FX11LA-80S12-SV21

CL573-0002-7 HIROSE | Alldatasheet

Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 8

Technical content

0.5mm Pitch Connectors with Ground Plate for 2mm Board-to-Board Connections FX11L Series NEWNEW 2003.7 I Features 1. Low Profile Design The board to board mating height of 2 mm suits smaller,thinner case designs. 2. Improved Transmission Efficiency Between Boards Transmission characteristics have been improved through a design that fixes ground plates to both sides of the header and receptacle. 3. 10 Signal:1 Ground Arrangement Signal and ground are arranged in a ratio of 10:1 with the ground plate SMT connected to the board. The ground stability achieved serves to reduce noise. 4. Reinforced Fittings for Added Solder Weld Strength Reinforced fittings provide greater adhesion to the board,protecting against peeling.The unique connector design provides a connection between the fitting and the ground plate for a stronger ground. 5. Suited to High-Density Applications The signal contact pitch of 0.5mm produces a smaller connector utilizing less board area for mounting. 6. Structure Prevents Solder Wicking A solder gap has been designed into the contact SMT portion to prevent solder wicking. 7. Optional Ground Plate An alternate style without the ground plate is available.The space provided by the ground plate removal has been filled with additional signal contacts. Note: The thickness of the solder paste is not included in the 2 mm board-to-board stack height. I Applications Notebook computers, PDA, and other miniature electronic equipment. G Cross-Section of Mating Detailed Figure of Solder Gap

Note 1: Please contact us when connector application exceeds 0.3 A rated current. Note 2: The term storage refers to an unused products prior to board mounting (including packing materials) that is being kept for a long period. The operating temperature and humidity range are applied to the non-conducting condition following board assembly. Note 3: The aforementioned specifications are representative of this series. For information on specific parts, confirm with Sales Office. I Materials I Product Number Configuration Please use this information to discern the product specifications from the product number codes. To order, please select from the product number codes listed in tables on pages 3 to 6 of this catalog. 1 2 75 3 6 1 2 753 4 6 Type With Ground Plate Type Without Ground Plate Series name : FX Series No. : 11L Form Symbol A : With guide post B : Without guide post Number of contacts Signal/Ground:60/6, 80/8, 100/10, 120/12 Signal: 68, 92, 116, 140 Type without ground Type with ground plate Connector type P : Header S : Receptacle Contact form SV : Straight SMT Blank:Tray packaging (Without pick-and-place tape) (21):Embossed tape packaging (Without pick-and-place tape) (22):Embossed tape packaging (With pick-and-place tape) 1 5 Rating Rated current Rated voltage

0.3 A (Note 1)

50 V AC

Operating temperature range Operating humidity range -55 to 85ç Relative humidity 95% or less (No condensation) Storage temperature range Storage humidity range -10 to +60ç (Note 2) -40 to -70% (Note 2) Part Insulator Contacts Ground plate Reinforced fitting Reinforced plate Material LCP resin Copper alloy Phosphor bronze Phosphor bronze Phosphor bronze Process Beige Header Engagement Area: Gold plating of 0.1µm Termination Area: Flash platingReceptacle Solder plating Tin plating UL Rating UL94V-0 Measured at 100 V DC

150 V AC applied for one minute

Frequency: 10 to 55 Hz, amplitude of 0.75 mm in 3 directions, 10 cycles each Acceleration of 490 m/s2, 11ms duration, sine half-wave waveform,for 3 cycles in the both directions of each of the 3 axes Temperature of 40ç, humidity of 90 to 95%, duration 96 h Temperature: -55ç ¡ 15 to 35ç ¡ 85ç ¡ 15 to 35ç Time: 30 min. ¡ 2 to 3 min. ¡ 30 min. ¡ 2 to 3 min. for 5 cycles 50 times Reflow: At the recommended temperature profile Soldering iron temperature: 300ç for 3 seconds

