CL570-0201-4 HIROSE | Alldatasheet

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0.5mm Pitch Connectors with Ground Plate for Board-to-Board Connections FX10 Series NEWNEW 2003.7 Receptacles Headers Dimension H 1. Improved Transmission Efficiency Between Boards Transmission characteristics have been improved through a design that fixes ground plates to both sides of the header and receptacle. 2. 10 Signal:1 Ground Arrangement Signal and ground are arranged in a ratio of 10:1 with the ground plate SMT connected to the board. The ground stability achieved serves to reduce noise. 3. Reinforced Fittings for Added Solder Weld Strength Reinforced fittings provide greater adhesion to the board, protecting against peeling. The unique connector design provides a connection between the fitting and the ground plate for a stronger ground. 4. Suited to High-Density Applications The signal contact pitch of 0.5 mm produces a smaller connector utilizing less board area for mounting. 5. Board-To-Board Dimensions of 4mm and 5 mm Are Available I Features I Applications Notebook computers, PDA, and other miniature electronic equipment. Note: The thickness of the solder paste is not included in the stack height (dimension H). 4mm 5mm Cross-Section of Mating Stack Height

Part Material Process Notes Insulator Contacts Ground plate Reinforced fitting LCP resin Phosphor bronze Phosphor bronze Phosphor bronze Beige Header Engagement Area: Gold plating of 0.1µm Tenmination Area: Solder plating Receptacle Engagement Area: Gold plating of 0.1m Termination Area: Flash plating Solder plating Tin plating UL94V-0 I Product Number Configuration Please use this information to discern the product specifications from the product number codes. To order, please select from the product number codes listed in tables on pages 3 to 5 of this catalog. 1 2 83 5 6 7 Series name: FX Series No.: 10 Form Symbol A: With guide post B: Without guide post Number of contacts Signal/Ground: 80/8, 100/10, 120/12, Connector type P: Header S: Receptacle Contact form SV: Straight SMT Product height Blank: Standard 1 : Standard + 1mm Packaging classification Blank: Tray packaging (21) : Embossed tape packaging Measured at 100 V DC

150 V AC applied for one minute

Frequency: 10 to 55 Hz, amplitude of 0.75 mm in 3 directions, 10 cycles each Acceleration of 490 m/s 2, 11 ms duration, sine half-wave waveform, for 3 cycles in the both directions of each of the 3 axes Temperature: -55ç¡ 15 to 35ç ¡ 85ç¡ 15 to 35ç Time: 30 min. ¡ 2 to 3 min. ¡ 30 min. ¡ 2 to 3 min. for 5 cycles Reflow: At the recommended temperature profile Soldering iron temperature: 300ç·for 3 seconds Temperature of 40ç, humidity of 90 to 95%, duration 96 h 50 times

100 Mø or greater

60 mø or less No electrical discontinuity for 1µs or greater No damage, cracks, or parts looseness No electrical discontinuity for 1µs or longer No damage, cracks, or parts looseness Contact resistance of 70 m ø or less No damage, cracks, or parts looseness No melting of resin portion which affects performance 4. Vibration 5. Shock 8. Insertion/Withdrawal life 9. Resistance to soldering heat 1. Insulation resistance 2. Voltage proof 3. Contact resistance I Product Specifications Item Requirements Conditions Note 1: Please contact us when connector application exceeds 0.3 A rated current. Note 2: The term storage refers to an unused products prior to board mounting (including packing materials) that is being kept for a long period. The operating temperature and humidity range are suited to the non-conducting condition following board assembly. Note 3: The aforementioned specifications are representative of this series. For information on specific parts, confirm with Sales Office. Rating Rated current Rated voltage

0.3 A (Note 1)

50 V AC

Operating temperature range Operating humidity range -55 to 85ç Relative humidity 95% or less (No condensation) Storage temperature range Storage humidity range -10 to +60ç(Note 2) -40 to 70% (Note 2) 6. Damp heat (Steady state) 7. Rapid change of temperature Contact resistance of 70 mø or less, insulation resistance of

100 Mø or greater, no damage, cracks, or parts looseness

Contact resistance of 70 mø or less, insulation resistance of Note : The black dots on the insulater will not affect performance.

