɹ0 ʴ0.1 (Ø380) (Ø80) P=20±0.15 (5.4) ̖±0.3 ̗±0.1 ̘±0.3 2±0.2 P=4±0.1 (̙) (0.5) Ø21±0.8 Ø13±0.2 1.7ɹ0 ʴ0.15 1.5ɹ0 ʴ0.1 ˙Reel Diagram ̛max Unit ɿ mm Part No. No. of Pos. A B C D E F Packaging Quantity Unit ɿ mm Part No. No. of Pos. A B C D E F Packaging Quantity

FX26 Series●140℃ Heat and Vibration Resistant Board-to-Board Floating Connector ■Recommended Temperature Profi le ■Cleaning Conditions ˔Cleaning with Organic Solvent Solvent Cleaning at Normal Temperature Heated Cleaning IPA (Isopropyl Alcohol) ˓˓ ˔Cleaning with Water When water-type cleaning agents (terpene, alkaline saponification agents) are used, select cleaning agents based on the 'table of influence' on metals and resins issued by the cleaning agent manufacturer. Caution : Do not leave the connector with any water content left on it. ˔Cleaning Precautions If flux or cleaning agent remains on the connector during part cleaning with organic solvent and water-based agents, it may cause deterioration of electrical performance. Confirm cleaning is performed properly. ■Usage Precautions ˔Securing Boards Together If the board is supported only by the connector, an excessive load may be applied, causing damage or poor contact. Use other methods to secure the board other than connectors. ˔About Board-to-Board Set Up Dimensions The dimensions between PCBs shall be within the following range : ˞The above ʶ0.75mm intersection is different from board amplitude. Refer to the next page for board amplitude. <Applicable Conditions>ɹɹ ɹ Test Board Measurements ɿɹ110×85×1.6mm Material ɿɹGlass Epoxy Solder Composition ɿɹSn-3Ag-0.5Cu Flux Content ɿɹ11wt% Metal Mask Thickness ɿɹ0.15mm Reflow Times ɿɹ2 times Max. ˞The temperature profile is a reference under the above conditions. Temperature profile may change depending on the solder paste types, manufacturers, PCB size, and other soldering materials. Please fully check the mounting conditions before use. 150ˆ 200ˆ 220ˆ Soldering Time (220ˆ Min.) (Peak Temperature : 250ˆ Max.) (90 to 120 sec.) (Within 60 sec.) Preheating Time (150 to 200ˆ) Temperature (ˆ) hʶ0.75mm FX26-S-1SV FX26-P-1SV h : connector height (15, 18, 20, 23, 25)

FX26 Series●140℃ Heat and Vibration Resistant Board-to-Board Floating Connector ˔Mating Operations Cautions It is recommended to operate straight and without tilting. ɾThe mating self-alignment is ±1.2mm in the X and Y directions. Mate the connector while following the self-alignment guide and without applying excessive force. ˞Rotational insertion and extraction are not recommended as it may damage the connector. ɾTo prevent incomplete mating or mating failure, install a backup on the back surface of the connector mounting portion during mating. Fix the board with screws after mating it securely. ˔Permissible Misalignment in the Mated State (Floating Range) This connector is designed to float when mated, with a permissible misalignment of ±0.7mm in both the X and Y directions. However, it is not applicable to absorbing when the misalignment amount is continually changing due to vibration, etc. Be sure to secure PCBs after mating. ˔Board Amplitude Under Vibration Conditions This connector can absorb the board amplitude in the Z direction (connector mating direction). However, it cannot absorb any vibration in the Z direction. The maximum absorption is 0.05mm. Make a board design that suppresses the amplitude (Amount of change in height between substrates) of the connector mounting portion to 0.05mm or less under a vibration environment in use. Also, design the fastening position, fastening method and case. ɾPay attention to board resonance. ɾWhen frequency exceeds 1000Hz under constant and sweep vibrations, reduce the acceleration applied to the connector and connector mating portion to 5G or less. X Direction (Length Side) Y Direction (Width Side) X Direction (Length) Y Direction (Width) Spacer Floating Side (Header Side Connector) ʶ0.7mm ʶ0.7mm ʶ1.2mm ʶ1.2mm

FX26 Series●140℃ Heat and Vibration Resistant Board-to-Board Floating Connector .&.0ɿ The characteristics and the specifications contained herein are for reference purpose. Please refer to the latest customer drawings prior to use. The contents of this catalog are current as of date of 08/2022. Contents are subject to change without notice for the purpose of improvements. 2-6-3,Nakagawa Chuoh,Tsuzuki-Ku,Yokohama-Shi 224-8540,JAPAN https://www.hirose.com/