100 Mø or greater

60 mø or less No electrical discontinuity for 1µs or greater No damage, cracks, or parts looseness No electrical discontinuity for 1µs or longer No damage, cracks, or parts looseness Contact resistance of 70 mø or less, insulation resistance of

100 Mø or greater, no damage, cracks, or parts looseness

Contact resistance of 70 mø or less, insulation resistance of Contact resistance of 70 mø or less No damage, cracks, or parts looseness No melting of resin portion which affects performance 1. Insulation resistance 2. Voltage proof 3. Contact resistance Item Requirements Conditions 4. Vibration 5. Shock 6. Damp heat (Steady state) 8. Insertion/ Withdrawal life 9. Resistance to soldering heat 7. Rapid change of temperature Note : The black dots on the insulater will not affect performance.

I Headers with Ground Plate Note 1: There is no polarity in terms of board mounting for this product. Note 2: The coplanarity of this product's SMT leads is 0.1 mm or less. Note 3: Please order embossed tape packaged items by the reel. (One reel holds 1,000 pieces.) [Specifications number] – ✽ ✽, (✽ ✽) Blank: Tray packaging (Without pick-and-place tape) (21) : Embossed tape packaging (Without pick-and-place tape) (22) : Embossed tape packaging (With pick-and-place tape) BRecommended Land Pattern Dimensions (Metal Mask Dimensions) Note Cross-hatched portions, totaling n places, indicate the ground circuits. The cross-hatched area inside the SMT land may come into contact with the connector contacts and thus care should be taken that the pattern does not extend beyond the SMT land width. Not required in products without guideposts. Recommended metal mask thickness: 0.15 mm HRS No. CL573-0002-7-✽ ✽ CL573-0003-0-✽ ✽ CL573-0004-2-✽ ✽ CL573-0005-5-✽ ✽ CL573-0012-0-✽ ✽ CL573-0013-3-✽ ✽ CL573-0014-6-✽ ✽ CL573-0015-9-✽ ✽ Product No. FX11LA-060P/06-SV (✽ ✽) FX11LA-080P/08-SV (✽ ✽) FX11LA-100P/10-SV (✽ ✽) FX11LA-120P/12-SV (✽ ✽) FX11LB-060P/06-SV (✽ ✽) FX11LB-080P/08-SV (✽ ✽) FX11LB-100P/10-SV (✽ ✽) FX11LB-120P/12-SV (✽ ✽) Number of Contacts Signal Ground 060 080 100 120 060 080 100 120 A 17.5 23.5 29.5 35.5 17.5 23.5 29.5 35.5 22.6 28.6 34.6 40.6 22.6 28.6 34.6 40.6 19.4 25.4 31.4 37.4 19.4 25.4 31.4 37.4 B C D E Notes With guideposts Without guideposts

I Receptacles with Ground Plate Note 1: There is no polarity in terms of board mounting for this product. Note 2: The coplanarity of this product's SMT leads is 0.1mm or less. Note 3: Please order embossed tape packaged items by the reel. (One reel holds 1,000 pieces.) BRecommended Land Pattern Dimensions (Metal Mask Dimensions) 0.25 Recommended metal mask thickness: 0.15 mm Number of Contacts Signal Ground 060 080 100 120 060 080 100 120 A B C D E F 17.5 23.5 29.5 35.5 17.5 23.5 29.5 35.5 20.8 26.8 32.8 38.8 25.4 31.4 37.4 43.4 25.4 31.4 37.4 43.4 22.2 28.2 34.2 40.2 22.2 28.2 34.2 40.2 Notes With guideposts Without guideposts HRS No. CL573-0102-1-✽ ✽ CL573-0103-4-✽ ✽ CL573-0104-7-✽ ✽ CL573-0105-7-✽ ✽ CL573-0112-5-✽ ✽ CL573-0113-8-✽ ✽ CL573-0114-0-✽ ✽ CL573-0105-3-✽ ✽ Product No. FX11LA-060S/06-SV (✽ ✽) FX11LA-080S/08-SV (✽ ✽) FX11LA-100S/10-SV (✽ ✽) FX11LA-120S/12-SV (✽ ✽) FX11LB-060S/06-SV (✽ ✽) FX11LB-080S/08-SV (✽ ✽) FX11LB-100S/10-SV (✽ ✽) FX11LB-120S/12-SV (✽ ✽)s [Specifications number] - ✽ ✽, (✽ ✽) Blank: Tray packaging (Without pick-and-place tape) (21) : Embossed tape packaging (Without pick-and-place tape) (22) : Embossed tape packaging (With pick-and-place tape) Note Cross-hatched portions, totaling n places, indicate the ground circuits. Cross-hatched portions, totaling 2 places, indicate the reinforced fittings. The cross-hatched area inside the SMT land may come into contact with the connector contacts and thus care should be taken that the pattern does not extend beyond the SMT land width. Not required in products without guideposts.

