FX18-40P-0.8SV10

FX18-60P-0.8SV HIROSE | Alldatasheet

Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 12

Technical content

2012.4 10+Gbps 0.8mm pitch Board to Board Connectors FX18 Series ■Mechanical features

• 0.8mm Pitch
• Variations :Coplanar / Vertical / Stacking
• Number of Contacts : 40 / 60 / 80 / 100 /
• Multi functional contact (MF contact) as; q ground contact to enhance grounding. w power supply contacts up to 12 A to reduce required pin counts. e 3-step sequential contacts for grounding and detection.
• Effective mating length of signal contact: 2.0 mm. (MF contact A:2.5mm / MF contact B:1.5mm)
• Pin through hole mounting MF contacts increase strength against wrenching.
• Large mating guide for easy mating. Single contact MF contact A MF contact B 10.85 15~30 15.15 9.5 20.3 Coplanar connection Vertical connection FX18-S-0.8SH FX18-S-0.8SHFX18-P-0.8SH FX18-P-0.8SV Stacking connection FX18-P-0.8SV FX18-S-0.8SV7.8 ■Signal integrity features
• Insertion Loss-to-Crosstalk-Ratio (ICR) The insertion loss-to-crosstalk ratio (ICR) with five-aggressor differential FEXT meets the extrapolated IEEE802.3ap specification for 10+Gbps with plenty of margins.
• Differential Impedance The differential impedance is within 100±10 ohms at 35 ps rise time( 20% to 80%) ■Variations NEW 0 2 4 6 8 10 Frequency (GHz) ICR (dB) ICR IEEE spec 0 0.2 0.4 0.6 0.8 1 100 105 110 Time (ns) Z (Ohms) Inner row ICR Impedance

FX18 Series●10+Gbps 0.8mm pitch Board to Board Connectors

• Receptacle / Header ■Product Specification ■Material Insulator PA Black UL94V-0 Signal contact Phosphor bronze Contact area:Gold plated –––––– Lead area :Gold plated MF contact Phosphor bronze Contact area:Gold plated –––––– Lead area :Tin plated Part Material Finish Remark (Note 1) Includes temperature rise caused by current flow. (Note 2) “Storage” means a long-term storage state for the unused product before assembly to pcb. (Note 3) The rated current applies to per contact. (Note 4) Information contained in this catalog represents general requirements for this Series. Contact us for the drawings and specifications for a specific part number shown. Item Specification Condition ■Ordering Information Rating Current Rating 0.5A(Signal) (Note3) 3.0A(MF contact ) Voltage Rating AC100V Operating Temperature Range -55ç ~ 80ç (Note 1) Storage Temperature Range -10ç ~ 60ç (Note 2) 1.Contact Resistance 2.Insulation Resistance 3.Voltage Proof 4.Durabirity (mating/unmating) 5.Vibration 6.Shock 7.Humidity (Steady state) 8.Temperature Cycle 90m ohms max 1000M ohms min No flashover or insulation breakdown Contact resistance: 100m ohms max No electrical discontinuity of 1µs or more No electrical discontinuity of 1µs or more Contact Resistance :100m ohms max Insulation Resistance: 1000M ohms min Contact Resistance :100m ohms max Insulation Resistance: 1000M ohms min 100mA 250V DC 300V AC / 1min 500 cycles Frequency:10 to 55Hz, Approx 5 min Single ampritude0.75mm, 10cycles for 3 directions 490m/s 2,Duration of pulse 11ms, at 3 time for 3 directions 96 hours at temperature of 40±2ç and humidity of 90% to 95% (-55ç:30 minutes,85ç:30minutes) under 5 cycle
• Right Angle Receptacle
• Right Angle Header
• Straight Header
• Straight Receptacle FX18 - 60 S - 0.8 SH ❶ ❷ ❸ ❹ ❺ FX18 - 60 P - 0.8 SH ❶ ❷ ❸ ❹ ❺ FX18 - 60 P - 0.8 SV 10 ❶ ❷ ❸ ❹ ❺ ❻ FX18 - 60 S - 0.8 SV 15 ❶ ❷ ❸ ❹ ❺ ❻ ❶ Series Name ：FX18 ❷ Number of contacts ❸ Connector Type S :Receptacle P :Header ❹ Contact Pitch :0.8mm ❺ Contact Type SH :Board Right Angle Type SV :Board Straight Type ❻ Stacking Height Designation

