FX20ASJ-06 RENESAS | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 7

Technical content

Features

  • Drive voltage : 4 V
  • VDSS : – 60 V
  • rDS(ON) (max) : 97 mΩ
  • ID : – 20 A
  • Integrated Fast Recovery Diode (TYP.) : 50 ns Outline (Package name: MP-3A) 1. Gate 2. Drain 3. Source 4. Drain 2, 4

Applications

Motor control, Lamp control, Solenoid control, DC-DC converters, etc. Maximum Ratings (Tc = 25°C) Parameter Symbol Ratings Unit Conditions Drain-source voltage VDSS –60 V V GS = 0 V Gate-source voltage VGSS ±20 V V DS = 0 V Drain current ID –20 A Drain current (Pulsed) IDM –80 A Avalanche drain current (Pulsed) I DA –20 A L = 100 µH Source current IS –20 A Source current (Pulsed) ISM –80 A Maximum power dissipation PD 35 W Channel temperature Tch – 55 to +150 °C Storage temperature Tstg – 55 to +150 °C Mass — 0.32 g Typical value

Rev.2.00 Aug 07, 2006 page 2 of 6

Electrical Characteristics

(Tch = 25°C) Parameter Symbol Min Typ Max Unit Test Conditions Drain-source breakdown voltage V (BR)DSS –60 — — V I D = –1 mA, VGS = 0 V Gate-source leakage current IGSS — — ±0.1 µA V GS = ±20 V, VDS = 0 V Drain-source leakage current IDSS — — –0.1 mA V DS = –60 V, VGS = 0 V Gate-source threshold voltage V GS(th) –1.3 –1.8 –2.3 V I D = –1 mA, VDS = –10 V Drain-source on-state resistance r DS(ON) — 73 97 m Ω I D = –10 A, VGS = –10 V Drain-source on-state resistance r DS(ON) — 119 166 m Ω I D = –10 A, VGS = – 4 V Drain-source on-state voltage V DS(ON) — –0.73 –0.97 V I D = –10 A, VGS = –10 V Forward transfer admittance | yfs | — 10.9 — S I D = –10 A, VDS = –10 V Input capacitance Ciss — 2370 — pF Output capacitance Coss — 306 — pF Reverse transfer capacitance Crss — 147 — pF VDS = –10 V, VGS = 0 V, f = 1MHz Turn-on delay time td(on) — 15 — ns Rise time tr — 37 — ns Turn-off delay time td(off) — 131 — ns Fall time tf — 72 — ns VDD = –30 V, ID = –10 A, VGS = –10 V, RGEN = RGS = 50 Ω Source-drain voltage VSD — –1.0 –1.5 V I S = –10 A, VGS = 0 V Thermal resistance Rth(ch-c) — — 3.57 °C/W Channel to case Reverse recovery time trr — 50 — ns I S = –20 A, dis/dt = 100 A/µs

Rev.2.00 Aug 07, 2006 page 3 of 6 Performance Curves Power Dissipation Derating Curve Case Temperature Tc (°C) Power Dissipation PD (W) Maximum Safe Operating Area Drain-Source Voltage VDS (V) Drain Current ID (A) Output Characteristics (Typical) Drain Current ID (A) Drain-Source Voltage VDS (V) Output Characteristics (Typical) Drain Current ID (A) Drain-Source Voltage VDS (V) On-State Voltage vs. Gate-Source Voltage (Typical) Gate-Source Voltage VGS (V) Drain-Source On-State Voltage VDS(ON) (V) On-State Resistance vs. Drain Current (Typical) Drain Current ID (A) Drain-Source On-State Resistance rDS(ON) (mΩ) 0 20050 100 150 –10 –20 –30 –40 –50 PD = 35W VGS = –10V –6V –3V –4V –5V –8V –12 –16 –20 –6V –5V –4V –3V –8V –10V VGS = –100 –101 –102 tw = 10µs 100µs 1ms DC PD = 35W 120 160 200 VGS = –4V –10V –10 –40A ID = –10A –20A Tc = 25°C Single Pulse Tc = 25°C Pulse Test Tc = 25°C Pulse Test Tc = 25°C Pulse Test Tc = 25°C Pulse Test