I Headers without Ground Plate Note 1: There is no polarity in terms of board mounting for this product. Note 2: The coplanarity of this product's SMT leads is 0.1 mm or less. Note 3: Please order embossed tape packaged items by the reel. (One reel holds 1,000 pieces.) BRecommended Land Pattern Dimensions (Metal Mask Dimensions) Recommended metal mask thickness: 0.15 mm Number of Contacts Signal 068 092 116 140 068 092 116 140 A 16.5 22.5 28.5 34.5 16.5 22.5 28.5 34.5 22.6 28.6 34.6 40.6 22.6 28.6 34.6 40.6 19.4 25.4 31.4 37.4 19.4 25.4 31.4 37.4 B C D Notes With guideposts Without guideposts HRS No. CL573-0042-1-✽ ✽ CL573-0043-4-✽ ✽ CL573-0044-7-✽ ✽ CL573-0045-0-✽ ✽ CL573-0052-5-✽ ✽ CL573-0053-8-✽ ✽ CL573-0054-0-✽ ✽ CL573-0055-3-✽ ✽ Product No. FX11LA-068P-SV (✽ ✽) FX11LA-092P-SV (✽ ✽) FX11LA-116P-SV (✽ ✽) FX11LA-140P-SV (✽ ✽) FX11LB-068P-SV (✽ ✽) FX11LB-092P-SV (✽ ✽) FX11LB-116P-SV (✽ ✽) FX11LB-140P-SV (✽ ✽) [Specifications number] - ✽ ✽, (✽ ✽) Blank: Tray packaging (Without pick-and-place tape) (21) : Embossed tape packaging (Without pick-and-place tape) (22) : Embossed tape packaging (With pick-and-place tape) Note The cross-hatched area inside the SMT land may come into contact with the connector contacts and thus care should be taken that the pattern does not extend beyond the SMT land width. Not required in products without guideposts.

I Receptacles without Ground Plate Note 1: There is no polarity in terms of board mounting for this product. Note 2: The coplanarity of this product's SMT leads is 0.1 mm or less. Note 3: Please order embossed tape packaged items by the reel. (One reel holds 1,000 pieces.) BRecommended Land Pattern Dimensions (Metal Mask Dimensions) Recommended metal mask thickness: 0.15 mm Number of Contacts Signal 068 092 116 140 068 092 116 140 A 16.5 22.5 28.5 34.5 16.5 22.5 28.5 34.5 20.8 26.8 32.8 38.8 B C D Notes With guideposts Without guideposts HRS No. CL573-0142-6-✽ ✽ CL573-0143-9-✽ ✽ CL573-0144-1-✽ ✽ CL573-0145-4-✽ ✽ CL573-0152-0-✽ ✽ CL573-0153-2-✽ ✽ CL573-0154-5-✽ ✽ CL573-0155-8-✽ ✽ Product No. FX11LA-068S-SV (✽ ✽) FX11LA-092S-SV (✽ ✽) FX11LA-116S-SV (✽ ✽) FX11LA-140S-SV (✽ ✽) FX11LB-068S-SV (✽ ✽) FX11LB-092S-SV (✽ ✽) FX11LB-116S-SV (✽ ✽) FX11LB-140S-SV (✽ ✽) [Specifications number] - ✽ ✽, (✽ ✽) Blank: Tray packaging (Without pick-and-place tape) (21) : Embossed tape packaging (Without pick-and-place tape) (22) : Embossed tape packaging (With pick-and-place tape) Note The cross-hatched area inside the SMT land may come into contact with the connector contacts and thus care should be taken that the pattern does not extend beyond the SMT land width. Not required in products without guideposts.