FX18 Series●10+Gbps 0.8mm pitch Board to Board Connectors

• Pin assignment ■Signal Integrity To match 100 ohm differential impedance and to reduce crosstalk, a staggered GSSG pin assignment is recommended for FX18. (G=ground and S=signal) ■Function Chart
• Right Angle Receptacle ●Right Angle Header ʲ FX18-S-0.8SH ʳ ʲ FX18-P-0.8SH ʳ ʲ FX18-P-0.8SV ʳʲ FX18-S-0.8SV15 ʳ
• Straight Header●Straight Receptacle ʲ FX18-S-0.8SV20 ʳ ʲ FX18-P-0.8SV10 ʳ Coplanar connection Vertical connection Stacking connection Contact No.1 Contact No.21 Contact No.20 Contact No.40 Outer row Inner row Signal pin Diff pair Ground pin Pin assignment ( In case of 40 pos. ) Cross section of mating (coplanar connection) Inner row Outer row ■Stacking connections Heights Stacking Variation FX18-P-0.8SV FX18-P-0.8SV10 FX18-S-0.8SV15 15mm 25mm FX18-S-0.8SV20 20mm 30mm Straight Receptacle FX18-S-0.8SV Straight Header FX18-P-0.8SV

FX18 Series●10+Gbps 0.8mm pitch Board to Board Connectors

• Impedance 0 0.2 0.4 0.6 0.8 1 100 105 110 Time (ns) Z (Ohms) Outer row 0 0.2 0.4 0.6 0.8 1 100 105 110 Time (ns) Z (Ohms) Inner row The differential impedance is 100±10 ohm for FX18 at 35 ps rise time (20% to 80%)
• Insertion Loss 0 2 4 6 8 10 -2.5 -1.5 -0.5 Frequency (GHz) S (dB) Outer row 0 2 4 6 8 10 -2.5 -1.5 -0.5 Frequency (GHz) S (dB) Inner row The differential insertion loss crosses 1dB at 6GHz for FX18.
• Return loss 0 5 10 15 20 -50 -40 -30 -20 -10 Frequency (GHz) RL (dB) RL IEEE Spec 0 5 10 15 20 -50 -40 -30 -20 -10 Frequency (GHz) RL (dB) RL IEEE Spec The differential return loss meets the IEEE 802.3ap specification to 10 GHz for FX18. Inner rowOuter row Inner rowOuter row Inner rowOuter row

FX18 Series●10+Gbps 0.8mm pitch Board to Board Connectors

• Near-end crosstalk (NEXT) 0 2 4 6 8 10 -60 -50 -40 -30 -20 -10 Frequency (GHz) S (dB) S12 0 2 4 6 8 10 -60 -50 -40 -30 -20 -10 Frequency (GHz) S (dB) S12 The staggered GSSG pin assignments resulted in low differential NEXT.
• Far-end crosstalk (FEXT) 0 2 4 6 8 10 -60 -50 -40 -30 -20 -10 Frequency (GHz) S (dB) S14 0 2 4 6 8 10 -60 -50 -40 -30 -20 -10 Frequency (GHz) S (dB) S14 The staggered GSSG pin assignments resulted in low differential FEXT.
• Insertion-loss-to-crosstalk ratio (ICR) 0 2 4 6 8 10 Frequency (GHz) ICR (dB) ICR IEEE spec 0 2 4 6 8 10 Frequency (GHz) ICR (dB) ICR IEEE spec The insertion-loss-to-crosstalk ratio (ICR) with multi-aggressor differential FEXT meets the extrapolated IEEE 802.3ap specification to 10+Gbps with plenty of margins. Inner rowOuter row Inner rowOuter row Inner rowOuter row

FX18 Series●10+Gbps 0.8mm pitch Board to Board Connectors

• Right Angle Receptacle
• Right Angle Header All dimensions in mm All dimensions in mm Part Number HRS No. A B C D E F G H(pos.) ★ indicates "available". No marking, "under development" Part Number HRS No. A B C D E F G H(pos.) ★ indicates "available". No marking, "under development" C±0.15 B±0.2 E±0.25 3.55±0.15 5.1±0.2 9.5±0.15 1.2±0.15 1.5±0.15 1.2±0.15 2.55±0.25 5±0.25 4.75±0.25 8.4±0.25.4±0.2 D±0.25 A±0.02 No.F No.H No.G No.1 1.35 +0.15 – 0.25 9.5±0.15 C±0.15 B±0.2 3.6±0.15 5.1±0.2 E±0.25 D±0.25 4.75±0.256.05±0.25 8.5±0.25 1.2±0.15 1.2±0.15 1.5±0.15 11.9±0.2 A±0.2 No.1 No.G No.H No.F 1.35 +0.15 – 0.25

