FT08 ETC1 | Alldatasheet
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Technical content
8 Amp
FT08...D SURFACE MOUNT TRIAC This series of TRIACs uses a high performance PNPN technology . These devices are intended for AC control applications using surface mount technology . The high commutation performances combined with high sensitivity , make them perfect in all applications like solid state relays, home appliances, power tools, small motor drives... Jun - 02 Absolute Maximum Ratings, according to IEC publication No. 134 RMS On-state Current Non-repetitive On-State Current Non-repetitive On-State Current Fusing Current Peak Gate Current Peak Gate Dissipation Gate Dissipation Critical rate of rise of on-state current Operating Temperature Range Storage Temperature Range Lead Temperature for soldering IT(RMS) PARAMETER CONDITIONS Min. Max. Unit DPAK (Plastic) Gate Trigger Current < 5 mA to < 50 mA Off-State V oltage
200 V ÷ 600 V
PG(AV) Tj Tstg TL All Conduction Angle, TC = 110 ºC Half Cycle, 60 Hz Half Cycle, 50 Hz t p = 10 ms, Half Cycle 20 µs max. 20 µs max. 20 ms max. 10s max. -40 -40 A A A A A W W A/µs ºC ºC ºC +125 +150 260 di/dt MT1 MT2 G MT2 Repetitive Peak Off State Voltage PARAMETER VOLTAGE UnitSYMBOL VDRM VRRM B 200 V M 600 D 400 Tr ≤ 100 ns, F = 120 Hz Tj = 125 ºC IG = 2 x IGT
FT08...D SURFACE MOUNT TRIAC Jun - 02 PART NUMBER INFORMATION FAGOR SCR CURRENT CASE VOLTAGE SENSITIVITY F T 08 08 B D 00 FORMING TR PACKAGING
Electrical Characteristics
Critical Rate of Voltage Rise PARAMETER CONDITIONS SENSITIVITY UnitSYMBOL IGT (1) IDRM VD = 12 VDC , RL = 30Ω mA 0.85 1.55 1.3 0.2 1.6 mA mA µA V mΩ V V V mA mA V/µs A/ms MAX MAX MAX MAX MAX MAX MAX MIN MAX MAX MAX MIN MIN MIN MIN /IRRM VTM (2) VGT VGD IH (2) IL dv / dt (2) Rth(j-a) Thermal Resistance Junction-Ambient Tj = 25 ºC VR = VRRM , IT = 11 Amp, tp = 380 µs, Tj = 25 ºC VD = 12 VDC , RL = 30Ω , Tj = 25 ºC IT = 100 mA , Gate open, Tj = 25 ºC IG = 1.2 IGT, Tj = 25 ºC VD = 0.67 x VDRM , Gate open Tj = 125 ºC Quadrant Q1÷Q3 Q1÷Q3 Q1÷Q3 Q1,Q3 VD = VDRM , RL = 3.3KΩ , Tj = 125 ºC ºC/W ºC/W (1) Minimum IGT is guaranted at 5% of IGT max. (2) For either polarity of electrode MT2 voltage with reference to electrode MT1. Rth(j-c) Thermal Resistance Junction-Case (dI/dt)c (2) Critical Rate of Current Rise (dv/dt)c= 0.1 V/µs Tj = 125 ºC (dv/dt)c= 10 V/µs Tj = 125 ºC without snubber Tj = 125 ºC Vto (2) Rd(2) Tj = 125 ºC Tj = 125 ºC 60Tj = 125 ºC Tj = 25 ºC 3.5 1.8 100 5.4 2.8 200 4.5 250 4.5 4.5 400 4.5 4.5
Fig. 1a: Maximum power dissipation versus RMS on-state current (FT0807.D, FT0808.D). 0 25 50 75 100 125 P (W) Fig. 2: Correlation between maximum power dissipation and maximum allowable temperatures (Tamb and Tcase) for different thermal resistances heatsink + contact. T case (ºC) -110 -115 -120 -125 Fig. 3: RMS on-state current versus ambient temperature Fig. 5: Relative variation of gate trigger current and holding current versus junction temperature (typical values). IGT, IH (Tj) / IGT, IH (Tj = 25 ºC) FT08...D SURFACE MOUNT TRIAC I T(RMS) (A) 0 2 4 6 8 P (W) Tamb (ºC) Tj (ºC) Tamb (ºC) IT(RMS)(A) 1 3 5 7 α = 90 º α = 60 º α = 30 º 0 25 50 75 100 125 -40 0 2.5 2.0 1.5 1.0 0.5 0.0 40 80 120-20 20 60 100 α 180 º α α = 180 º α = 120 º Fig. 1b: Maximum power dissipation versus RMS on-state current (FT0811.D, FT0814.D). 0 2 4 6 8 P (W) IT(RMS)(A) 1 3 5 7 α = 90 º α = 60 º α 180 º α α = 120 º α = 180 º α = 30 º 1.0 K = [Zth(j-c) / Rth (j-c)] Fig. 4: Relative variation of thermal impedance junction to case versus pulse duration. 1E-3 1E-2 1E-1 1E+0 tp (s) 0.5 0.2 0.1 Rth=15 ºC/W Rth=10 ºC/W Rth=5 ºC/W Rth=0 ºC/W α = 180 º Rth(j-a) = Rth(j-c) α = 180 º Rth(j-a) = 55 ºC/W S(Cu) = 1.75 cm2 140 IH IGT
FT08...D SURFACE MOUNT TRIAC 500 1 10 ITSM(A). I2t (A2s) Fig. 7: Non repetitive surge peak on-state current for a sinusoidal pulse with width: tp < 10 ms, and corresponding value of I 2t. tp(ms) 2 5 Fig. 8: On-state characteristics (maximum values). 1 10 100 1000 Fig. 6: Non repetitive surge peak on-state current versus number of cycles. I TSM (A) Number of cycles Fig. 9: Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board FR4, copper thickness: 35 µm). Tj initial = 25 ºC F = 50 Hz 100 I2 t ITSM Tj initial = 25 ºC Jun - 02 ITM(A) 4.0 100.0 VTM(V) 4.5 10.0 1.0 0.1 5.0 Tj = Tj max. Tj = 25 ºC Rth(j-a) (ºC/W) S(Cu) (cm2) 100 2 4 6 8 10 12 14 16 18 20 Tj max Vto = 0.8 V Rd = 60 mΩ
FT08...D SURFACE MOUNT TRIAC PACKAGE MECHANICAL DATA DPAK TO 252-AA A b c D E e H L REF . DIMENSIONS Milimeters Min. Nominal Max. 2.18 0.64 0.46 0.46 5.97 5.21 6.35 5.20 9.40 1.40 2.55 0.46 0.89 0.64 2.3±0.18 0.12 0.75±0.1 0.8±0.013 6.1±0.1 6.58±0.14 5.36±0.1 2.28BSC 9.90±0.15 2.6±0.05 0.5±0.013 1.20±0.05 0.83±0.1 2.39 0.127 0.89 0.61 0.56 6.22 5.52 6.73 5.46 10.41 1.78 2.74 0.58 1.27 1.02 Marking: type number Weight: 0.2 g 8º±2º E D b e 4.57 Typ. ø1x0.15 H 1.6 A 8º±2º8º±2º 8º±2º 8º±2º L 1.067±0.013 Jun - 02 FOOT PRINT 6.7 6.7 1.6 2.3 2.3 1.6