20.2 26.2 20.2 26.2 A B C D E 40.4 52.4 40.4 52.4 45.5 45.5 50.6 50.5 Insertion Connector FX11L#-060P/06-SV FX11L#-080P/08-SV FX11L#-100P/10-SV FX11L#-120P/12-SV FX11L#-068P/12-SV FX11L#-092P/12-SV FX11L#-116P/12-SV FX11L#-140P/12-SV 20.2 26.2 20.2 26.2 A B C D E 40.4 52.4 40.4 52.4 45.5 45.5 50.6 50.5 Insertion Connector FX11L#-060S/06-SV FX11L#-080S/08-SV FX11L#-100S/10-SV FX11L#-120S/12-SV FX11L#-068S/12-SV FX11L#-092S/12-SV FX11L#-116S/12-SV FX11L#-140S/12-SV BEmbossed Carrier Tape Dimensions Note 1: There is no polarity in terms of embossed tape packaging for this product. Note 2: Left figure is representative of products with ground plates. Note 1: There is no polarity in terms of embossed tape packaging for this product. Note 2: Left figure is representative of products with ground plates. G Headers G Receptacles G Reel Packaging Dimensions

BRecommended Temperature Profile BWashing Conditions BConnector Handling Precautions 1. Allowable Creepage Dimensions at Time of Mating The effective coupling length of this product is 0.55 mm for the signal portion and the ground portion. The creepage of the header and receptacle at the time of mating should be within 0.18 mm of the completely coupled condition. 2. Retension of Boards Avoid the support of boards by connectors alone and adopt a board locking measure that does not rely on the connectors. 3. Solder Repair Flux may rise as far as the contact portion of the connector depending on the flux coating and other factors at the time of repair. This will cause poor contact reliability; therefore, before use, the aforementioned washing conditions should be taken into consideration prior to connector washing. 4. Miscellaneous

• Note that excessive twisting while inserting or withdrawing connectors will cause damage.
• The shade of the molded items may vary somewhat depending on the manufacturing lot; however, this does not affect performance. Water Type Washing When using water type cleaning agents (e.g., terpene, and alkali saponifiers), select the cleaning agent based on the documentation issued by the various manufacturers of cleaning agents which describes the effects on metals and resins. Be careful that parts are not left with moisture remaining on them. Organic Solvent Washing Washing Precautions Residual flux or cleaning agent on the contacts when washing with organic solvents or water type cleaners can give rise to the deterioration of electrical performance. In this regard it is important to check whether a thorough washing has been performed. Solvent Room temperature washingHeated washing IPA (Isopropyl alcohol) HCFC (Hydrochlorofluorocarbon) Ye s Ye s Ye s Ye s Applicable Conditions Reflow method : IR reflow Solder : Cream type 63Sn/37Pb (Flux component of 9wt%) Test substrate : Glass epoxy 85 x 110 x 1.6mm Metal mask thickness: 0.15mm This temperature profile is a recommendation. Conditions may change somewhat depending on the type of cream solder and the amount. This temperature profile is a reference for the setting conditions described below. It will differ depending on conditions and so mounting should follow verification. The contents of this catalog are current as of date of publication. Contents are subject to change without notice for the purpose of improvements. 5-23,OSAKI 5-CHOME,SHINAGAWA-KU,TOKYO 141-8587,JAPAN PHONE: 81-3-3491-9741, FAX: 81-3-3493-2933