FX18 Series●10+Gbps 0.8mm pitch Board to Board Connectors

• Straight Header All dimensions in mm No.FNo.1 No.G No.H B±0.2 A±0.2 0.35±0.1P=0.8±0.15 7.8±0.2 3.55±0.15 18.65±0.31.35 ʴ0.15 ʵ0.3 E±0.25 D±0.25 C±0.15 4.9±0.2 1.2±0.15 4.9±0.2 1.2±0.15 2±0.2 2±0.2
• Straight Header (10 type) All dimensions in mm Part Number HRS No. A B C D E F G H(pos.) ★ indicates "available". No marking, "under development" Part Number HRS No. A B C D E F G H(pos.) ★ indicates "available". No marking, "under development" E±0.25 7.8±0.2 A±0.2 (8.65) D±0.25 C±0.15 5.1±0.2 1.2±0.15 1±0.15 3.55±0.15 B±0.2 No.H No.FNo.1 No.G 1.35+0.15 –0.25

FX18 Series●10+Gbps 0.8mm pitch Board to Board Connectors Part Number HRS No. A B C D E F G H(pos.) ★ indicates "available". No marking, "under development"

• Straight Receptacle(20type)
• Straight Receptacle(15type) No.H No.G No.1No.F C±0.2 1.35+0.15 -0.3 B±0.15 A±0.2 7.8±0.2 3.6±0.15 5.1±0.24.9±0.2 4.9±0.2 1.2±0.15 1.2±0.15 E±0.25 D±0.25 2±0.2 2±0.2 11.45±0.3 No.F No.1 No.GNo.H C±0.2 16.45±0.3 2±0.2 2±0.2 D±0.25 E±0.25 1.2±0.15 1.2±0.15 4.9±0.2 4.9±0.2 5.1±0.2 3.6±0.15 7.8±0.2 A±0.2 B±0.15 1.35 +0.15 -0.3 All dimensions in mm Part Number HRS No. A B C D E F G H(pos.) ★ indicates "available". No marking, "under development" All dimensions in mm

FX18 Series●10+Gbps 0.8mm pitch Board to Board Connectors 0.5ʴ0.05 2±0.05 2±0.05P=0.8±0.05 1 +0.1 0 (TH) 1 +0.1 0 (TH) +0.1 0ʢTHʣ 1.4+0.1 0ʢTHʣ 2 +0.1 0 (TH) 2.1ʴ0.1 0 2.1ʴ0.1 8.4±0.05 4.9±0.05 A±0.05 B±0.05 C±0.05 R0.5 ■Recommended Land Pattern Dimension of PCB (PCB thickness: t=1.6mm / Metal mask thickness: t=0.12mm)

• Right Angle Receptacle / Right Angle Header PCB EDGE P=0.8±0.05 2.1＋0.1 2.1＋0.1 8.4±0.05 A±0.05 0.4 ＋0.05 2±0.05 2 ＋0.1 0 (TH) 1 ＋0.1 0 (TH) 1＋0.1 0 (TH) 6.5±0.05 R0.5 C±0.05 B±0.05 1.7 (TH) 2 (TH)+0.1 +0.1
• Straight Header
• Straight Header (SV 10 type)
• Straight Receptacle (SV 15 / SV20 type) R0.5 A±0.05 8.4±0.05 P=0.8±0.05 C±0.05 B±0.05 5.1±0.05 2.1 +0.1 0 2.1 +0.1 2 (TH)+0.1 1 (TH)+0.1 0.4+0.05 1 (TH)+0.1 1.2 (TH)+0.1 1.8 (TH)+0.1 0.5 +0.05 C±0.05 B±0.05 A±0.05 4.9±0.05 8.4±0.05 2.1+0.1 ɹ02.1 +0.1 2+0.1 0 (TH) 1.4+0.1 0ʢTHʣ 2 +0.1 0ʢTHʣ 1+0.1 0 (TH) 1+0.1 0 (TH) P=0.8±0.05 2±0.05 2±0.05 R0.5 Part Number A B C FX18-40P-0.8SV 15.2 18.4 24.65 FX18-60P-0.8SV 23.2 26.4 32.65 FX18-80P-0.8SV 31.2 34.4 40.65 FX18-100P-0.8SV 39.2 42.4 48.65 FX18-120P-0.8SV 47.2 50.4 56.65 FX18-140P-0.8SV 55.2 58.4 64.65 Part Number A B C FX18-40S-0.8SH 15.2 18.4 24.65 FX18-40P-0.8SH FX18-60S-0.8SH 23.2 26.4 32.65 FX18-60P-0.8SH FX18-80S-0.8SH 31.2 34.4 40.65 FX18-80P-0.8SH FX18-100S-0.8SH 39.2 42.4 48.65 FX18-100P-0.8SH FX18-120S-0.8SH 47.2 50.4 56.65 FX18-120P-0.8SH FX18-140S-0.8SH 55.2 58.4 64.65 FX18-140P-0.8SH Part Number A B C FX18-40P-0.8SV10 15.2 18.4 24.65 FX18-60P-0.8SV10 23.2 26.4 32.65 FX18-80P-0.8SV10 31.2 34.4 40.65 FX18-100P-0.8SV10 39.2 42.4 48.65 FX18-120P-0.8SV10 47.2 50.4 56.65 FX18-140P-0.8SV10 55.2 58.4 64.65 Part Number A B C FX18-40S-0.8SV15/20 15.2 18.4 26.05 FX18-60S-0.8SV15/20 23.2 26.4 34.05 FX18-80S-0.8SV15/20 31.2 34.4 42.05 FX18-100S-0.8SV15/20 39.2 42.4 50.05 FX18-120S-0.8SV15/20 47.2 50.4 58.05 FX18-140S-0.8SV15/20 55.2 58.4 66.05