HRS No. Product No. Number of Contacts SignalGround A B C D E F Notes Unit: mm CL570-0201-4-✽ ✽ CL570-0202-7-✽ ✽ CL570-0203-0-✽ ✽ CL570-0204-2-✽ ✽ CL570-0221-1-✽ ✽ CL570-0222-4-✽ ✽ CL570-0223-7-✽ ✽ CL570-0224-0-✽ ✽ FX10A-080S/08-SV(✽ ✽) FX10A-100S/10-SV(✽ ✽) FX10A-120S/12-SV(✽ ✽) FX10A-140S/14-SV(✽ ✽) FX10B-080S/08-SV(✽ ✽) FX10B-100S/10-SV(✽ ✽) FX10B-120S/12-SV(✽ ✽) FX10B-140S/14-SV(✽ ✽) 080 100 120 140 080 100 120 140 28.3 34.3 40.3 46.3 28.3 34.3 40.3 46.3 Without guideposts With guideposts 23.5 29.5 35.5 41.5 23.5 29.5 35.5 41.5 31.1 37.1 43.1 49.1 31.1 37.1 43.1 49.1 26.4 32.4 38.4 44.4 31.5 37.5 43.5 49.5 31.5 37.5 43.5 49.5 Note 1: There is no polarity in terms of board mounting for this product. Note 2: The coplanarity of this product's SMT leads is 0.1 mm or less. Note 3: Please order embossed tape packaged items by the reel. (One reel holds 1,000 pieces.) BRecommended Land Pattern Dimensions (Metal Mask Dimensions) [Specifications number]-✽ ✽,(✽ ✽) Blank: Tray packaging (21) :Embossed tape packaging Recommended metal mask thickness: 0.15 mm Note Cross-hatched portions, totaling n places, indicate the ground circuits. Cross-hatched portions, 2 places on both sides, indicate the reinforced fittings. Not required in products without guideposts.

Unit: mm Note 1: There is no polarity in terms of board mounting for this product. Note 2: The coplanarity of this product's SMT leads is 0.1mm or less. Note 3: Please order embossed tape packaged items by the reel. (One reel holds 1,000 pieces.) BRecommended Land Pattern Dimensions (Metal Mask Dimensions) [Specifications number] -✽ ✽, (✽ ✽) Blank: Tray packaging (21) : Embossed tape packaging Recommended metal mask thickness: 0.15 mm Note Cross-hatched portions, totaling n places, indicate the ground circuits. Cross-hatched portions, 2 places on both sides, indicate the reinforced fittings. The cross-hatched area inside the SMT land may come into contact with the connector contacts and thus care should be taken that the pattern does not extend beyond the SMT land width. Not required in products without guideposts. HRS No. Product No. Number of Contacts SignalGround A B C D E F Notes CL570-0001-5-✽ ✽ CL570-0002-8-✽ ✽ CL570-0003-0-✽ ✽ CL570-0004-3-✽ ✽ CL570-0021-2-✽ ✽ CL570-0022-5-✽ ✽ CL570-0023-8-✽ ✽ CL570-0024-0-✽ ✽ FX10A-080P/08-SV(✽ ✽) FX10A-100P/10-SV(✽ ✽) FX10A-120P/12-SV(✽ ✽) FX10A-140P/14-SV(✽ ✽) FX10B-080P/08-SV(✽ ✽) FX10B-100P/10-SV(✽ ✽) FX10B-120P/12-SV(✽ ✽) FX10B-140P/14-SV(✽ ✽) 080 100 120 140 080 100 120 140 23.5 29.5 35.5 41.5 23.5 29.5 35.5 41.5 31.1 37.1 43.1 49.1 31.1 37.1 43.1 49.1 26.4 32.4 38.4 44.4 31.5 37.5 43.5 49.5 31.5 37.5 43.5 49.5 28.3 34.3 40.3 46.3 28.3 34.3 40.3 46.3 Without guideposts With guideposts