Rev.2.00 Aug 07, 2006 page 4 of 6 Transfer Characteristics (Typical) Gate-Source Voltage VGS (V) Drain Current ID (A) Forward Transfer Admittance vs. Drain Current (Typical) Drain Current ID (A) Forward Transfer Admittance | yfs | (S) Switching Characteristics (Typical) Drain-Source Voltage VDS (V) Capacitance vs. Drain-Source Voltage (Typical) Drain Current ID (A) Capacitance C (pF) Switching Time (ns) Gate-Source Voltage vs. Gate Charge (Typical) Gate Charge Qg (nC) Gate-Source Voltage VGS (V) Source-Drain Diode Forward Characteristics (Typical) Source-Drain Voltage VSD (V) Source Current IS (A) 101 102 100 101 102 25°C TC = 75°C 125°C –10 –20 –30 –40 –50 102 103 Ciss Coss Crss td(off) td(on) tr tf –10 0 1 02 03 04 05 0 VDS = –10V –20V –40V –10 –20 –30 –40 –50 125°C TC = 75°C 25°C Tc = 25°C VDS = –10V Pulse Test Tch = 25°C f = 1MHz V GS = 0V VDS = –10V Pulse Test Tch = 25°C VDD = –30V VGS = –10V RGEN = RGS = 50Ω VGS = 0V Pulse Test Tch = 25°C ID = –20A

Rev.2.00 Aug 07, 2006 page 5 of 6 Channel Temperature Tch (°C) Drain-Source On-State Resistance rDS(ON) (t°C) Threshold Voltage vs. Channel Temperature (Typical) Gate-Source Threshold Voltage VGS(th) (V) On-State Resistance vs. Channel Temperature (Typical) Drain-Source On-State Resistance rDS(ON) (25°C) Channel Temperature Tch (°C) Transient Thermal Impedance Characteristics Channel Temperature Tch (°C) Breakdown Voltage vs. Channel Temperature (Typical) Pulse Width tw (s) Transient Thermal Impedance Zth(ch–c) (°C/W) Drain-Source Breakdown Voltage V(BR)DSS (t°C) Drain-Source Breakdown Voltage V(BR)DSS (25°C) Switching Time Measurement Circuit Switching Waveform RL VDD RGEN RGS Vin Monitor D.U.T. trtd(on) Vin 90% 90% 10% 10%Vout td(off) Vout Monitor 90% 10% tf 10–1 100 101 –50 0 50 100 150 0 –0.8 –1.6 –2.4 –3.2 –4.0 –50 0 50 100 150 0.4 0.6 0.8 1.0 1.2 1.4 –50 0 50 100 150 10–2 10–1 100 101 10–4 23 57 23 57 23 57 23 57 100 23 57 101 23 57 10210–3 10–2 10–1 PDM tw D= T tw T D = 1.0 0.5 0.2 0.1 0.05 0.02 0.01 Single Pulse VGS = 0V ID = –1mA VGS = –10V ID = –10A Pulse Test VDS = –10V ID = –1mA

Rev.2.00 Aug 07, 2006 page 6 of 6 Package Dimensions SC-63 0.32g MASS[Typ.] PRSS0004ZA-A RENESAS CodeJEITA Package Code Previous Code Unit: mm 10.4Max 1Max 0.5 ± 0.2 0.1 ± 0.1 0.5 ± 0.2 0.760.76 ± 0.2 2.3 ± 0.2 5.3 ± 0.2 6.6 1.4 ± 0.2 6.1 ± 0.2 1 ± 0.2 2.3 2.5Min 2.3 Package Name MP-3A Order Code Lead form Standard packing Quantity Standard order code Standard order code example Surface-mounted type Taping 3000 Type name – T +Direction (1 or 2) +3 FX20ASJ-06-T13 Surface-mounted type Plastic Magazine (Tube)

75 Type name FX20ASJ-06

Note: Please confirm the specificati on about the shipping in detail.

Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein. Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan http://www.renesas.com Refer to "http://www.renesas.com/en/network" for the latest and detailed information. Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Renesas Technology Europe Limited Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K. Renesas Technology (Shanghai) Co., Ltd. Unit 204, 205, AZIACenter, No.1233 Lujiazui Ring Rd, Pudong District, Shanghai, China 200120 Renesas Technology Hong Kong Ltd. 7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2730-6071 Renesas Technology Taiwan Co., Ltd. 10th Floor, No.99, Fushing North Road, Taipei, Taiwan Renesas Technology Singapore Pte. Ltd.

1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632

Tel: <65> 6213-0200, Fax: <65> 6278-8001 Renesas Technology Korea Co., Ltd. Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea Renesas Technology Malaysia Sdn. Bhd Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No.18, Jalan Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia Tel: <603> 7955-9390, Fax: <603> 7955-9510 RENESAS SALES OFFICES © 2006. Renesas Technology Corp., All rights reserved. Printed in Japan. Colophon .6.0