FX18 Series●10+Gbps 0.8mm pitch Board to Board Connectors ■Packing specification

• Right Angle Receptacle / Right Angle Header
• Straight Header (225) (45) (P=47) (235) (325) (30) (P=18) (162) A >PS< FX18-60P/S-0.8SH QTY.60 (325) (230±0.5) (P=46)(47.5) (225) (P=18) (31.5)(162) >PS< A FX18-60P-0.8SV QTY.60 Part Number Quantity FX18-40S-0.8SH FX18-40P-0.8SH FX18-60S-0.8SH FX18-60P-0.8SH FX18-80S-0.8SH FX18-80P-0.8SH FX18-100S-0.8SH FX18-100P-0.8SH FX18-120S-0.8SH FX18-120P-0.8SH FX18-140S-0.8SH FX18-140P-0.8SH Part Number Quantity FX18-40P-0.8SV 70 FX18-60P-0.8SV 60 FX18-80P-0.8SV 50 FX18-100P-0.8SV 40 FX18-120P-0.8SV 40 FX18-140P-0.8SV 40

FX18 Series●10+Gbps 0.8mm pitch Board to Board Connectors

• Straight Header 10 type / Straight Receptacle (15/20 type) QTY.60 >PS< FX18-60P-0.8SV10̖ FX18-60S-0.8SV20 (325) (230) (47.5) (P=46) (P=18) (31.5)(162) (225) Part Number Quantity FX18-40P-0.8SV10 60FX18-40S-0.8SV15 FX18-40S-0.8SV20 FX18-60P-0.8SV10 60FX18-60S-0.8SV15 FX18-60S-0.8SV20 FX18-80P-0.8SV10 50FX18-80S-0.8SV15 FX18-80S-0.8SV20 FX18-100P-0.8SV10 40FX18-100S-0.8SV15 FX18-100S-0.8SV20 FX18-120P-0.8SV10 40FX18-120S-0.8SV15 FX18-120S-0.8SV20 FX18-140P-0.8SV10 40FX18-140S-0.8SV15 FX18-140S-0.8SV20 ■Mounting Temperature Profile (Reference) MAX 60s90±120s Soldering Time (220ç min.) Pre-heating time (150 to 200ç) Time (Second) (ç) Temperature 150ç 200ç 220ç 140 180 220 160 200 (MAX 250ç) 240

260 HRS test conditions

Test board dimension : 110∞50∞1.6mm material : Glass epoxy Solder method : Reflow Solder composition : Paste Sn-3Ag-0.5Cu Metal mask : 0.12mm thick Reflow cycle : 2 cycle The temperature profile is based on the above conditions. In individual applications the actual temperature may vary, depending on solder paste type, Volume/thickness and board size/thickness. Consult your solder paste and equipment manufacturer for specific recommendations.

FX18 Series●10+Gbps 0.8mm pitch Board to Board Connectors ■Cleaning recommendations

• Water based cleaning When using water based cleaning agents (e.g., terpene, alkali saponifiers), select the cleaning agent based on the documentation issued by the various manufacturers of cleaning agents which describes it’s affects on metals, platings and plastics. Remove any moisture after cleaning. Residual flux or cleaning agents in the contact areas may affect electrical performance.
• Organic solvent cleaning Solvent Type Room temperature cleaning Heated cleaning IPA ( Isopropyl alcohol) HCFC ( Hydrochlorofluorocarbon ) YES YES YES YES ■Connector Precautions
• Allowable Clearance between the Mated Pair Recommend the allowable clearance at mating including angled insertion to be Max.1mm.
• PCB Fixture PCB and chassis can not be stabilized only by the connector. Fixture to stabilize the PCB is necessary. When fitting using a rotary insertion plug, please ensure you refer to the Rotary Insertion Guideline (TADC 4-210630) Within 1mmWithin 1mm Within 1mm Coplanar connection Vertical connection Stacking connection The contents of this catalog are current as of date of 04/2012. Contents are subject to change without notice for the purpose of improvements. 6-3,Nakagawa Chuoh-2-Chome,Tsuzuki-Ku,Yokohama-Shi 224-8540,JAPAN TEL: +81-45-620-3526 Fax: +81-45-591-3726 http://www.hirose.com http://www.hirose-connectors.com