Unit: mm Note 1: There is no polarity in terms of board mounting for this product. Note 2: The coplanarity of this product's SMT leads is 0.1 mm or less. Note 3: Please order embossed tape packaged items by the reel. (One reel holds 1,000 pieces.) [Specifications number] -✽ ✽,(✽ ✽) Blank: Tray packaging (21) : Embossed tape packaging Note Cross-hatched portions, totaling n places, indicate the ground circuits. Cross-hatched portions, 2 places on both sides, indicate the reinforced fittings. The cross-hatched area inside the SMT land may come into contact with the connector contacts and thus care should be taken that the pattern does not extend beyond the SMT land width. Not required in products without guideposts. BRecommended Land Pattern Dimensions (Metal Mask Dimensions) Recommended metal mask thickness: 0.15 mm GroundHRS No. Product No. Signal Number of Contacts A B C D E F Notes CL570-0101-0-✽ ✽ CL570-0102-2-✽ ✽ CL570-0103-5-✽ ✽ CL570-0104-8-✽ ✽ CL570-0121-7-✽ ✽ CL570-0122-0-✽ ✽ CL570-0123-2-✽ ✽ CL570-0124-5-✽ ✽ FX10A-080P/08-SV1(✽ ✽) FX10A-100P/10-SV1(✽ ✽) FX10A-120P/12-SV1(✽ ✽) FX10A-140P/14-SV1(✽ ✽) FX10B-080P/08-SV1(✽ ✽) FX10B-100P/10-SV1(✽ ✽) FX10B-120P/12-SV1(✽ ✽) FX10B-140P/14-SV1(✽ ✽) 080 100 120 140 080 100 120 140 23.5 29.5 35.5 41.5 23.5 29.5 35.5 41.5 31.1 37.1 43.1 49.1 31.1 37.1 43.1 49.1 26.4 32.4 38.4 44.4 31.5 37.5 43.5 49.5 31.5 37.5 43.5 49.5 28.3 34.3 40.3 46.3 28.3 34.3 40.3 46.3 With guideposts Without guideposts

20.2 26.2 26.2 34.2 40.4 52.4 52.4 68.4 330 330 330 330 45.5 76.5 50.5 81.5 G H J L M NInsertion Connector FX10#-080S/08-SV FX10#-100S/10-SV FX10#-120S/12-SV FX10#-140S/14-SV BEmbossed Carrier Tape Dimensions Note: There is no polarity in terms of embossed tape packaging for this product. 20.2 26.2 26.2 34.2 20.2 26.2 26.2 34.2 40.4 52.4 52.4 68.4 40.4 52.4 52.4 68.4 3.8 3.8 3.8 3.8 4.8 4.8 4.8 4.8 330 330 330 330 370 370 370 370 45.5 76.5 45.5 76.5 50.5 81.5 50.5 81.5 G H J K L M NInsertion Connector FX10#-080P/08-SV FX10#-100P/10-SV FX10#-120P/12-SV FX10#-140P/14-SV FX10#-080P/08-SV1 FX10#-100P/10-SV1 FX10#-120P/12-SV1 FX10#-140P/14-SV1 Note: There is no polarity in terms of embossed tape packaging for this product. G Receptacles G Headers G Reel Packaging Dimensions

BRecommended Temperature Profile BWashing Conditions BConnector Handling Precautions 1. Allowable Creepage Dimensions at Time of Mating The effective coupling length of this product is 1.1 mm for the signal portion and 1 mm for the ground portion. The creepage of the header and receptacle at the time of mating should be within 0.5 mm of the completely coupled condition. 2. Retension of Boards Avoid the support of boards by connectors alone and adopt a locking measure that does not rely on the connectors. 3. Solder Repair Flux may rise as far as the contact portion of the connector depending on the flux coating and other factors at the time of repair. This will cause poor contact reliability; therefore, before use, the aforementioned washing conditions should be taken into consideration prior to connector washing. 4. Miscellaneous

  • Note that excessive twisting while inserting or withdrawing connectors will cause damage.
  • The shade of the molded items may vary somewhat depending on the manufacturing lot; however, this does not affect performance. Water Type Washing When using water type cleaning agents (e.g., terpene, and alkali saponifiers), select the cleaning agent based on the documentation issued by the various manufacturers of cleaning agents which describes the effects on metals and resins. Be careful that parts are not left with moisture remaining on them. Organic Solvent Washing Washing Precautions Residual flux or cleaning agent on the contacts when washing with organic solvents or water type cleaners can give rise to the deterioration of electrical performance. In this regard it is important to check whether a thorough washing has been performed. Solvent Room temperature washingHeated washing IPA (Isopropyl alcohol) HCFC (Hydrochlorofluorocarbon) Ye s Ye s Ye s Ye s Applicable Conditions Reflow method : IR reflow Solder : Cream type 63Sn/37Pb (Flux component of 9wt%) Test substrate : Glass epoxy. 85 x 110 x 1.6mm Metal mask thickness: 0.15mm This temperature profile is a recommendation. Conditions may change somewhat depending on the type of cream solder and the amount. This temperature profile is a reference for the setting conditions described below. It will differ depending on conditions and so mounting should follow verification.